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NVBG020N090SC1

Onsemi

NVBG020N090SC1 by Onsemi

NVBG020N090SC1 by Onsemi is a N-CHANNEL FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 448A IDM, 264mJ EAS, and 0.028 ohm RDS(on). Operating in ENHANCEMENT MODE, it has a max temp of 175°C and AEC-Q101 certification.

Median Price

$35.250

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 481 parts In-Stock

1+ parts

$23.800

100+ parts

$16.850

1k+ parts

-

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481

$23.800

$16.850

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DigiKey

USA . 293 parts In-Stock

1+ parts

$35.250

100+ parts

-

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$23.119

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293

$35.250

-

$23.119

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Mouser Electronics

USA . 245 parts In-Stock

1+ parts

$35.250

100+ parts

$28.220

1k+ parts

$26.430

10k+ parts

-

245

$35.250

$28.220

$26.430

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Newark

USA . 441 parts In-Stock

1+ parts

$36.310

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441

$36.310

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Chip1Stop

Japan . 676 parts In-Stock

1+ parts

$122.000

100+ parts

$60.200

1k+ parts

$43.500

10k+ parts

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676

$122.000

$60.200

$43.500

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Element14

Singapore . 590 parts In-Stock

1+ parts

$4,735.620

100+ parts

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590

$4,735.620

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EBV Elektronik

Germany . 1,600 parts In-Stock

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1,600

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Rochester

USA . 511 parts In-Stock

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$23.120

1k+ parts

$20.690

10k+ parts

$19.470

511

-

$23.120

$20.690

$19.470

Verical

USA . 331 parts In-Stock

1+ parts

-

100+ parts

$28.900

1k+ parts

$25.863

10k+ parts

$24.337

331

-

$28.900

$25.863

$24.337

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,830 parts In-Stock

1+ parts

$24.406

100+ parts

-

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1,830

$24.406

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Nova Conductors

Japan . 16 parts In-Stock

1+ parts

$41.765

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16

$41.765

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Flip Electronics

USA . 5,600 parts In-Stock

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5,600

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NAC Semi

USA . 1,600 parts In-Stock

1+ parts

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100+ parts

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$39.230

10k+ parts

$36.220

1,600

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-

$39.230

$36.220

IBS Electronics

USA . 800 parts In-Stock

1+ parts

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$33.898

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800

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$33.898

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Vyrian

USA . 699 parts In-Stock

1+ parts

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699

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Bristol Electronics

USA . 60 parts In-Stock

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60

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Distributors (Availability)

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Advanced Electronics

New Zealand . 600 parts In-Stock

1+ parts

$1.060

100+ parts

$0.965

1k+ parts

$0.869

10k+ parts

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600

$1.060

$0.965

$0.869

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Aztec Data Supply Inc.

USA . 540 parts In-Stock

1+ parts

$1.680

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540

$1.680

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Semicontronic

India . 715 parts In-Stock

1+ parts

$19.200

100+ parts

$18.720

1k+ parts

$18.624

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715

$19.200

$18.720

$18.624

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Ampacity Inc.

Singapore . 335 parts In-Stock

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$19.200

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335

$19.200

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Corohmni

South Africa . 162 parts In-Stock

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$22.590

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162

$22.590

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Corphita

USA . 2,016 parts In-Stock

1+ parts

$23.121

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$23.121

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Continental Prestige Electronics

USA . 651 parts In-Stock

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$38.860

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$38.860

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Aranea Global

USA . 500 parts In-Stock

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$40.930

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$39.292

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500

$40.930

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$39.292

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Microchip USA

USA . 9,646 parts In-Stock

1+ parts

$90.283

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9,646

$90.283

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TANS Electronics

Latvia . 6,008 parts In-Stock

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Problanco Electronics

Mexico . 5,648 parts In-Stock

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SupplyDigital Components

Austria . 4,592 parts In-Stock

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Argo Parts USA

USA . 3,769 parts In-Stock

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Kulean Microsystems

USA . 3,333 parts In-Stock

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Perfect Parts

USA . 1,824 parts In-Stock

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1,824

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Eastek

USA . 1,600 parts In-Stock

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$76.070

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1,600

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$76.070

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Authorized Procurement Solutions

USA . 1,000 parts In-Stock

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1,000

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UHIMA Technologies

Türkiye . 888 parts In-Stock

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888

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Overview

Discover the NVBG020N090SC1 by Onsemi, a high-quality Power FET with countless advantages. Manufactured by Onsemi, a trusted industry leader, this N-CHANNEL FET is perfect for switching applications with its single configuration and built-in diode. With a minimum DS breakdown voltage of 900V and maximum drain current of 112A, this FET offers exceptional performance and reliability. Whether you're in automotive, industrial, or consumer electronics, this FET provides value, efficiency, and durability that will exceed your expectations. Upgrade your designs with the NVBG020N090SC1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material makes the package durable and resistant to environmental factors, ensuring reliable performance and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher current-carrying capabilities, making them efficient for power switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for faster switching speeds and provides protection against reverse voltage transients, enhancing the reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of power in electronic circuits with minimal power loss.

Surface Mount: YES

The surface mount capability allows for easy integration onto PCBs, saving space and enabling high-density circuit design.

Maximum Power Dissipation (Abs): 477 W

With a high power dissipation capability, this FET can handle large power loads without overheating, ensuring stable operation under high stress conditions.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this FET to be used in a wide variety of environments and applications without the risk of thermal damage.

Maximum Drain-Source On Resistance: 0.028 ohm

The low on-resistance of this FET results in minimal power loss and heat generation, making it suitable for high-efficiency power switching systems.

Technical Specifications

Power Field Effect Transistors (FET) NVBG020N090SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

112 A

Maximum Drain Current (ID):

112 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

448 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NVBG020N090SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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