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NTHS4111PT1

Onsemi

NTHS4111PT1 by Onsemi

NTHS4111PT1 by Onsemi is a P-CHANNEL FET with 30V DS breakdown voltage, 3.3A ID, and 0.045 ohm RDS(on). Ideal for switching applications, it features a single configuration with built-in diode in a small outline package suitable for surface mount technology.

Median Price

$0.238

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 24,600 parts In-Stock

1+ parts

-

100+ parts

$0.238

1k+ parts

$0.197

10k+ parts

$0.176

24,600

-

$0.238

$0.197

$0.176

DigiKey

USA . 24,600 parts In-Stock

1+ parts

-

100+ parts

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$0.300

24,600

-

-

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$0.300

Verical

USA . 24,600 parts In-Stock

1+ parts

-

100+ parts

-

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10k+ parts

$0.220

24,600

-

-

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$0.220

Distributors (In-Stock)

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Vyrian

USA . 62 parts In-Stock

1+ parts

$0.155

100+ parts

-

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62

$0.155

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Digiode

USA . 2,209 parts In-Stock

1+ parts

$0.185

100+ parts

-

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2,209

$0.185

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Astute Electronics Inc

. 5,029 parts In-Stock

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5,029

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Distributors (Availability)

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Corohmni

South Africa . 440 parts In-Stock

1+ parts

$0.155

100+ parts

-

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440

$0.155

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Corphita

USA . 914 parts In-Stock

1+ parts

$0.176

100+ parts

-

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914

$0.176

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Continental Prestige Electronics

USA . 24,600 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.155

10k+ parts

-

24,600

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-

$0.155

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QUARKTWIN TECHNOLOGY LTD

USA . 10,528 parts In-Stock

1+ parts

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10,528

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Kulean Microsystems

USA . 8,393 parts In-Stock

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8,393

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A-Z Elektronik GmbH

Germany . 6,735 parts In-Stock

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6,735

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SupplyDigital Components

Austria . 6,649 parts In-Stock

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6,649

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Problanco Electronics

Mexico . 4,044 parts In-Stock

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4,044

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TANS Electronics

Latvia . 2,241 parts In-Stock

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2,241

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UHIMA Technologies

Türkiye . 682 parts In-Stock

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682

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Overview

Upgrade your electronic devices with the NTHS4111PT1 by Onsemi, a high-quality P-Channel Small Signal Field Effect Transistor that offers exceptional performance and reliability. Ideal for switching applications, this single configuration transistor features a built-in diode and operates in enhancement mode with a minimum DS breakdown voltage of 30V. With a maximum drain current of 3.3A and low on-resistance of 0.045 ohm, this surface mount transistor ensures efficient power management. Trust Onsemi's expertise in semiconductor technology and choose the NTHS4111PT1 for superior functionality and value in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for a variety of applications.

Polarity or Channel Type: P-CHANNEL

P-channel FETs are known for their high input impedance and low output impedance, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in those scenarios.

Surface Mount: YES

Surface mount technology enables easy integration into compact electronic devices and PCBs.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this FET can handle higher voltages without compromising performance.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient use of space on the PCB and facilitates easy mounting.

Terminal Form: C BEND

C-bend terminals provide a secure connection and easy soldering during assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and low leakage current, enhancing efficiency in operation.

No. of Terminals: 8

Having 8 terminals provides flexibility in circuit design and connectivity options.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and is suitable for compact electronic devices.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers fast switching speeds, low power consumption, and high efficiency in operation.

Transistor Element Material: SILICON

Silicon is a commonly used semiconductor material known for its reliability and performance in electronic components.

Terminal Finish: TIN LEAD

Tin lead finish provides good solderability and ensures a reliable electrical connection.

Maximum Drain Current (ID): 3.3 A

With a high drain current rating, this FET can handle high current loads efficiently.

Maximum Drain-Source On Resistance: 0.045 ohm

Low on-resistance helps in minimizing power losses and improving efficiency in switching applications.

Terminal Position: DUAL

Dual terminal position offers versatility in circuit layout and enables various connection options.

Peak Reflow Temperature °C: 235

With a high peak reflow temperature, this FET can endure the soldering process without damage.

Technical Specifications

Small Signal Field Effect Transistors (FET) NTHS4111PT1 attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

LOGIC LEVEL COMPATIBLE

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (ID):

3.3 A

Maximum Drain-Source On Resistance:

.045 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-C8

JESD-609 Code:

e0

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

8

Operating Mode:

ENHANCEMENT MODE

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

235

Polarity or Channel Type:

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

TIN LEAD

Terminal Form:

C BEND

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTHS4111PT1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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