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NTHS5402T1

Onsemi

NTHS5402T1 by Onsemi

NTHS5402T1 by Onsemi is a N-CHANNEL FET with 30V DS breakdown voltage, 4.9A ID, and 0.035 ohm RDS(on). Ideal for SWITCHING applications, it operates in ENHANCEMENT MODE with a max temp of 150 °C. This RECTANGULAR package has 8 terminals and built-in diode, suitable for surface mount technology.

Median Price

$0.242

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Rochester

USA . 21,000 parts In-Stock

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$0.251

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$0.208

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$0.186

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$0.251

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$0.186

Verical

USA . 21,000 parts In-Stock

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$0.232

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$0.232

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Digiode

USA . 624 parts In-Stock

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$0.196

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Chip Stock

USA . 67,000 parts In-Stock

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Vyrian

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R&J Components

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Corphita

USA . 1,203 parts In-Stock

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$0.185

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Corohmni

South Africa . 481 parts In-Stock

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$0.206

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Component Stockers USA

USA . 18,309 parts In-Stock

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$0.210

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$0.200

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$0.180

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$0.180

18,309

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$0.180

AZTECH Wire

Italy . 447 parts In-Stock

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$9.640

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Continental Prestige Electronics

USA . 21,000 parts In-Stock

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$0.189

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QUARKTWIN TECHNOLOGY LTD

USA . 14,721 parts In-Stock

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Kulean Microsystems

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Problanco Electronics

Mexico . 3,407 parts In-Stock

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TANS Electronics

Latvia . 2,470 parts In-Stock

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SupplyDigital Components

Austria . 1,957 parts In-Stock

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UHIMA Technologies

Türkiye . 851 parts In-Stock

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Overview

Elevate your electronic designs with the NTHS5402T1 from Onsemi, a top-of-the-line Small Signal Field Effect Transistor that offers unparalleled quality and performance. With its N-CHANNEL polarity and built-in diode configuration, this transistor is perfect for switching applications. The compact rectangular package shape and C Bend terminal form make it ideal for surface mounting, while the metal-oxide semiconductor technology ensures reliable operation at up to 150 °C. Trust Onsemi's expertise and experience in semiconductor manufacturing to deliver a product that exceeds expectations. Experience the benefits of enhanced performance and efficiency with the NTHS5402T1.

Feature Benefit Bullets

Polarity or Channel Type: N-CHANNEL

N-CHANNEL FETs are known for their high input impedance and low output impedance, making them suitable for signal switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Having a built-in diode helps in preventing reverse current flow and provides protection against voltage spikes, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures fast switching speeds and low power dissipation.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30V, this FET can handle higher voltage levels without experiencing breakdown, ensuring reliability in high voltage applications.

Maximum Drain Current: 4.9 A

The high maximum drain current rating of 4.9A allows this FET to handle higher current loads, making it suitable for applications requiring high power dissipation.

Maximum Power Dissipation: 0.7 W

With a maximum power dissipation of 0.7W, this FET can effectively dissipate heat generated during operation, ensuring efficient performance and reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage at the gate terminal to turn on, providing better control over the switching operation.

Peak Reflow Temperature: 235 C

The FET can withstand peak reflow temperatures of 235 °C, making it suitable for surface mount assembly processes and ensuring reliability during manufacturing.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTHS5402T1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

4.9 A

Maximum Drain Current (ID):

4.9 A

Maximum Drain-Source On Resistance:

.035 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-XDSO-C8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

UNSPECIFIED

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHS5402T1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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