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NTH4L020N090SC1

Onsemi

NTH4L020N090SC1 by Onsemi

NTH4L020N090SC1 by Onsemi is a Power FET with 900V DS Breakdown Voltage, 148A Drain Current, and 1039A Pulsed Drain Current. It is an N-CHANNEL transistor in SINGLE configuration with built-in diode. Ideal for high-power applications requiring robust performance at temperatures ranging from -55 to 175°C.

Median Price

$25.560

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 1,800 parts In-Stock

1+ parts

$24.180

100+ parts

$16.520

1k+ parts

$16.190

10k+ parts

-

1,800

$24.180

$16.520

$16.190

-

Mouser Electronics

USA . 2,250 parts In-Stock

1+ parts

$25.560

100+ parts

-

1k+ parts

-

10k+ parts

-

2,250

$25.560

-

-

-

Newark

USA . 1,344 parts In-Stock

1+ parts

$27.540

100+ parts

$18.290

1k+ parts

$18.030

10k+ parts

-

1,344

$27.540

$18.290

$18.030

-

DigiKey

USA . 192 parts In-Stock

1+ parts

$28.220

100+ parts

$18.280

1k+ parts

$17.492

10k+ parts

-

192

$28.220

$18.280

$17.492

-

Chip1Stop

Japan . 321 parts In-Stock

1+ parts

$92.400

100+ parts

$43.300

1k+ parts

-

10k+ parts

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321

$92.400

$43.300

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-

EBV Elektronik

Germany . 1,800 parts In-Stock

1+ parts

-

100+ parts

-

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-

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1,800

-

-

-

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Rochester

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$17.490

1k+ parts

$15.650

10k+ parts

$14.730

900

-

$17.490

$15.650

$14.730

Verical

USA . 900 parts In-Stock

1+ parts

-

100+ parts

$21.863

1k+ parts

$19.563

10k+ parts

$18.413

900

-

$21.863

$19.563

$18.413

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,149 parts In-Stock

1+ parts

$15.646

100+ parts

-

1k+ parts

-

10k+ parts

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2,149

$15.646

-

-

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Vyrian

USA . 1,736 parts In-Stock

1+ parts

$16.470

100+ parts

-

1k+ parts

-

10k+ parts

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1,736

$16.470

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-

-

IBS Electronics

USA . 25 parts In-Stock

1+ parts

$21.463

100+ parts

$20.761

1k+ parts

$20.449

10k+ parts

-

25

$21.463

$20.761

$20.449

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Flip Electronics

USA . 4,500 parts In-Stock

1+ parts

-

100+ parts

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4,500

-

-

-

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NAC Semi

USA . 1,350 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$41.230

10k+ parts

$37.110

1,350

-

-

$41.230

$37.110

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 75 parts In-Stock

1+ parts

$14.823

100+ parts

-

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75

$14.823

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Corohmni

South Africa . 404 parts In-Stock

1+ parts

$16.470

100+ parts

-

1k+ parts

-

10k+ parts

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404

$16.470

-

-

-

Continental Prestige Electronics

USA . 346 parts In-Stock

1+ parts

$30.570

100+ parts

$26.310

1k+ parts

-

10k+ parts

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346

$30.570

$26.310

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-

Microchip USA

USA . 5,402 parts In-Stock

1+ parts

$90.689

100+ parts

-

1k+ parts

-

10k+ parts

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5,402

$90.689

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SupplyDigital Components

Austria . 7,356 parts In-Stock

1+ parts

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7,356

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-

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TANS Electronics

Latvia . 2,323 parts In-Stock

1+ parts

-

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2,323

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-

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Kulean Microsystems

USA . 1,858 parts In-Stock

1+ parts

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100+ parts

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1,858

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-

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UHIMA Technologies

Türkiye . 440 parts In-Stock

1+ parts

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440

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iodParts Technologies Inc.

India . 334 parts In-Stock

1+ parts

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334

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Problanco Electronics

Mexico . 260 parts In-Stock

1+ parts

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260

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GreenTree Electronics

Israel . 108 parts In-Stock

1+ parts

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108

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Overview

Unleash the power of innovation with the NTH4L020N090SC1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are designed for optimal performance and reliability. Whether you're in the automotive, industrial, or renewable energy sector, this N-CHANNEL transistor offers enhanced efficiency and durability. With a maximum DS Breakdown Voltage of 900V and a Maximum Pulsed Drain Current of 1039A, this transistor is sure to meet your power needs. Trust Onsemi to provide you with cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and reliability for long-term use.

Polarity or Channel Type: N-CHANNEL

Allows for efficient power control in electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by integrating a diode.

Minimum DS Breakdown Voltage: 900 V

Ensures high voltage handling capability for power applications.

Maximum Pulsed Drain Current (IDM): 1039 A

Supports high peak currents for demanding applications.

Maximum Power Dissipation (Abs): 719 W

Can handle high power levels without overheating.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Provides efficient switching performance for power applications.

Maximum Operating Temperature: 175 °C

Suitable for use in high-temperature environments.

Transistor Element Material: SILICON CARBIDE

Offers enhanced performance and efficiency compared to traditional silicon transistors.

Maximum Feedback Capacitance (Crss): 29.64 pF

Helps in reducing signal distortion and improves circuit stability.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L020N090SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

148 A

Maximum Drain Current (ID):

148 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

29.64 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

1039 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTH4L020N090SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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