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NTH4L040N120SC1

Onsemi

NTH4L040N120SC1 by Onsemi

NTH4L040N120SC1 by Onsemi is a Power FET with 1200V DS Breakdown Voltage, 232A IDM, and 0.056 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Features SILICON CARBIDE material, -55 to 175 °C temp range, and 66ns turn on time.

Median Price

$15.300

Lifecycle Status

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In-Stock Inventory

1k+

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Arrow

USA . 882 parts In-Stock

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$11.772

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$11.772

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Newark

USA . 450 parts In-Stock

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$12.110

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$12.110

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$12.110

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$12.110

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Verical

USA . 620 parts In-Stock

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$14.085

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Chip1Stop

Japan . 30 parts In-Stock

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$15.300

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$15.300

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Farnell

UK . 390 parts In-Stock

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$16.540

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$12.630

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$12.270

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$16.540

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$12.270

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Mouser Electronics

USA . 1,458 parts In-Stock

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$18.790

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$18.790

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DigiKey

USA . 432 parts In-Stock

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$22.150

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$14.041

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$12.867

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$22.150

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$12.867

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Element14

Singapore . 384 parts In-Stock

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$25.560

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$18.940

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$18.640

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384

$25.560

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$18.640

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EBV Elektronik

Germany . 840 parts In-Stock

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RS (Exports)

UK . 630 parts In-Stock

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$15.677

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$15.201

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$15.201

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Future Electronics

Canada . 300 parts In-Stock

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$12.870

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$12.870

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Rochester

USA . 25 parts In-Stock

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$12.860

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$11.510

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$10.830

25

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$11.510

$10.830

Distributors (In-Stock)

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Digiode

USA . 138 parts In-Stock

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$12.834

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TME

Poland . 146 parts In-Stock

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$17.700

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Nova Conductors

Japan . 75 parts In-Stock

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$19.565

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$19.565

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Flip Electronics

USA . 6,750 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 405 parts In-Stock

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Vyrian

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IBS Electronics

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$18.387

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NAC Semi

USA . 60 parts In-Stock

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$19.050

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$19.050

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Ampacity Inc.

Singapore . 116 parts In-Stock

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$11.480

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Corphita

USA . 1,268 parts In-Stock

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$12.159

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Corohmni

South Africa . 482 parts In-Stock

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$13.510

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Continental Prestige Electronics

USA . 2,170 parts In-Stock

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$19.565

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$19.174

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$19.565

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$19.174

Microchip USA

USA . 3,435 parts In-Stock

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$45.136

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Lixinc

USA . 16,816 parts In-Stock

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Kulean Microsystems

USA . 6,468 parts In-Stock

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TANS Electronics

Latvia . 4,685 parts In-Stock

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SupplyDigital Components

Austria . 4,305 parts In-Stock

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GreenTree Electronics

Israel . 3,888 parts In-Stock

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Argo Parts USA

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Perfect Parts

USA . 1,249 parts In-Stock

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Problanco Electronics

Mexico . 1,244 parts In-Stock

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Netroflash

USA . 500 parts In-Stock

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$19.174

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$18.587

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$18.195

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$18.587

$18.195

UHIMA Technologies

Türkiye . 304 parts In-Stock

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Eastek

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Overview

Unlock the power of cutting-edge technology with the NTH4L040N120SC1 by Onsemi. Designed for efficiency and performance, this Power FET offers unparalleled reliability and durability. From switching applications to enhancing overall system functionality, this N-CHANNEL transistor with a built-in diode is a game-changer in the industry. With a high breakdown voltage of 1200V and a maximum drain current of 58A, this transistor delivers exceptional results under various operating conditions. Trust Onsemi's expertise and innovation to take your projects to the next level with the NTH4L040N120SC1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body provides good insulation and protection for the internal components of the FET, ensuring reliable operation and longevity.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance and efficiency compared to P-channel FETs, making this product a good choice for various switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient and smooth switching operations, enhancing the overall performance of the FET in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers high efficiency and low power dissipation, making it suitable for a wide range of switching tasks.

Minimum DS Breakdown Voltage: 1200 V

With a minimum breakdown voltage of 1200 V, this FET can handle high voltage applications with ease, ensuring reliable operation under demanding conditions.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy mounting and integration into various electronic systems, making this FET a versatile choice for different applications.

Terminal Form: THROUGH-HOLE

The through-hole terminal form provides a secure and reliable connection to the circuit board, ensuring stable performance and easy installation of the FET.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer improved control and efficiency in switching operations, making this product a good choice for high-performance applications.

Maximum Pulsed Drain Current (IDM): 232 A

With a high maximum pulsed drain current of 232 A, this FET can handle large current spikes during switching operations, making it suitable for high-power applications.

Avalanche Energy Rating (EAS): 578 mJ

The high avalanche energy rating of 578 mJ ensures that this FET can withstand high-energy spikes and transients, making it a reliable choice for rugged environments.

Maximum Drain Current (Abs) (ID): 58 A

The maximum drain current rating of 58 A allows for high power handling capacity, making this FET suitable for applications that require high current levels.

No. of Terminals: 4

With 4 terminals, this FET provides versatile connectivity options and allows for flexible integration into various circuit configurations.

Maximum Power Dissipation (Abs): 319 W

The high maximum power dissipation rating of 319 W indicates the FET's ability to handle high power levels without overheating, ensuring reliable performance under heavy loads.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and mechanical stability, making this FET suitable for applications that require sturdy and durable components.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability, making this FET a good choice for demanding electronic applications that require precision and efficiency.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175°C, this FET can operate reliably in high-temperature environments, ensuring stable performance under challenging conditions.

Transistor Element Material: SILICON CARBIDE

Silicon carbide material in the transistor element provides enhanced performance and efficiency, making this FET a reliable choice for high-power applications that require superior electrical characteristics.

Maximum Turn On Time (ton): 66 ns

The fast turn-on time of 66 ns ensures quick response and efficient switching operations, making this FET suitable for high-speed applications that require rapid switching.

Minimum Operating Temperature: -55 °C

With a minimum operating temperature of -55°C, this FET can function reliably in low-temperature environments, making it suitable for a wide range of operating conditions.

Maximum Turn Off Time (toff): 71 ns

The fast turn-off time of 71 ns ensures quick response and efficient switching operations, enhancing the overall performance of this FET in high-speed applications.

Terminal Finish: Matte Tin (Sn) - annealed

The matte tin finish provides corrosion resistance and ensures reliable electrical connections, making this FET suitable for long-term use in various environmental conditions.

Maximum Drain-Source On Resistance: 0.056 ohm

With a low drain-source on resistance of 0.056 ohm, this FET provides efficient power delivery and minimal power loss, making it ideal for high-current switching applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection, ensuring easy integration of this FET into electronic circuits and systems.

Maximum Feedback Capacitance (Crss): 11 pF

The low feedback capacitance of 11 pF minimizes signal distortion and ensures stable operation, making this FET suitable for high-frequency applications that require precise signal control.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L040N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

578 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

58 A

Maximum Drain Current (ID):

58 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

11 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

232 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

71 ns

Maximum Turn On Time (ton):

66 ns

Trade Compliance

NTH4L040N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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