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NTH4L027N65S3F

Onsemi

NTH4L027N65S3F by Onsemi

NTH4L027N65S3F by Onsemi is a Power FET with 650V DS Breakdown Voltage, 187.5A IDM, and 0.0274 ohm RDS(on). It is an N-CHANNEL transistor for SWITCHING applications. Operating in ENHANCEMENT MODE, it has a max power dissipation of 595W and operates b/w -55 to 150 °C.

Median Price

$23.760

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 395 parts In-Stock

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$23.760

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$14.069

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Mouser Electronics

USA . 29 parts In-Stock

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$23.760

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$16.080

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Digiode

USA . 543 parts In-Stock

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$19.456

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Vyrian

USA . 3,567 parts In-Stock

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Flip Electronics

USA . 450 parts In-Stock

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Advanced Electronics

New Zealand . 1,000 parts In-Stock

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$0.860

100+ parts

$0.783

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$0.705

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1,000

$0.860

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$0.705

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Corphita

USA . 800 parts In-Stock

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$18.432

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Corohmni

South Africa . 489 parts In-Stock

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$20.480

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Component Stockers USA

USA . 57 parts In-Stock

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$21.710

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Microchip USA

USA . 9,577 parts In-Stock

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$52.969

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Kulean Microsystems

USA . 8,385 parts In-Stock

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TANS Electronics

Latvia . 6,725 parts In-Stock

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SupplyDigital Components

Austria . 1,099 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 952 parts In-Stock

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UHIMA Technologies

Türkiye . 277 parts In-Stock

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Authorized Procurement Solutions

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Overview

Discover the NTH4L027N65S3F by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. Manufactured by Onsemi, known for their reliability and innovation, this N-CHANNEL FET offers customers unmatched performance with its high breakdown voltage of 650V and low on-resistance. Whether you need efficient power management or reliable circuit protection, this transistor is the solution you've been searching for. Upgrade your projects today with the NTH4L027N65S3F and experience the benefits of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and reliability are important.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically offer better performance and efficiency compared to P-channel transistors, making this product a good choice for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and makes the product more versatile for various applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this product offers fast switching speeds and high efficiency.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this product can handle high voltages and provides reliable operation in demanding conditions.

Maximum Pulsed Drain Current (IDM): 187.5 A

The high pulsed drain current rating allows the product to handle short bursts of high current, making it suitable for power applications with high peak currents.

Maximum Power Dissipation (Abs): 595 W

With a high power dissipation rating, this product can handle high power levels without overheating, ensuring reliable operation even under heavy loads.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the product to operate in high-temperature environments without performance degradation, making it suitable for a wide range of applications.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L027N65S3F attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1610 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

75 A

Maximum Drain Current (ID):

75 A

Maximum Drain-Source On Resistance:

.0274 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

187.5 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTH4L027N65S3F Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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