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BSS138W

Onsemi

BSS138W by Onsemi

BSS138W by Onsemi is a small signal N-CHANNEL FET with a min DS breakdown voltage of 50V. It is commonly used for switching applications due to its single configuration with built-in diode and max drain current of 0.21A.

Median Price

$0.213

Lifecycle Status

Suppliers In-Stock

36

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 4,184 parts In-Stock

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$0.098

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$0.093

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DigiKey

USA . 22 parts In-Stock

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$0.160

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$0.060

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$0.038

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$0.026

22

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Distrelec

Netherlands . 5,837 parts In-Stock

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$0.232

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$0.177

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Farnell

UK . 106,332 parts In-Stock

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Arrow

USA . 80 parts In-Stock

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Mouser Electronics

USA . 31,804 parts In-Stock

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$0.100

Newark

USA . 60 parts In-Stock

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Verical

USA . 93,000 parts In-Stock

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Element14

Singapore . 88,286 parts In-Stock

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$0.194

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Chip1Stop

Japan . 4,721 parts In-Stock

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$0.097

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$0.063

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$0.049

4,721

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Distributors (In-Stock)

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EXC GmbH

Germany . 11,133 parts In-Stock

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IBS Electronics

USA . 11,209 parts In-Stock

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11,209

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Digiode

USA . 2,985 parts In-Stock

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Nova Conductors

Japan . 15 parts In-Stock

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Bristol Electronics

USA . 2,142 parts In-Stock

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Maritex

Poland . 987 parts In-Stock

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$0.218

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987

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TME

Poland . 2,211 parts In-Stock

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$0.310

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$0.135

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$0.088

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$0.068

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$0.135

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$0.068

Cyclops Electronics Ltd

UK . 451,280 parts In-Stock

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Vyrian

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Chip Stock

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Electro Sonic

Canada . 102,000 parts In-Stock

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ES Components

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NAC Semi

USA . 6,000 parts In-Stock

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ComSIT Distribution GmbH

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Inventory MP

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Microfarads

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Sensible Micro Corp

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PC Components Company LLC

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ACDS - Activité Composants Distribution Service

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Bas Electronics GmbH & Co. KG

Germany . 32 parts In-Stock

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Prism Electronics

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Corohmni

South Africa . 341 parts In-Stock

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Ampacity Inc.

Singapore . 125,375 parts In-Stock

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Semicontronic

India . 123,521 parts In-Stock

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Corphita

USA . 2,294 parts In-Stock

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Argo Parts USA

USA . 2,443 parts In-Stock

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$0.094

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$0.091

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Modulus Dynamics

Lithuania . 666 parts In-Stock

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$0.095

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$0.091

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$0.087

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666

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Advanced Electronics

New Zealand . 4,184 parts In-Stock

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$0.098

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Netroflash

USA . 100 parts In-Stock

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Aztec Data Supply Inc.

USA . 79 parts In-Stock

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$1.402

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Perfect Parts

USA . 134,019 parts In-Stock

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Continental Prestige Electronics

USA . 115,940 parts In-Stock

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GreenTree Electronics

Israel . 91,030 parts In-Stock

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Metaverse IC Inc.

Canada . 90,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 27,383 parts In-Stock

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Authorized Procurement Solutions

USA . 25,000 parts In-Stock

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Robosynatics

Brazil . 24,310 parts In-Stock

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Lucentia Tech

USA . 24,310 parts In-Stock

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Futuretech Components

Singapore . 10,000 parts In-Stock

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Glotronic Ltd.

UK . 7,200 parts In-Stock

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XScomponents

USA . 6,000 parts In-Stock

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A-Z Elektronik GmbH

Germany . 4,950 parts In-Stock

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TANS Electronics

Latvia . 1,434 parts In-Stock

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Kulean Microsystems

USA . 1,239 parts In-Stock

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Problanco Electronics

Mexico . 991 parts In-Stock

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UHIMA Technologies

Türkiye . 596 parts In-Stock

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Supply Digital

USA . 444 parts In-Stock

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SupplyDigital Components

Austria . 370 parts In-Stock

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Formix International (Excess)

India . 219 parts In-Stock

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Overview

Discover the BSS138W by Onsemi, a high-quality Small Signal Field Effect Transistor (FET) that guarantees exceptional performance and reliability. Manufactured by Onsemi, a renowned industry leader, this N-CHANNEL transistor offers numerous advantages for a variety of applications. With its built-in diode and switching capabilities, the BSS138W is perfect for enhancing your projects. Its surface mount design and compact package shape make it easy to integrate into any circuit. Trust Onsemi's expertise and elevate your designs with the superior value and benefits provided by the BSS138W.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this product lightweight and cost-effective, making it a good choice for portable and budget-sensitive applications.

