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NTH4LN095N65S3H

Onsemi

NTH4LN095N65S3H by Onsemi

NTH4LN095N65S3H by Onsemi is a Power FET with 650V DS Breakdown Voltage, 84A IDM, and 0.095 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with THROUGH-HOLE terminals.

Median Price

$8.125

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 393 parts In-Stock

1+ parts

$7.000

100+ parts

$3.550

1k+ parts

$3.310

10k+ parts

-

393

$7.000

$3.550

$3.310

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Mouser Electronics

USA . 450 parts In-Stock

1+ parts

$9.250

100+ parts

-

1k+ parts

$4.770

10k+ parts

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450

$9.250

-

$4.770

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DigiKey

USA . 425 parts In-Stock

1+ parts

$9.270

100+ parts

$5.450

1k+ parts

$4.165

10k+ parts

-

425

$9.270

$5.450

$4.165

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Newark

USA . 393 parts In-Stock

1+ parts

$9.530

100+ parts

$5.090

1k+ parts

$4.910

10k+ parts

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393

$9.530

$5.090

$4.910

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Element14

Singapore . 393 parts In-Stock

1+ parts

$10.590

100+ parts

$7.570

1k+ parts

$6.900

10k+ parts

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393

$10.590

$7.570

$6.900

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Rochester

USA . 2,172 parts In-Stock

1+ parts

-

100+ parts

$4.170

1k+ parts

$3.730

10k+ parts

$3.510

2,172

-

$4.170

$3.730

$3.510

Verical

USA . 2,172 parts In-Stock

1+ parts

-

100+ parts

$5.213

1k+ parts

$4.662

10k+ parts

$4.388

2,172

-

$5.213

$4.662

$4.388

RS (Exports)

UK . 430 parts In-Stock

1+ parts

-

100+ parts

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$5.372

10k+ parts

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430

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$5.372

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Distributors (In-Stock)

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Digiode

USA . 634 parts In-Stock

1+ parts

$4.398

100+ parts

-

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634

$4.398

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Vyrian

USA . 5,190 parts In-Stock

1+ parts

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5,190

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Flip Electronics

USA . 2,700 parts In-Stock

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2,700

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Distributors (Availability)

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Corphita

USA . 1,404 parts In-Stock

1+ parts

$4.167

100+ parts

-

1k+ parts

-

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1,404

$4.167

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-

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Corohmni

South Africa . 257 parts In-Stock

1+ parts

$4.630

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257

$4.630

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Component Stockers USA

USA . 4,896 parts In-Stock

1+ parts

$4.900

100+ parts

$4.610

1k+ parts

$4.170

10k+ parts

-

4,896

$4.900

$4.610

$4.170

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Continental Prestige Electronics

USA . 403 parts In-Stock

1+ parts

$5.620

100+ parts

$3.560

1k+ parts

$3.260

10k+ parts

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403

$5.620

$3.560

$3.260

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Microchip USA

USA . 8,002 parts In-Stock

1+ parts

$23.548

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8,002

$23.548

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TANS Electronics

Latvia . 3,487 parts In-Stock

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3,487

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SupplyDigital Components

Austria . 3,479 parts In-Stock

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3,479

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Kulean Microsystems

USA . 1,868 parts In-Stock

1+ parts

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1,868

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Problanco Electronics

Mexico . 1,201 parts In-Stock

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1,201

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Allen Electronics Distributors

USA . 434 parts In-Stock

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$5.008

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434

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$5.008

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UHIMA Technologies

Türkiye . 203 parts In-Stock

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203

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Overview

Power up your devices with the NTH4LN095N65S3H by Onsemi. This high-quality Power FET offers reliable performance in a variety of switching applications. With a maximum DS breakdown voltage of 650V and a maximum drain current of 30A, this transistor is built to handle the toughest tasks. The single configuration with a built-in diode ensures efficiency and ease of use. Trust in Onsemi's expertise in semiconductor technology to deliver a product that exceeds expectations. Upgrade your power systems today with the NTH4LN095N65S3H and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides good insulation properties and durability, making the product reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer lower ON resistance and higher switching speeds compared to P-Channel FETs, making them efficient for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode provides reverse polarity protection, enhancing the reliability and safety of the circuit where this FET is used.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET can efficiently control the flow of current in electronic circuits, making it suitable for use in power supply units, motor control, and other similar applications.

Minimum DS Breakdown Voltage: 650 V

High breakdown voltage ensures that the FET can handle high voltage applications without the risk of failure or damage, making it suitable for use in power electronics.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy and secure mounting onto circuit boards or heatsinks, providing mechanical stability and efficient heat dissipation.

Terminal Form: THROUGH-HOLE

Through-hole terminals facilitate easy and secure soldering onto PCBs, ensuring reliable connections and mechanical strength.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are normally OFF devices and can be turned ON by applying a positive gate-to-source voltage, offering better control over the switching operation.

Maximum Pulsed Drain Current (IDM): 84 A

High pulsed drain current capability allows the FET to handle short-term high current spikes, making it suitable for applications where transient overloads occur.

Avalanche Energy Rating (EAS): 284 mJ

High avalanche energy rating indicates the FET's ability to withstand high-energy pulses without breakdown, making it suitable for applications with inductive loads.

No. of Terminals: 4

Four terminals provide easy interfacing and connection with external circuitry, enabling versatile usage in different electronic systems.

Maximum Power Dissipation (Abs): 208 W

High power dissipation capability allows the FET to handle large power loads without overheating, ensuring reliable operation under high power conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount package style enables secure attachment to heatsinks or chassis, enhancing thermal performance and overall reliability in high-power applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-Oxide Semiconductor technology offers low gate input capacitance and high input impedance, minimizing power losses and improving switching efficiency.

Maximum Operating Temperature: 150 °C

High maximum operating temperature ensures reliable performance in environments with elevated temperatures, making this FET suitable for industrial and automotive applications.

Transistor Element Material: SILICON

Silicon-based construction provides good electrical characteristics and temperature stability, ensuring consistent performance over a wide range of operating conditions.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature allows the FET to function in cold environments without performance degradation, making it suitable for outdoor or harsh climate applications.

Maximum Drain Current (ID): 30 A

High maximum drain current rating allows the FET to handle large continuous current flows, making it suitable for high-power applications such as motor control or power conversion.

Maximum Drain-Source On Resistance: 0.095 ohm

Low ON-resistance results in minimal power losses and less heat dissipation, making the FET efficient for high-power switching applications where low conduction losses are critical.

Terminal Position: SINGLE

Single terminal position simplifies the mounting and connection process, ensuring easy integration into circuits and reducing assembly complexity.

Technical Specifications

Power Field Effect Transistors (FET) NTH4LN095N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

284 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.095 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

84 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTH4LN095N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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