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NTMFS4921NT3G

Onsemi

NTMFS4921NT3G by Onsemi

NTMFS4921NT3G by Onsemi is a N-CHANNEL FET with 30V DS Breakdown Voltage, 0.0088A ID, and 0.0108 ohm RDS. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 150 °C. Its RECTANGULAR package with 5 terminals is suitable for surface mount assembly.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,211 parts In-Stock

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Digiode

USA . 2,073 parts In-Stock

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Modulus Dynamics

Lithuania . 100 parts In-Stock

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$0.491

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$0.491

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$0.491

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100

$0.491

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AZTECH Wire

Italy . 464 parts In-Stock

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$20.320

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Component Stockers USA

USA . 344 parts In-Stock

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$99.990

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Kepictronics

USA . 51,178 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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SupplyDigital Components

Austria . 4,896 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,884 parts In-Stock

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TANS Electronics

Latvia . 3,561 parts In-Stock

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Corphita

USA . 2,234 parts In-Stock

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Problanco Electronics

Mexico . 1,185 parts In-Stock

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Kulean Microsystems

USA . 711 parts In-Stock

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UHIMA Technologies

Türkiye . 686 parts In-Stock

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Corohmni

South Africa . 289 parts In-Stock

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Overview

Unlock the power of reliable and efficient switching with the NTMFS4921NT3G by Onsemi! Crafted with precision and quality, this N-CHANNEL Small Signal Field Effect Transistor offers a seamless solution for your electronic applications. With a single configuration and built-in diode, this transistor provides enhanced performance in a compact package. Whether you're looking to optimize your circuit design or streamline your production process, this product ensures maximum efficiency and value. Trust Onsemi to deliver cutting-edge technology that meets your needs with the NTMFS4921NT3G.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is lightweight and durable, making the transistor easy to handle and long-lasting.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher mobility and conductivity, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for improved performance and protection in switching applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are easy to control and require less power for operation, increasing efficiency.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliability and stability in various environments.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4921NT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

.0088 A

Maximum Drain-Source On Resistance:

.0108 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4921NT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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