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NTMFS4854NST1G

Onsemi

NTMFS4854NST1G by Onsemi

NTMFS4854NST1G by Onsemi is a N-CHANNEL FET with 25V DS Breakdown Voltage and 149A Drain Current. Ideal for SWITCHING applications, it features a built-in diode, current sensor, and operates in ENHANCEMENT MODE. With a max power dissipation of 86.2W and operating temperature up to 150 °C, this transistor is suitable for high-power electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 5,669 parts In-Stock

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Digiode

USA . 585 parts In-Stock

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AZTECH Wire

Italy . 632 parts In-Stock

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$11.670

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632

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TANS Electronics

Latvia . 8,194 parts In-Stock

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Problanco Electronics

Mexico . 4,743 parts In-Stock

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Kulean Microsystems

USA . 4,255 parts In-Stock

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UHIMA Technologies

Türkiye . 673 parts In-Stock

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SupplyDigital Components

Austria . 281 parts In-Stock

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Corohmni

South Africa . 222 parts In-Stock

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Corphita

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Overview

Unlock the power of cutting-edge technology with the NTMFS4854NST1G by Onsemi. Crafted with precision and expertise, this N-CHANNEL small signal FET is designed for SWITCHING applications, offering enhanced performance and reliability. With a built-in diode, current sensor, and Kelvin sensor, this transistor maximizes efficiency while ensuring seamless operation. From its robust construction to its high operating temperature, this product delivers unparalleled value and versatility. Experience the difference with Onsemi's innovative solutions and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection for the transistor, making it durable and reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel transistors generally have lower on-resistance and higher forward transconductance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE AND CURRENT AND KELVIN SENSOR

The built-in diode and sensors enhance functionality and performance of the transistor, allowing for better current monitoring and control.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor provides fast response times and efficient performance in switching circuits.

Surface Mount: YES

Surface mount capability allows for easy and efficient assembly onto circuit boards, saving space and improving overall circuit design.

Minimum DS Breakdown Voltage: 25 V

With a minimum breakdown voltage of 25V, this transistor can handle higher voltages, making it suitable for a wide range of applications.

Maximum Drain Current (Abs) (ID): 149 A

High maximum drain current rating of 149A allows for handling of high power loads, making it ideal for heavy duty applications.

Maximum Power Dissipation (Abs): 86.2 W

High power dissipation capability of 86.2W ensures efficient heat dissipation, preventing overheating and extending the lifespan of the transistor.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low input capacitance, leading to improved performance and efficiency.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high temperatures, making it suitable for demanding environments.

Transistor Element Material: SILICON

Silicon is a commonly used material for transistors due to its reliability and efficiency in electronic components.

Terminal Finish: TIN

Tin terminal finish provides good solderability and corrosion resistance, ensuring reliable connections and long-term stability.

Terminal Position: DUAL

Dual terminal position allows for versatile mounting options, making it easier to integrate into different circuit designs.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTMFS4854NST1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

25 V

Maximum Drain Current (Abs) (ID):

149 A

Maximum Drain Current (ID):

15.2 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-F8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTMFS4854NST1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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