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NTH4L015N065SC1

Onsemi

NTH4L015N065SC1 by Onsemi

NTH4L015N065SC1 by Onsemi is a Power FET with 650V DS Breakdown Voltage, 859A IDM, and 753W Max Power Dissipation. Ideal for high-power applications requiring N-CHANNEL configuration in RECTANGULAR package style with SILICON CARBIDE element material.

Median Price

$23.560

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 72 parts In-Stock

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$10.410

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$10.410

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$10.410

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72

$10.410

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Farnell

UK . 186 parts In-Stock

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$22.980

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$16.480

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$16.480

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Arrow

USA . 7,704 parts In-Stock

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$23.020

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7,704

$23.020

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Verical

USA . 7,704 parts In-Stock

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$23.020

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$23.020

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Chip1Stop

Japan . 79 parts In-Stock

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$24.100

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Mouser Electronics

USA . 189 parts In-Stock

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$26.100

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DigiKey

USA . 1,380 parts In-Stock

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$28.130

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$18.219

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$17.424

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$28.130

$18.219

$17.424

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Element14

Singapore . 186 parts In-Stock

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$39.170

100+ parts

$28.800

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$28.230

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186

$39.170

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$28.230

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Flip Electronics (Authorized)

USA . 8,000 parts In-Stock

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EBV Elektronik

Germany . 3,150 parts In-Stock

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Digiode

USA . 2,337 parts In-Stock

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$15.276

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Flip Electronics

USA . 12,500 parts In-Stock

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NAC Semi

USA . 2,700 parts In-Stock

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$33.950

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$33.950

Vyrian

USA . 2,370 parts In-Stock

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IBS Electronics

USA . 515 parts In-Stock

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$25.554

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Distributors (Availability)

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Corphita

USA . 1,239 parts In-Stock

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$14.472

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Corohmni

South Africa . 83 parts In-Stock

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$16.080

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Continental Prestige Electronics

USA . 411 parts In-Stock

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$20.060

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Microchip USA

USA . 2,701 parts In-Stock

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Problanco Electronics

Mexico . 6,447 parts In-Stock

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TANS Electronics

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SupplyDigital Components

Austria . 3,579 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Infinite Electronics LLP (Excess)

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Kulean Microsystems

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UHIMA Technologies

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Eastek

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Overview

Experience unparalleled power and performance with the NTH4L015N065SC1 by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and reliability in every product they produce. This Power Field Effect Transistor (FET) is perfect for a wide range of applications, offering customers unbeatable value and benefits. With its single configuration and built-in diode, the NTH4L015N065SC1 provides enhanced efficiency and effectiveness in any project. Trust Onsemi to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging offers good insulation properties, making the product durable and reliable in various operating conditions.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically offer better performance and efficiency compared to P-Channel FETs, making this product suitable for high-power applications.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage of 650V, this FET can handle high voltages safely, making it ideal for power applications that require high voltage tolerance.

Maximum Pulsed Drain Current (IDM): 859 A

The high pulsed drain current rating of 859A allows this FET to handle high peak currents, making it suitable for applications that require high power handling capabilities.

Maximum Power Dissipation (Abs): 753 W

The high power dissipation rating of 753W ensures that the FET can handle heat dissipation effectively, making it suitable for high-power applications where heat generation is a concern.

Maximum Operating Temperature: 175 °C

With a maximum operating temperature of 175 °C, this FET can operate in high-temperature environments, making it suitable for industrial and automotive applications.

Transistor Element Material: SILICON CARBIDE

Silicon Carbide material offers high thermal conductivity and can operate at high temperatures, making the FET more reliable and efficient in demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L015N065SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

164 A

Maximum Drain Current (ID):

164 A

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

39.33 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

859 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Element Material:

SILICON CARBIDE

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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