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BSS131E6327

Infineon Technologies

BSS131E6327 by Infineon Technologies

Infineon BSS131E6327 is a N-CHANNEL FET with 240V DS breakdown voltage, 0.11A drain current, and 14 ohm on-resistance. Ideal for small signal applications, it operates in enhancement mode with a max power dissipation of 0.36W. Its GULL WING terminals and compact design make it suitable for surface mount configurations.

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1k+

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USA . 239,720 parts In-Stock

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Digital Electronic Gebert Verwaltungs UG

Germany . 9,877 parts In-Stock

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ComSIT USA

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ACDS - Activité Composants Distribution Service

France . 1,809 parts In-Stock

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ComSIT Distribution GmbH

Germany . 802 parts In-Stock

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Nova Conductors

Japan . 600 parts In-Stock

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600

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VNN

France . 406 parts In-Stock

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406

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Ashlea Components Ltd

UK . 388 parts In-Stock

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Vyrian

USA . 360 parts In-Stock

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Digiode

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Prism Electronics

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Modulus Dynamics

Lithuania . 17,794 parts In-Stock

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$0.503

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$0.483

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$0.463

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17,794

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Corohmni

South Africa . 1,362 parts In-Stock

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$1.315

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Aztec Data Supply Inc.

USA . 4,874 parts In-Stock

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$1.690

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Advanced Electronics

New Zealand . 94 parts In-Stock

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$1.923

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$1.827

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$1.827

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94

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AZTECH Wire

Italy . 360 parts In-Stock

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$16.154

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Andel Nordic

Denmark . 5,833 parts In-Stock

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$24.170

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$16.916

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Ampacity Inc.

Singapore . 1,348 parts In-Stock

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$47.050

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Semicontronic

India . 1,646 parts In-Stock

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$51.050

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$49.774

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$49.518

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Perfect Parts

USA . 4,079 parts In-Stock

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Continental Prestige Electronics

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Glotronic Ltd.

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Cyclops Electronics Ltd (Excess)

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Corphita

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Bastille Electronics

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Overview

Discover the BSS131E6327 by Infineon Technologies, a high-quality N-CHANNEL Small Signal Field Effect Transistor with a built-in diode. This versatile component offers reliable performance in a wide range of applications, from consumer electronics to industrial equipment. With its compact design and enhanced efficiency, this FET provides value and benefits to customers looking for superior functionality and durability. Trust in Infineon's expertise in semiconductor technology to deliver the reliability and innovation you need for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes this transistor lightweight and cost-effective.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance characteristics compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and reduces components required for operation.

Surface Mount: YES

Surface mount compatibility allows for easy integration onto PCBs and saves valuable board space.

Minimum DS Breakdown Voltage: 240 V

The high breakdown voltage ensures reliable operation in various applications with high voltage requirements.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient packing and utilization of space on the PCB.

Terminal Form: GULL WING

The gull wing terminal form provides secure soldering connections for a reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation offers precise control over the transistor's output and improves overall performance.

Maximum Drain Current (Abs) (ID): 0.11 A

The high maximum drain current allows for high power handling capabilities in demanding applications.

No. of Terminals: 3

The three terminals provide flexibility in circuit configurations and compatibility with various circuit designs.

Maximum Power Dissipation (Abs): 0.36 W

The high power dissipation capability ensures the transistor can handle heat generated during operation effectively.

Package Style (Meter): SMALL OUTLINE

The small outline package style makes this transistor suitable for applications with limited space constraints.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The MOSFET technology offers high switching speeds and low power consumption for efficient operation.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature ensures the transistor can withstand harsh environmental conditions.

Transistor Element Material: SILICON

Silicon material provides high performance and reliability in various operating conditions.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature allows for operation in extreme cold environments.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures a durable connection.

Maximum Drain Current (ID): 0.11 A

The high maximum drain current capability allows for handling high current loads without overheating.

Maximum Drain-Source On Resistance: 14 ohm

The low drain-source on resistance ensures minimal power loss and high efficiency in operation.