Polarity or Channel Type: N-CHANNEL

The N-channel polarity allows for efficient and fast switching operations, making this product suitable for applications that require high-speed switching.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this single configuration provides reverse-bias protection and simplifies circuit design, making it a convenient choice for applications where reverse voltage protection is required.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor ensures reliable and efficient switching operations, making it ideal for use in a wide range of electronic devices and circuits.

Surface Mount: YES

The surface-mount capability of this product allows for easy integration onto PCBs, saving valuable space and enabling efficient automated assembly, making it a favorable choice for compact and mass-produced electronic devices.

Minimum DS Breakdown Voltage: 50 V

With a minimum DS breakdown voltage of 50V, this transistor can handle higher voltage applications reliably, making it suitable for use in various power supply and voltage regulation circuits.

Package Shape: RECTANGULAR

The rectangular package shape offers versatility in placement and allows for efficient heat dissipation, making it suitable for applications that require good thermal management.

Terminal Form: GULL WING

The gull-wing terminal form facilitates easy soldering and provides good mechanical strength, ensuring a reliable electrical connection, making it a preferred choice for applications that require durability.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operating mode offers low power consumption and allows for easy control of the transistor's behavior, making it an excellent choice for applications where power efficiency is essential.

No. of Elements: 1

With a single element, this transistor simplifies circuit design and reduces overall component count, making it an economical choice for applications that require simplicity and cost-effectiveness.

Maximum Drain Current (Abs) (ID): 0.21 A

This product offers a maximum drain current of 0.21A, ensuring it can handle relatively high current requirements, making it suitable for various amplification and switching applications.

No. of Terminals: 3

With three terminals, this transistor provides flexibility in circuit connections, offering multiple options for input and output configurations, making it suitable for various circuit designs.

Maximum Power Dissipation (Abs): 0.34 W

The maximum power dissipation of 0.34W ensures the transistor can handle significant power levels without the risk of overheating, making it a reliable choice for various power applications.

Package Style (Meter): SMALL OUTLINE

The small outline package style offers compactness and space-saving advantages, making it suitable for applications with size constraints or where multiple components need to be accommodated closely.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Utilizing metal-oxide semiconductor technology, this transistor provides good noise immunity, low power consumption, and high input impedance, making it an excellent choice for applications that require high-quality signal processing.

Maximum Power Dissipation Ambient: 0.34 W

With a maximum power dissipation of 0.34W in ambient conditions, this transistor can operate reliably within specified power limits even in varying environmental temperatures, making it suitable for a wide range of applications.

Maximum Operating Temperature: 150 °C

The maximum operating temperature of 150°C ensures this transistor can withstand high-temperature environments, making it suitable for use in applications subjected to elevated ambient temperatures.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides excellent electrical performance, temperature stability, and reliability, making it a trusted and commonly used material in semiconductor devices.

Minimum Operating Temperature: -55 °C

Able to operate reliably at temperatures as low as -55°C, this transistor is well-suited for applications in extreme environmental conditions or where sub-zero temperature operation is required.

Terminal Finish: Tin (Sn)

The tin terminal finish offers good solderability and corrosion resistance, ensuring strong and reliable electrical connections, making it a preferred choice for long-term usage and durability.

Maximum Drain-Source On Resistance: 6 ohm

With a maximum drain-source on resistance of 6 ohms, this transistor minimizes power losses and provides efficient conduction, making it suitable for applications that require low resistance and high efficiency.

Terminal Position: DUAL

The dual terminal position offers flexibility in circuit layout and connection options, accommodating different design requirements and enabling multiple configurations, making it suitable for complex circuit implementations.

Moisture Sensitivity Level (MSL): 1

This product's moisture sensitivity level of 1 indicates that it has a low susceptibility to moisture-related damage during storage or assembly, ensuring long-term reliability in various environments.

Maximum Feedback Capacitance (Crss): 3.5 pF

With a maximum feedback capacitance of 3.5 picofarads, this transistor provides effective high-frequency response, making it suitable for applications that require fast signal switching and amplification.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS138W attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

ULTRA-LOW RESISTANCE

Minimum DS Breakdown Voltage:

50 V

Maximum Drain Current (Abs) (ID):

.21 A

Maximum Drain Current (ID):

.21 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

3.5 pF

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

.34 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Tin (Sn)

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS138W Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.21.00.95

SB

8541.21.00.80

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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