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NVBG040N120SC1

Onsemi

NVBG040N120SC1 by Onsemi

NVBG040N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a max IDM of 240A and EAS of 578mJ, this MOSFET operates in ENHANCEMENT MODE with 0.056ohm RDS(ON). Suitable for high-power requirements, it has a max power dissipation of 357W and can withstand temperatures from -55 to 175°C.

Median Price

$16.800

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 66 parts In-Stock

1+ parts

$16.800

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66

$16.800

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Mouser Electronics

USA . 41 parts In-Stock

1+ parts

$26.600

100+ parts

$19.710

1k+ parts

$17.880

10k+ parts

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41

$26.600

$19.710

$17.880

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DigiKey

USA . 2,646 parts In-Stock

1+ parts

$27.430

100+ parts

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$16.875

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2,646

$27.430

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$16.875

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Arrow

USA . 8,800 parts In-Stock

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$16.070

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8,800

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$16.070

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Verical

USA . 8,800 parts In-Stock

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$16.070

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8,800

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$16.070

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Distributors (In-Stock)

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Digiode

USA . 2,268 parts In-Stock

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$15.960

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2,268

$15.960

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Vyrian

USA . 1,264 parts In-Stock

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$16.800

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1,264

$16.800

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Flip Electronics

USA . 20,000 parts In-Stock

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20,000

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Chip Stock

USA . 2,854 parts In-Stock

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2,854

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Nova Conductors

Japan . 25 parts In-Stock

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25

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Distributors (Availability)

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Corphita

USA . 974 parts In-Stock

1+ parts

$15.120

100+ parts

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974

$15.120

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Corohmni

South Africa . 396 parts In-Stock

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$16.800

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396

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Ampacity Inc.

Singapore . 610 parts In-Stock

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$31.080

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610

$31.080

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Microchip USA

USA . 9,361 parts In-Stock

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$54.495

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9,361

$54.495

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Robosynatics

Brazil . 18,615 parts In-Stock

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18,615

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Lucentia Tech

USA . 18,615 parts In-Stock

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$0.586

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$0.574

10k+ parts

$0.574

18,615

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$0.586

$0.574

$0.574

SupplyDigital Components

Austria . 5,305 parts In-Stock

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Problanco Electronics

Mexico . 5,215 parts In-Stock

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Argo Parts USA

USA . 2,707 parts In-Stock

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Kulean Microsystems

USA . 2,576 parts In-Stock

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Continental Prestige Electronics

USA . 2,345 parts In-Stock

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TANS Electronics

Latvia . 1,696 parts In-Stock

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Authorized Procurement Solutions

USA . 666 parts In-Stock

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666

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UHIMA Technologies

Türkiye . 156 parts In-Stock

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156

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Aranea Global

USA . 100 parts In-Stock

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100

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Overview

Discover the unbeatable performance and reliability of the NVBG040N120SC1 Power FET by Onsemi. Crafted with precision and expertise, this N-CHANNEL transistor is ideal for a wide range of switching applications. With its high breakdown voltage and efficient design, this single-channel FET offers unparalleled power dissipation capabilities, ensuring optimal performance even in the most demanding conditions. Trust in Onsemi's cutting-edge technology and elevate your projects to new heights with the NVBG040N120SC1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy packaging provides durability and protection to the FET, ensuring reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a suitable choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and improves overall efficiency in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high performance and reliability in controlling power flow.

Surface Mount: YES

Surface mount capability allows for easy and convenient installation on circuit boards, saving space and improving overall manufacturing efficiency.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage levels, making it suitable for a wide range of power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high efficiency and faster response times, providing better performance in switching operations.

Maximum Pulsed Drain Current (IDM): 240 A

High pulsed drain current capability allows for handling large current spikes, making this FET suitable for high-power applications.

Avalanche Energy Rating (EAS): 578 mJ

The high avalanche energy rating indicates that this FET can withstand high-energy transients, ensuring reliability in challenging environments.

Maximum Power Dissipation (Abs): 357 W

With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring long-term reliability.

Maximum Operating Temperature: 175 °C

The FET can operate at high temperatures without performance degradation, making it suitable for demanding industrial applications.

Maximum Drain-Source On Resistance: 0.056 ohm

Low on-resistance results in minimal power loss and heat generation in the FET, improving overall efficiency in power control applications.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability and corrosion resistance, ensuring reliable connections in various operating environments.

Technical Specifications

Power Field Effect Transistors (FET) NVBG040N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

578 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

66 ns

Maximum Turn On Time (ton):

66 ns

Trade Compliance

NVBG040N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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