Terminal Position: DUAL

The dual terminal position allows for easy integration into various circuit layouts for versatile applications.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance allows for reliable soldering during assembly processes.

Maximum Feedback Capacitance (Crss): 4.2 pF

The low feedback capacitance minimizes signal distortion and improves overall performance in high-frequency applications.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS131E6327 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Infineon Technologies

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

240 V

Maximum Drain Current (Abs) (ID):

.11 A

Maximum Drain Current (ID):

.11 A

Maximum Drain-Source On Resistance:

14 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

4.2 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Element Material:

SILICON

Trade Compliance

BSS131E6327 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Infineon Technologies

Infineon Technologies AG is a leading global semiconductor manufacturer and provider of comprehensive solutions for automotive, industrial, and consumer applications. Founded in 1999, the company has grown to become one of the largest semiconductor manufacturers in Europe. Infineon is headquartered in Neubiberg, Germany with operations across countries in Europe and Asia Pacific. Infineon provides microelectronics products that address many of today's societal challenges affecting energy efficiency, mobility, security and connectivity. Over the past two decades Infineon has become a major player in the semiconductor industry with an impressive portfolio of innovative technologies. As one of only four companies that produce DRAM chips for automobiles, Infineon produces cutting-edge processors for use in advanced driver assistance systems (ADAS). Likewise, they specialize in providing advanced embedded secure microcontrollers that are essential for connected devices. Furthermore, they offer integrated circuit solutions for industrial power control such as motor controllers and embedded gate drivers.

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Management team

CEO

Jochen Hanebeck

Chief Financial Officer

Sven Schneider

Chief Marketing Officer

Andreas Urschitz

Manufacturer fab locations 19

Fab name Location Fab Initiation Wafer Capacity

Villach 300mm

Fabrication

Fab Initiation

2011

Austria

Villach

Wafer Capacity

11,000

2011

11,000

Kulim 2

Fabrication

Fab Initiation

2016

Malaysia

Kulim

Wafer Capacity

79,500

2016

79,500

Dresden - Module 3

Fabrication

Fab Initiation

1999

Germany

Dresden

Wafer Capacity

58,000

1999

58,000

Villach Building

Fabrication

Fab Initiation

2016

Austria

Villach

Wafer Capacity

2,000

2016

2,000

Regensburg

Fabrication

Fab Initiation

1986

Germany

Regensburg

Wafer Capacity

60,000

1986

60,000

Dresden 200 - Module 1

Fabrication

Fab Initiation

1995

Germany

Dresden

Wafer Capacity

28,000

1995

28,000

Dresden 200 - Module 2

Fabrication

Fab Initiation

1996

Germany

Dresden

Wafer Capacity

28,000

1996

28,000

Building 38

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Building 47

Fabrication

Fab Initiation

2005

Germany

Dresden

Wafer Capacity

500

2005

500

Kulim 1

Fabrication

Fab Initiation

2006

Malaysia

Kulim

Wafer Capacity

110,000

2006

110,000

Mesa Facility

Fabrication

Fab Initiation

1990

USA

Mesa

Wafer Capacity

3,000

1990

3,000

Villach 150mm

Fabrication

Fab Initiation

1981

Austria

Villach

Wafer Capacity

35,000

1981

35,000

Villach 200mm

Fabrication

Fab Initiation

1995

Austria

Villach

Wafer Capacity

68,000

1995

68,000

Temecula

Fabrication

Fab Initiation

1995

USA

Temecula

Wafer Capacity

30,000

1995

30,000

Villach 300mm

Fabrication

Fab Initiation

2021

Austria

Villach

Wafer Capacity

2021

Villach 150mm

Fabrication

Fab Initiation

2018

Austria

Villach

Wafer Capacity

5,000

2018

5,000

Kulim 3

Fabrication

Fab Initiation

2024

Malaysia

Kulim

Wafer Capacity

2024

Fab 25

Fabrication

Fab Initiation

1995

USA

Austin

Wafer Capacity

31,000

1995

31,000

Dresden - Module 4

Fabrication

Fab Initiation

2026

Germany

Dresden

Wafer Capacity

2026

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