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NTH4L040N65S3HFN

Onsemi

NTH4L040N65S3HFN by Onsemi

NTH4L040N65S3HFN by Onsemi is a Power FET with 650V DS Breakdown Voltage, 162.5A IDM, and 0.04 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. With a max power dissipation of 446W, it can handle high-power requirements efficiently.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,525 parts In-Stock

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Vyrian

USA . 1,216 parts In-Stock

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TANS Electronics

Latvia . 6,145 parts In-Stock

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SupplyDigital Components

Austria . 4,302 parts In-Stock

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Kulean Microsystems

USA . 3,607 parts In-Stock

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Corphita

USA . 2,371 parts In-Stock

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Problanco Electronics

Mexico . 361 parts In-Stock

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Corohmni

South Africa . 240 parts In-Stock

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UHIMA Technologies

Türkiye . 231 parts In-Stock

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Overview

Unleash the power of innovation with the NTH4L040N65S3HFN by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are perfect for various applications such as switching. With a high DS Breakdown Voltage of 650V and a maximum Drain Current of 65A, this transistor offers unparalleled performance and reliability. Say goodbye to overheating issues thanks to its Maximum Power Dissipation of 446W. Trust Onsemi to provide you with cutting-edge technology that will take your projects to the next level. Choose the NTH4L040N65S3HFN and experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package material provides good insulation and protection for the FET, ensuring long-term reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance characteristics compared to P-channel FETs, making this product suitable for a wide range of applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse current flow, improving overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast and reliable switching performance.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this FET can handle high power applications with ease, ensuring safe and reliable operation.

Maximum Pulsed Drain Current (IDM): 162.5 A

The high pulsed drain current rating allows for handling of short-duration high power spikes, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 446 W

With a high power dissipation rating, this FET can handle high power levels without overheating, ensuring reliable operation under heavy loads.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate in high-temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.04 ohm

The low drain-source on resistance results in lower power losses and improved efficiency, making it a good choice for high-efficiency applications.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L040N65S3HFN attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1009 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

162.5 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTH4L040N65S3HFN Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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