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NTH4L040N65S3F

Onsemi

NTH4L040N65S3F by Onsemi

NTH4L040N65S3F by Onsemi is a single N-channel power FET with 650V DS breakdown voltage. Ideal for switching applications, it has a max IDM of 162.5A and EAS of 1009mJ. With 0.04 ohm RDS(on), it operates in enhancement mode at -55 to 150 °C temperature range.

Median Price

$15.246

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 1,181 parts In-Stock

1+ parts

$18.080

100+ parts

$11.262

1k+ parts

$9.931

10k+ parts

-

1,181

$18.080

$11.262

$9.931

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Mouser Electronics

USA . 26 parts In-Stock

1+ parts

$18.090

100+ parts

-

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$11.350

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26

$18.090

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$11.350

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Rochester

USA . 268 parts In-Stock

1+ parts

-

100+ parts

$9.930

1k+ parts

$8.880

10k+ parts

$8.360

268

-

$9.930

$8.880

$8.360

Verical

USA . 145 parts In-Stock

1+ parts

-

100+ parts

$12.412

1k+ parts

$11.100

10k+ parts

$10.450

145

-

$12.412

$11.100

$10.450

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,974 parts In-Stock

1+ parts

$10.478

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-

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1,974

$10.478

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Vyrian

USA . 561 parts In-Stock

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$11.030

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561

$11.030

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TME

Poland . 30 parts In-Stock

1+ parts

$23.460

100+ parts

$18.680

1k+ parts

$16.690

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30

$23.460

$18.680

$16.690

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Flip Electronics

USA . 3,600 parts In-Stock

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3,600

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NAC Semi

USA . 2,010 parts In-Stock

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$13.550

1k+ parts

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$12.500

2,010

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$13.550

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$12.500

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,861 parts In-Stock

1+ parts

$9.927

100+ parts

-

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1,861

$9.927

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Corohmni

South Africa . 105 parts In-Stock

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$11.030

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105

$11.030

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Microchip USA

USA . 6,412 parts In-Stock

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$30.828

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6,412

$30.828

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QUARKTWIN TECHNOLOGY LTD

USA . 19,053 parts In-Stock

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19,053

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A-Z Elektronik GmbH

Germany . 6,488 parts In-Stock

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6,488

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TANS Electronics

Latvia . 6,317 parts In-Stock

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Authorized Procurement Solutions

USA . 6,000 parts In-Stock

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Kulean Microsystems

USA . 3,124 parts In-Stock

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Problanco Electronics

Mexico . 2,688 parts In-Stock

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2,688

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SupplyDigital Components

Austria . 2,428 parts In-Stock

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2,428

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UHIMA Technologies

Türkiye . 726 parts In-Stock

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726

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Perfect Parts

USA . 674 parts In-Stock

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Overview

Elevate your power electronics with the NTH4L040N65S3F by Onsemi. Crafted by a trusted manufacturer, this N-channel power FET offers unparalleled reliability and performance for a variety of switching applications. Its advanced technology ensures enhanced efficiency and durability, while its high breakdown voltage of 650V provides added protection. Experience seamless operation with a single configuration design and benefit from a maximum drain current of 65A. Trust Onsemi to deliver cutting-edge solutions for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good thermal and electrical insulation, making the product durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs offer lower on-state resistance and faster switching speeds compared to P-Channel FETs.

Configuration: SINGLE

Simplified setup and control for easy integration into various circuits.

Transistor Application: SWITCHING

Specifically designed for switching applications, ensuring efficient performance.

Minimum DS Breakdown Voltage: 650 V

Can handle high voltages, suitable for applications that require reliable voltage handling.

Maximum Pulsed Drain Current (IDM): 162.5 A

Capable of handling high current spikes for demanding applications.

Maximum Power Dissipation (Abs): 446 W

High power dissipation capability allows the FET to operate in challenging conditions without overheating.

Maximum Operating Temperature: 150 °C

Can function reliably in high-temperature environments, expanding its range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L040N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1009 mJ

Case Connection:

ISOLATED

Configuration:

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

65 A

Maximum Drain Current (ID):

65 A

Maximum Drain-Source On Resistance:

.04 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

446 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

162.5 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTH4L040N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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