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NTHS5404T1G

Onsemi

NTHS5404T1G by Onsemi

NTHS5404T1G by Onsemi is a N-CHANNEL FET with 20V DS Breakdown Voltage, 5.2A ID, and 0.03 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE at up to 150°C. This RECTANGULAR package has 8 terminals and built-in DIODE, making it suitable for high-power circuits.

Median Price

$0.503

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 57 parts In-Stock

1+ parts

$0.459

100+ parts

$0.251

1k+ parts

$0.219

10k+ parts

$0.194

57

$0.459

$0.251

$0.219

$0.194

Chip1Stop

Japan . 8,123 parts In-Stock

1+ parts

$3.660

100+ parts

$1.160

1k+ parts

$0.788

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8,123

$3.660

$1.160

$0.788

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Flip Electronics (Authorized)

USA . 17,249 parts In-Stock

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17,249

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DigiKey

USA . 1,463 parts In-Stock

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$0.330

1,463

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$0.330

Rochester

USA . 1,240 parts In-Stock

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-

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$0.503

1k+ parts

$0.418

10k+ parts

$0.372

1,240

-

$0.503

$0.418

$0.372

Verical

USA . 1,240 parts In-Stock

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-

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$0.522

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$0.466

1,240

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$0.522

$0.466

Distributors (In-Stock)

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Digiode

USA . 2,435 parts In-Stock

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$0.436

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-

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2,435

$0.436

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Nova Conductors

Japan . 650 parts In-Stock

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$0.523

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650

$0.523

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Bristol Electronics

USA . 3,000 parts In-Stock

1+ parts

$0.938

100+ parts

$0.347

1k+ parts

$0.244

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3,000

$0.938

$0.347

$0.244

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Chip Stock

USA . 41,100 parts In-Stock

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Vyrian

USA . 10,299 parts In-Stock

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10,299

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Cyclops Electronics Ltd

UK . 10,000 parts In-Stock

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Dan-Mar Components

USA . 3,000 parts In-Stock

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3,000

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ACDS - Activité Composants Distribution Service

France . 2,875 parts In-Stock

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2,875

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PC Components Company LLC

USA . 2,517 parts In-Stock

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2,517

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ComSIT Distribution GmbH

Germany . 2,250 parts In-Stock

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2,250

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Flip Electronics

USA . 1,463 parts In-Stock

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1,463

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Zilex Electronics Inc.

Canada . 1,400 parts In-Stock

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1,400

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Sensible Micro Corp

USA . 45 parts In-Stock

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45

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Distributors (Availability)

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Continental Prestige Electronics

USA . 44,657 parts In-Stock

1+ parts

$0.358

100+ parts

$0.196

1k+ parts

$0.161

10k+ parts

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44,657

$0.358

$0.196

$0.161

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Ampacity Inc.

Singapore . 10,127 parts In-Stock

1+ parts

$0.390

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10,127

$0.390

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Corphita

USA . 1,272 parts In-Stock

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$0.413

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1,272

$0.413

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Corohmni

South Africa . 250 parts In-Stock

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$0.459

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250

$0.459

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Netroflash

USA . 1,000 parts In-Stock

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$0.523

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1,000

$0.523

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AZTECH Wire

Italy . 1,001 parts In-Stock

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$14.900

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$14.900

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Perfect Parts

USA . 107,554 parts In-Stock

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GreenTree Electronics

Israel . 8,133 parts In-Stock

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Kepictronics

USA . 6,900 parts In-Stock

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Kulean Microsystems

USA . 6,846 parts In-Stock

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Computer Components Inc. - USA

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A-Z Elektronik GmbH

Germany . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 1,714 parts In-Stock

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TANS Electronics

Latvia . 1,332 parts In-Stock

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SupplyDigital Components

Austria . 1,008 parts In-Stock

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1,008

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UHIMA Technologies

Türkiye . 608 parts In-Stock

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608

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Futuretech Components

Singapore . 508 parts In-Stock

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508

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Lixinc

USA . 327 parts In-Stock

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Argo Parts USA

USA . 164 parts In-Stock

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Overview

Enhance your electronic devices with the NTHS5404T1G Small Signal FET by Onsemi. This N-channel transistor offers high-quality performance in switching applications, thanks to its built-in diode and enhancement mode operation. With a maximum drain current of 5.2 A and low on-resistance, this transistor delivers reliable power management. Trust in Onsemi's expertise in semiconductor technology for top-notch products. Upgrade your designs with the NTHS5404T1G and experience improved efficiency and functionality in your circuits.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have higher electron mobility and faster switching speeds compared to P-channel transistors, making them a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode facilitates bidirectional current flow, which can prevent damage from reverse polarity or inductive kickback, enhancing the reliability of the circuit.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient and reliable performance in electronic circuits that require rapid on/off switching.

Surface Mount: YES

Surface mount technology allows for easy and compact integration onto PCBs, saving space and reducing manufacturing costs.

Minimum DS Breakdown Voltage: 20 V

With a minimum breakdown voltage of 20V, this FET can handle higher voltages without breakdown, ensuring the circuit's stability and longevity.

Package Shape: RECTANGULAR

Rectangular package shape provides a standard form factor for easy handling and mounting on PCBs.

Terminal Form: C BEND

C bend terminals facilitate easy soldering and connection to the circuit board, ensuring a reliable electrical connection.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally off devices that require a positive voltage at the gate to turn on, allowing for precise control over the switching operation.

Maximum Drain Current (Abs) (ID): 5.2 A

With a high maximum drain current of 5.2A, this FET can handle heavy loads and high current applications with ease.

No. of Terminals: 8

Having 8 terminals provides more connection options and flexibility in circuit design, allowing for more complex and versatile circuit configurations.

Maximum Power Dissipation (Abs): 0.7 W

The low maximum power dissipation of 0.7W helps in reducing heat dissipation and power loss, improving the overall efficiency of the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB, making it suitable for compact electronic devices and applications with limited space.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance, low power consumption, and reliable operation, making it ideal for various electronic applications.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this FET can withstand high ambient temperatures, ensuring reliability and longevity in extreme conditions.

Transistor Element Material: SILICON

Silicon-based transistors are known for their reliability, stability, and low cost, making them a popular choice for various electronic applications.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and corrosion resistance, ensuring a durable and long-lasting connection between the FET and the PCB.

Maximum Drain-Source On Resistance: 0.03 ohm

Low drain-source on resistance of 0.03 ohm minimizes power dissipation and voltage drops, enhancing the efficiency and performance of the FET in circuit applications.

Terminal Position: DUAL

Dual terminal position provides alternative mounting options and flexibility in circuit layout, allowing for optimized space utilization and easier connections.

Maximum Time At Peak Reflow Temperature (s): 30

Ability to withstand peak reflow temperature for up to 30 seconds ensures reliable soldering and assembly processes, leading to a robust and durable circuit connection.

Peak Reflow Temperature °C: 260

Peak reflow temperature of 260°C allows for proper solder melting and bonding during the assembly process, ensuring quality and reliable solder joints.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTHS5404T1G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

5.2 A

Maximum Drain Current (ID):

5.2 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

C BEND

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHS5404T1G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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