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NVBG020N120SC1

Onsemi

NVBG020N120SC1 by Onsemi

NVBG020N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS breakdown voltage, 392A IDM, and 264mJ EAS. Ideal for switching applications, it operates in enhancement mode with -55 to 175 °C temperature range.

Median Price

$61.513

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,064 parts In-Stock

1+ parts

$48.830

100+ parts

-

1k+ parts

$34.634

10k+ parts

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1,064

$48.830

-

$34.634

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Mouser Electronics

USA . 234 parts In-Stock

1+ parts

$48.830

100+ parts

$40.150

1k+ parts

$39.590

10k+ parts

-

234

$48.830

$40.150

$39.590

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Newark

USA . 666 parts In-Stock

1+ parts

$66.820

100+ parts

$57.430

1k+ parts

$57.420

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666

$66.820

$57.430

$57.420

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Element14

Singapore . 742 parts In-Stock

1+ parts

$78.942

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742

$78.942

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RS (Exports)

UK . 800 parts In-Stock

1+ parts

$82.572

100+ parts

$76.217

1k+ parts

$74.312

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800

$82.572

$76.217

$74.312

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Chip1Stop

Japan . 671 parts In-Stock

1+ parts

$181.000

100+ parts

$89.500

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$64.800

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671

$181.000

$89.500

$64.800

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Rochester

USA . 3,917 parts In-Stock

1+ parts

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$34.640

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$30.990

10k+ parts

$29.170

3,917

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$34.640

$30.990

$29.170

Verical

USA . 3,117 parts In-Stock

1+ parts

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$43.300

1k+ parts

$38.737

10k+ parts

$36.462

3,117

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$43.300

$38.737

$36.462

EBV Elektronik

Germany . 1,600 parts In-Stock

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1,600

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Farnell

UK . 742 parts In-Stock

1+ parts

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100+ parts

$61.513

1k+ parts

$58.764

10k+ parts

$56.412

742

-

$61.513

$58.764

$56.412

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,287 parts In-Stock

1+ parts

$36.556

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1,287

$36.556

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Nova Conductors

Japan . 100 parts In-Stock

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$48.730

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100

$48.730

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Flip Electronics

USA . 6,400 parts In-Stock

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6,400

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NAC Semi

USA . 1,600 parts In-Stock

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$58.780

10k+ parts

$54.260

1,600

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$58.780

$54.260

Vyrian

USA . 1,127 parts In-Stock

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IBS Electronics

USA . 800 parts In-Stock

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$50.785

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800

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$50.785

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 881 parts In-Stock

1+ parts

$1.420

100+ parts

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881

$1.420

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Advanced Electronics

New Zealand . 75 parts In-Stock

1+ parts

$1.680

100+ parts

$1.529

1k+ parts

$1.378

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75

$1.680

$1.529

$1.378

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Semicontronic

India . 1,009 parts In-Stock

1+ parts

$30.190

100+ parts

$29.435

1k+ parts

$29.284

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1,009

$30.190

$29.435

$29.284

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Corphita

USA . 659 parts In-Stock

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$34.632

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659

$34.632

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Corohmni

South Africa . 151 parts In-Stock

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$38.480

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$38.480

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Aranea Global

USA . 2,000 parts In-Stock

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$47.755

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$45.845

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$47.755

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$45.845

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Continental Prestige Electronics

USA . 761 parts In-Stock

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$49.740

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761

$49.740

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Ampacity Inc.

Singapore . 741 parts In-Stock

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$65.720

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$65.720

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Microchip USA

USA . 9,303 parts In-Stock

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$106.211

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TANS Electronics

Latvia . 6,905 parts In-Stock

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Kulean Microsystems

USA . 5,588 parts In-Stock

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SupplyDigital Components

Austria . 5,359 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,666 parts In-Stock

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Argo Parts USA

USA . 1,905 parts In-Stock

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Perfect Parts

USA . 1,530 parts In-Stock

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UHIMA Technologies

Türkiye . 334 parts In-Stock

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334

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Overview

Unleash the power of the NVBG020N120SC1 by Onsemi, a top-of-the-line Power Field Effect Transistor that offers unparalleled quality and reliability. Manufactured by industry leader Onsemi, this N-CHANNEL FET with a built-in diode is perfect for switching applications, ensuring seamless performance and efficiency. With a high breakdown voltage of 1200V and impressive current ratings, this transistor guarantees optimal functionality in any operating condition. Experience the difference with Onsemi's cutting-edge technology, providing customers with the value and advantages they deserve. Elevate your projects with the NVBG020N120SC1 and witness the superior performance it delivers.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and protection for the internal components of the FET.

Polarity or Channel Type: N-CHANNEL

N-channel FETs have better performance characteristics compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protection against reverse currents, enhancing the overall functionality of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast and efficient switching operations.

Surface Mount: YES

Being surface mountable, this FET is easy to install on PCBs, making it suitable for compact and high-density designs.

Minimum DS Breakdown Voltage: 1200 V

The high breakdown voltage capability of 1200 V ensures reliable performance under high voltage conditions.

Maximum Pulsed Drain Current (IDM): 392 A

With a high pulsed drain current rating of 392 A, this FET can handle large current spikes without compromising its performance.

Maximum Power Dissipation (Abs): 468 W

The high power dissipation rating of 468 W allows this FET to operate efficiently even under high power conditions.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C ensures reliable performance in a wide range of temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) NVBG020N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

98 A

Maximum Drain Current (ID):

98 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

24 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

392 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

85 ns

Maximum Turn On Time (ton):

67 ns

Trade Compliance

NVBG020N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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