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NTJD4152PT1

Onsemi

NTJD4152PT1 by Onsemi

NTJD4152PT1 by Onsemi is a P-CHANNEL FET with 2 elements, diode, and resistor. It operates in enhancement mode for switching applications. Features include 20V DS breakdown voltage, 0.88A max drain current, and 0.26 ohm on resistance. Ideal for small outline packages in high-temp environments up to 150 °C.

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Digiode

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AZTECH Wire

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Component Stockers USA

USA . 718 parts In-Stock

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Problanco Electronics

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SupplyDigital Components

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A-Z Elektronik GmbH

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Kulean Microsystems

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Overview

Discover the NTJD4152PT1 from Onsemi, a high-quality P-CHANNEL Small Signal FET that is perfect for switching applications. With a unique configuration of separate elements and built-in diode and resistor, this transistor offers enhanced performance and efficiency. Its compact design with a gull wing terminal form makes it ideal for surface mount applications. Trust in Onsemi's reputation for excellence in semiconductor technology to deliver a product that exceeds expectations. Experience the value and benefits of the NTJD4152PT1 for your electronic projects today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers durability and protection for the internal components of the transistor, ensuring a longer lifespan.

Polarity or Channel Type: P-CHANNEL

P-channel transistors are known for their low resistance and high speed, making them ideal for switching applications.

Configuration: SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE AND RESISTOR

The built-in diode and resistor simplify the circuit design, making it more efficient and compact.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in such scenarios.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto circuit boards.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this transistor can handle higher voltages without damage.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and solder onto circuit boards, saving space in the layout.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and easy handling during installation.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer high input impedance and low leakage current, improving overall efficiency.

No. of Elements: 2

With 2 elements in one package, this transistor offers flexibility in circuit design and space-saving benefits.

Maximum Drain Current (Abs) (ID): 0.88 A

With a maximum drain current of 0.88A, this transistor can handle higher current loads effectively.

No. of Terminals: 6

With 6 terminals, this transistor offers multiple connection options for enhanced circuit flexibility.

Maximum Power Dissipation (Abs): 0.35 W

The maximum power dissipation rating of 0.35W ensures the transistor can handle high-power applications without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high switching speeds and low power consumption, ideal for efficient electronics.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150 °C, this transistor can withstand high-temperature environments without performance degradation.

Transistor Element Material: SILICON

Silicon transistors offer high reliability and performance, making them a popular choice in various electronic applications.

Terminal Finish: TIN LEAD

The tin lead terminal finish provides good solderability and reliability in connecting the transistor to the circuit.

Maximum Drain-Source On Resistance: 0.26 ohm

With a low on-resistance of 0.26 ohms, this transistor minimizes power loss and heat generation during operation.

Terminal Position: DUAL

The dual terminal position allows for flexible mounting options and ease of connection in various circuit layouts.

Peak Reflow Temperature °C: 235

The peak reflow temperature of 235 °C ensures reliable solder joints and proper assembly during manufacturing processes.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTJD4152PT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

.88 A

Maximum Drain Current (ID):

.88 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

2

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTJD4152PT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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