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BSS123LT3G

Onsemi

BSS123LT3G by Onsemi

BSS123LT3G by Onsemi is a N-CHANNEL FET with 100V DS breakdown voltage, 0.17A drain current, and 6 ohm on resistance. Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 0.225W. Its small outline package makes it suitable for surface mount designs.

Median Price

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Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 7,148 parts In-Stock

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VNN

France . 3,817 parts In-Stock

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Nova Conductors

Japan . 450 parts In-Stock

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450

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Digiode

USA . 158 parts In-Stock

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158

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Aztec Data Supply Inc.

USA . 4,583 parts In-Stock

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$1.217

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4,583

$1.217

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Advanced Electronics

New Zealand . 2,000 parts In-Stock

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$1.944

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$1.846

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$1.846

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2,000

$1.944

$1.846

$1.846

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AZTECH Wire

Italy . 850 parts In-Stock

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$6.480

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850

$6.480

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Ampacity Inc.

Singapore . 1,101 parts In-Stock

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$42.050

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$42.050

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Semicontronic

India . 256 parts In-Stock

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$51.050

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$49.774

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$49.518

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256

$51.050

$49.774

$49.518

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QUARKTWIN TECHNOLOGY LTD

USA . 24,182 parts In-Stock

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SupplyDigital Components

Austria . 6,578 parts In-Stock

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Problanco Electronics

Mexico . 4,982 parts In-Stock

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Argo Parts USA

USA . 4,161 parts In-Stock

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Continental Prestige Electronics

USA . 3,842 parts In-Stock

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Robosynatics

Brazil . 3,000 parts In-Stock

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$1.327

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$1.327

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$1.327

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$1.327

$1.327

$1.327

Lucentia Tech

USA . 3,000 parts In-Stock

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$1.327

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$1.327

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$1.327

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$1.327

$1.327

Kulean Microsystems

USA . 1,850 parts In-Stock

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1,850

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Formix International (Excess)

India . 1,150 parts In-Stock

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TANS Electronics

Latvia . 1,133 parts In-Stock

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Corphita

USA . 718 parts In-Stock

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Corohmni

South Africa . 393 parts In-Stock

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UHIMA Technologies

Türkiye . 128 parts In-Stock

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128

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Bastille Electronics

Australia . 100 parts In-Stock

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100

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Modulus Dynamics

Lithuania . 15 parts In-Stock

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Overview

Discover the BSS123LT3G by Onsemi, a high-quality Small Signal Field Effect Transistor perfect for switching applications. With Onsemi's reputation for excellence in semiconductor manufacturing, this N-channel transistor with a built-in diode offers unmatched reliability and performance. Experience the benefits of enhanced mode operation, low power dissipation, and high breakdown voltage of 100V. Ideal for a wide range of electronic projects, the BSS123LT3G delivers value and efficiency to customers seeking top-notch components for their designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material makes the transistor lightweight and durable, ideal for various electronic applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors offer high efficiency and low power consumption, making them suitable for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects the transistor from reverse voltage, enhancing its reliability.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast transition times and high switching speeds.

Surface Mount: YES

Being surface mountable allows for easy and efficient PCB assembly, making this transistor ideal for mass production.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage ensures the transistor can handle high voltages, increasing its versatility in different circuits.

Package Shape: RECTANGULAR

The rectangular shape makes the transistor easy to mount and align on a PCB, simplifying the manufacturing process.

Terminal Form: GULL WING

Gull wing terminals provide strong connections and easy soldering, increasing the reliability of the transistor in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors offer better control over the current flow, allowing for precise switching and improved efficiency.

Maximum Drain Current (Abs) (ID): 0.17 A

With a high maximum drain current, this transistor can handle heavy loads without overheating, ensuring reliable performance.

No. of Terminals: 3

The simple 3-terminal design makes the transistor easy to integrate into circuits and reduces complexity in circuit layouts.

Maximum Power Dissipation (Abs): 0.225 W

The high power dissipation capability ensures the transistor can handle sudden power surges without getting damaged.

Package Style (Meter): SMALL OUTLINE

The small outline package saves space on the PCB, allowing for compact and efficient circuit design.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high switching speeds and low power consumption, making this transistor ideal for modern electronics.

Maximum Operating Temperature: 150 °C

The high operating temperature range allows the transistor to function in demanding environments without losing performance.

Transistor Element Material: SILICON

Silicon transistors offer high reliability and stability over time, ensuring long-lasting performance in various applications.

Minimum Operating Temperature: -55 °C

The wide operating temperature range makes this transistor suitable for both low and high-temperature environments.

Terminal Finish: TIN

Tin terminals provide excellent solderability and corrosion resistance, ensuring long-term reliability in various electronic applications.

Maximum Drain-Source On Resistance: 6 ohm

The low drain-source on resistance minimizes power loss and improves efficiency in switching applications.

Terminal Position: DUAL

Dual terminal positions offer flexibility in circuit design and make it easy to replace the transistor if needed.

Peak Reflow Temperature °C: 260

The high peak reflow temperature allows for efficient soldering during assembly, ensuring strong and reliable connections.

Technical Specifications

Small Signal Field Effect Transistors (FET) BSS123LT3G attributes and parameters. Explore more Small Signal Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

.17 A

Maximum Drain Current (ID):

.17 A

Maximum Drain-Source On Resistance:

6 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-236

JESD-30 Code:

R-PDSO-G3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

BSS123LT3G Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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