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NTH4L020N120SC1

Onsemi

NTH4L020N120SC1 by Onsemi

NTH4L020N120SC1 by Onsemi is a Power FET with 1200V DS Breakdown Voltage, 408A IDM, and 264mJ EAS. Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with SILICON CARBIDE element material, suitable for high-power requirements.

Median Price

$25.875

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

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Farnell

UK . 176 parts In-Stock

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$25.050

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$20.620

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Newark

USA . 16 parts In-Stock

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$25.430

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16

$25.430

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Arrow

USA . 984 parts In-Stock

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$26.320

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$23.470

1k+ parts

$23.010

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984

$26.320

$23.470

$23.010

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Chip1Stop

Japan . 30 parts In-Stock

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$26.900

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$26.900

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Mouser Electronics

USA . 256 parts In-Stock

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$28.720

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256

$28.720

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DigiKey

USA . 416 parts In-Stock

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$36.260

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$24.012

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$23.953

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416

$36.260

$24.012

$23.953

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Element14

Singapore . 176 parts In-Stock

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$39.910

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$35.180

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$39.910

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Verical

USA . 13,950 parts In-Stock

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$24.103

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$24.103

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Avnet

USA . 36 parts In-Stock

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$6.857

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Rochester

USA . 34 parts In-Stock

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$23.950

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$21.430

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$20.170

34

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$21.430

$20.170

Distributors (In-Stock)

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Digiode

USA . 603 parts In-Stock

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$21.451

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$21.451

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NAC Semi

USA . 7,312 parts In-Stock

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Vyrian

USA . 2,430 parts In-Stock

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Corphita

USA . 281 parts In-Stock

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$20.322

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Corohmni

South Africa . 258 parts In-Stock

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$22.580

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$22.580

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Continental Prestige Electronics

USA . 450 parts In-Stock

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$22.840

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$22.840

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Microchip USA

USA . 4,299 parts In-Stock

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$99.843

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$99.843

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Kulean Microsystems

USA . 6,811 parts In-Stock

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SupplyDigital Components

Austria . 6,507 parts In-Stock

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Problanco Electronics

Mexico . 1,917 parts In-Stock

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TANS Electronics

Latvia . 1,299 parts In-Stock

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UHIMA Technologies

Türkiye . 435 parts In-Stock

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Eastek

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Perfect Parts

USA . 192 parts In-Stock

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Overview

Unlock the power of your applications with the NTH4L020N120SC1 from Onsemi. As a leader in Power Field Effect Transistors, Onsemi delivers top-quality products that are built to last. Ideal for switching applications, this N-CHANNEL FET offers a single configuration with a built-in diode for enhanced performance. With a high DS breakdown voltage of 1200V and maximum drain current of 102A, this transistor ensures reliable operation even in the most demanding conditions. Trust Onsemi to provide the innovative solutions you need to take your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the transistor, ensuring a longer lifespan and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-resistance and higher mobility, making them efficient for switching applications.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage allows the transistor to handle high voltage applications safely.

Maximum Pulsed Drain Current (IDM): 408 A

Capable of handling high current pulses, suitable for demanding switching tasks.

Maximum Power Dissipation (Abs): 510 W

High power dissipation capability allows for handling high power levels without overheating.

Maximum Operating Temperature: 175 °C

Can operate in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L020N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

264 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

102 A

Maximum Drain Current (ID):

102 A

Maximum Drain-Source On Resistance:

.028 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

24 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

408 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

86 ns

Maximum Turn On Time (ton):

69 ns

Trade Compliance

NTH4L020N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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