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NVBG160N120SC1

Onsemi

NVBG160N120SC1 by Onsemi

The Onsemi NVBG160N120SC1 is a N-CHANNEL Power FET with 1200V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 78A and EAS of 120mJ, operating in ENHANCEMENT MODE. With a compact SMALL OUTLINE package and SILICON CARBIDE material, it offers 0.224 ohm RDS(ON) for efficient performance.

Median Price

$10.050

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 80 parts In-Stock

1+ parts

$9.138

100+ parts

$6.319

1k+ parts

$5.720

10k+ parts

-

80

$9.138

$6.319

$5.720

-

Newark

USA . 710 parts In-Stock

1+ parts

$10.050

100+ parts

$7.510

1k+ parts

$7.000

10k+ parts

-

710

$10.050

$7.510

$7.000

-

Farnell

UK . 800 parts In-Stock

1+ parts

$10.530

100+ parts

$7.360

1k+ parts

$6.270

10k+ parts

-

800

$10.530

$7.360

$6.270

-

Mouser Electronics

USA . 31 parts In-Stock

1+ parts

$12.140

100+ parts

$7.290

1k+ parts

$6.800

10k+ parts

-

31

$12.140

$7.290

$6.800

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DigiKey

USA . 1,150 parts In-Stock

1+ parts

$13.020

100+ parts

$7.281

1k+ parts

$5.948

10k+ parts

-

1,150

$13.020

$7.281

$5.948

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Element14

Singapore . 800 parts In-Stock

1+ parts

$15.740

100+ parts

-

1k+ parts

-

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800

$15.740

-

-

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Chip1Stop

Japan . 800 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.640

10k+ parts

-

800

-

-

$6.640

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Verical

USA . 569 parts In-Stock

1+ parts

-

100+ parts

$7.438

1k+ parts

$6.650

10k+ parts

$6.263

569

-

$7.438

$6.650

$6.263

Rochester

USA . 569 parts In-Stock

1+ parts

-

100+ parts

$5.950

1k+ parts

$5.320

10k+ parts

$5.010

569

-

$5.950

$5.320

$5.010

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 287 parts In-Stock

1+ parts

$6.593

100+ parts

-

1k+ parts

-

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287

$6.593

-

-

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Nova Conductors

Japan . 150 parts In-Stock

1+ parts

$8.640

100+ parts

-

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-

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150

$8.640

-

-

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Chip Stock

USA . 16,833 parts In-Stock

1+ parts

-

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16,833

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Flip Electronics

USA . 10,400 parts In-Stock

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-

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10,400

-

-

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NAC Semi

USA . 800 parts In-Stock

1+ parts

-

100+ parts

-

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$14.360

10k+ parts

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800

-

-

$14.360

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Vyrian

USA . 588 parts In-Stock

1+ parts

-

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-

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588

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Right Parts Inc.

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 437 parts In-Stock

1+ parts

$2.310

100+ parts

-

1k+ parts

-

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437

$2.310

-

-

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Corohmni

South Africa . 87 parts In-Stock

1+ parts

$2.712

100+ parts

-

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87

$2.712

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-

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Corphita

USA . 922 parts In-Stock

1+ parts

$6.246

100+ parts

-

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-

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922

$6.246

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Netroflash

USA . 500 parts In-Stock

1+ parts

$8.640

100+ parts

$8.467

1k+ parts

-

10k+ parts

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500

$8.640

$8.467

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-

Continental Prestige Electronics

USA . 800 parts In-Stock

1+ parts

$10.570

100+ parts

$8.160

1k+ parts

-

10k+ parts

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800

$10.570

$8.160

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Microchip USA

USA . 5,759 parts In-Stock

1+ parts

$26.374

100+ parts

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5,759

$26.374

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Perfect Parts

USA . 11,623 parts In-Stock

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11,623

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TANS Electronics

Latvia . 7,132 parts In-Stock

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Lixinc

USA . 6,567 parts In-Stock

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6,567

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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5,000

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Argo Parts USA

USA . 3,715 parts In-Stock

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3,715

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Eastek

USA . 2,438 parts In-Stock

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2,438

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Kulean Microsystems

USA . 2,066 parts In-Stock

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2,066

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SupplyDigital Components

Austria . 1,617 parts In-Stock

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1,617

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Problanco Electronics

Mexico . 1,034 parts In-Stock

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1,034

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UHIMA Technologies

Türkiye . 819 parts In-Stock

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819

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Futuretech Components

Singapore . 247 parts In-Stock

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247

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Overview

Discover the NVBG160N120SC1 by Onsemi, a cutting-edge Power FET that delivers unrivaled performance and reliability. Manufactured by industry leader Onsemi, this N-Channel transistor is designed for switching applications with a single built-in diode configuration. With a high DS Breakdown Voltage of 1200V and a maximum Drain Current of 19.5A, this transistor offers exceptional power dissipation of 136W in a compact package. Ideal for a wide range of applications, the NVBG160N120SC1 provides customers with superior quality, efficiency, and value. Experience the benefits of advanced semiconductor technology with Onsemi's NVBG160N120SC1 today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation properties, making the product reliable for high voltage applications.

Transistor Application: SWITCHING

Designed for switching applications, this FET can efficiently control the flow of current in electronic circuits, making it suitable for various power management systems.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage of 1200V, this FET can handle high voltage levels safely, making it ideal for industrial or high-power applications.

Maximum Drain Current (ID): 19.5 A

Capable of handling a maximum drain current of 19.5A, this FET is suitable for applications requiring high current output.

Maximum Power Dissipation (Abs): 136 W

The high power dissipation capability of 136W ensures the FET can handle large amounts of power without overheating, making it reliable for heavy-duty applications.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can withstand high temperatures, making it suitable for harsh environments or applications that generate heat.

Technical Specifications

Power Field Effect Transistors (FET) NVBG160N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

19.5 A

Maximum Drain Current (ID):

19.5 A

Maximum Drain-Source On Resistance:

.224 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

78 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

42 ns

Maximum Turn On Time (ton):

40 ns

Trade Compliance

NVBG160N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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