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NTHS5445T1

Onsemi

NTHS5445T1 by Onsemi

NTHS5445T1 by Onsemi is a P-CHANNEL FET with 8V DS Breakdown Voltage, 5.2A Drain Current, and 0.035 ohm On Resistance. Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 150 °C. This RECTANGULAR package with DUAL terminals is designed for high-power efficiency in various electronic devices.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 12,000 parts In-Stock

1+ parts

-

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$0.238

1k+ parts

$0.197

10k+ parts

$0.176

12,000

-

$0.238

$0.197

$0.176

DigiKey

USA . 12,000 parts In-Stock

1+ parts

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$0.300

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$0.300

Verical

USA . 12,000 parts In-Stock

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$0.220

12,000

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$0.220

Distributors (In-Stock)

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Digiode

USA . 2,173 parts In-Stock

1+ parts

$0.185

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2,173

$0.185

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Chip Stock

USA . 75,000 parts In-Stock

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Vyrian

USA . 12,943 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 1,659 parts In-Stock

1+ parts

$0.176

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1,659

$0.176

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Corohmni

South Africa . 402 parts In-Stock

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$0.195

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402

$0.195

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Component Stockers USA

USA . 10,119 parts In-Stock

1+ parts

$0.200

100+ parts

$0.190

1k+ parts

$0.170

10k+ parts

$0.170

10,119

$0.200

$0.190

$0.170

$0.170

AZTECH Wire

Italy . 1,191 parts In-Stock

1+ parts

$18.930

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$18.930

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QUARKTWIN TECHNOLOGY LTD

USA . 16,011 parts In-Stock

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Continental Prestige Electronics

USA . 12,000 parts In-Stock

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$0.179

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Kulean Microsystems

USA . 5,364 parts In-Stock

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Problanco Electronics

Mexico . 5,125 parts In-Stock

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TANS Electronics

Latvia . 3,442 parts In-Stock

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SupplyDigital Components

Austria . 2,841 parts In-Stock

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UHIMA Technologies

Türkiye . 756 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the NTHS5445T1 by Onsemi. Crafted by industry-leading experts, this P-CHANNEL small signal Field Effect Transistor (FET) is designed for maximum performance and reliability. Perfect for switching applications, this transistor offers enhanced mode operation with a built-in diode for seamless functionality. With a high breakdown voltage and low on-resistance, this transistor delivers top-notch efficiency and durability. Trust Onsemi to provide you with the quality and innovation you need to take your projects to the next level. Elevate your designs with the NTHS5445T1 and experience the difference today!

Feature Benefit Bullets

Polarity or Channel Type: P-CHANNEL

P-CHANNEL transistors are efficient for low-power applications and can provide high input impedance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for simplified circuit designs and protection against reverse current flow.

Transistor Application: SWITCHING

Designed for switching applications which require fast response times and low power consumption.

Minimum DS Breakdown Voltage: 8 V

Provides a safety margin for voltage spikes and overloads in the circuit.

Surface Mount: YES

Easily mountable on circuit boards, saving space and simplifying assembly processes.

Maximum Drain Current (Abs): 5.2 A

Can handle high current loads, making it suitable for various applications.

Maximum Power Dissipation (Abs): 0.7 W

Efficient power handling capability ensuring reliable operation and minimal heat dissipation.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, suitable for applications where heat dissipation is a concern.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTHS5445T1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

8 V

Maximum Drain Current (Abs) (ID):

5.2 A

Maximum Drain Current (ID):

5.2 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHS5445T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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