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NTH4L022N120M3S

Onsemi

NTH4L022N120M3S by Onsemi

NTH4L022N120M3S by Onsemi is a Power FET with 1200V DS Breakdown Voltage, 246A IDM, and 0.03 ohm RDS(on). Ideal for SWITCHING applications due to its N-CHANNEL configuration and ENHANCEMENT MODE operation. Package style is FLANGE MOUNT with SILICON CARBIDE element material.

Median Price

$16.735

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 62 parts In-Stock

1+ parts

$14.840

100+ parts

$9.370

1k+ parts

$9.180

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62

$14.840

$9.370

$9.180

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Mouser Electronics

USA . 1,474 parts In-Stock

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$18.630

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$18.630

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Newark

USA . 40 parts In-Stock

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$19.070

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40

$19.070

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DigiKey

USA . 840 parts In-Stock

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$19.410

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$12.167

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$10.877

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840

$19.410

$12.167

$10.877

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Element14

Singapore . 62 parts In-Stock

1+ parts

$22.140

100+ parts

$16.230

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$15.980

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62

$22.140

$16.230

$15.980

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Chip1Stop

Japan . 65,700 parts In-Stock

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$58.100

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$27.600

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$17.200

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65,700

$58.100

$27.600

$17.200

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Rochester

USA . 4,890 parts In-Stock

1+ parts

-

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$10.880

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$9.730

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$9.160

4,890

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$10.880

$9.730

$9.160

Verical

USA . 3,090 parts In-Stock

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$13.600

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$12.162

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$13.600

$12.162

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Avnet

USA . 2,250 parts In-Stock

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$7.508

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$7.508

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Arrow

USA . 450 parts In-Stock

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$10.447

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450

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$10.447

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Flip Electronics (Authorized)

USA . 450 parts In-Stock

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450

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Distributors (In-Stock)

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Vyrian

USA . 1,055 parts In-Stock

1+ parts

$10.268

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$10.268

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IBS Electronics

USA . 3,679 parts In-Stock

1+ parts

$12.454

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$15.946

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3,679

$12.454

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$15.946

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Digiode

USA . 1,624 parts In-Stock

1+ parts

$12.778

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1,624

$12.778

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Flip Electronics

USA . 15,300 parts In-Stock

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NAC Semi

USA . 900 parts In-Stock

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$21.600

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900

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$21.600

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Distributors (Availability)

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Corohmni

South Africa . 192 parts In-Stock

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$10.852

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192

$10.852

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Corphita

USA . 1,806 parts In-Stock

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$12.105

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Microchip USA

USA . 6,593 parts In-Stock

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$66.516

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iodParts Technologies Inc.

India . 96,000 parts In-Stock

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Problanco Electronics

Mexico . 4,758 parts In-Stock

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SupplyDigital Components

Austria . 2,083 parts In-Stock

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Perfect Parts

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UHIMA Technologies

Türkiye . 845 parts In-Stock

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Kulean Microsystems

USA . 620 parts In-Stock

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Eastek

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Authorized Procurement Solutions

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TANS Electronics

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Overview

Discover the power and reliability of the NTH4L022N120M3S by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch Power Field Effect Transistors that are perfect for various switching applications. With a high breakdown voltage of 1200V and maximum pulsing current of 246A, this transistor offers unparalleled performance and durability. Whether you're looking to enhance your power system or improve efficiency, this N-Channel FET with a built-in diode is the ideal solution. Trust Onsemi to provide you with cutting-edge technology that meets your needs and exceeds your expectations. Upgrade to the NTH4L022N120M3S today and experience the difference!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, extending the lifespan of the product.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage allows for reliable performance in high voltage applications.

Configuration: SINGLE WITH BUILT-IN DIODE

Convenient built-in diode simplifies circuit design and integration.

Transistor Application: SWITCHING

Suitable for various switching applications due to its fast switching speed and low on-resistance.

Maximum Pulsed Drain Current (IDM): 246 A

Capable of handling high current pulses, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 267 mJ

Can withstand high energy spikes, providing protection against voltage transients and surges.

Maximum Power Dissipation (Abs): 352 W

Efficient power dissipation capability allows for reliable operation under high power conditions.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high efficiency and low power consumption, making it ideal for energy-efficient applications.

Maximum Operating Temperature: 175 °C

Can operate in high temperature environments without compromising performance.

Minimum Operating Temperature: -55 °C

Can function in low temperature conditions, providing versatility in different operating environments.

Maximum Drain Current (ID): 68 A

Capable of handling high continuous current, suitable for power-intensive applications.

Maximum Drain-Source On Resistance: 0.03 ohm

Low on-resistance results in reduced power loss and improved efficiency in circuit applications.

Maximum Feedback Capacitance (Crss): 12 pF

Low feedback capacitance facilitates high-speed switching, enhancing overall performance.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L022N120M3S attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

267 mJ

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (ID):

68 A

Maximum Drain-Source On Resistance:

.03 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

246 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Trade Compliance

NTH4L022N120M3S Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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