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NTH4L067N65S3H

Onsemi

NTH4L067N65S3H by Onsemi

NTH4L067N65S3H by Onsemi is a Power FET with 650V DS Breakdown Voltage, 112A IDM, and 0.067 ohm RDS(on). Ideal for switching applications, it operates in enhancement mode with a max power dissipation of 266W. The transistor features an avalanche energy rating of 422mJ and can withstand temperatures from -55 to 150 °C.

Median Price

$6.350

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

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Chip1Stop

Japan . 10 parts In-Stock

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$32.300

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$32.300

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Rochester

USA . 1,644 parts In-Stock

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$5.080

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$4.550

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$4.280

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$4.280

Verical

USA . 1,110 parts In-Stock

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$6.350

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$5.688

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$5.350

1,110

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$6.350

$5.688

$5.350

Distributors (In-Stock)

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Digiode

USA . 1,007 parts In-Stock

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$5.368

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Vyrian

USA . 6,519 parts In-Stock

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Flip Electronics

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Corphita

USA . 1,824 parts In-Stock

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$5.085

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$5.085

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Corohmni

South Africa . 381 parts In-Stock

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$5.650

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Component Stockers USA

USA . 6,674 parts In-Stock

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$5.860

100+ parts

$5.510

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$4.980

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$5.860

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$4.980

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AZTECH Wire

Italy . 1,101 parts In-Stock

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$10.580

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Microchip USA

USA . 5,734 parts In-Stock

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$18.705

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Kulean Microsystems

USA . 5,407 parts In-Stock

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SupplyDigital Components

Austria . 2,621 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 556 parts In-Stock

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UHIMA Technologies

Türkiye . 423 parts In-Stock

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Perfect Parts

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GreenTree Electronics

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Overview

Looking for a reliable power field effect transistor for your switching applications? Look no further than the NTH4L067N65S3H by Onsemi. With a high DS breakdown voltage of 650V and a maximum pulsed drain current of 112A, this N-channel transistor offers exceptional performance and durability. Its single configuration with built-in diode makes it easy to use, while its matte tin terminal finish ensures long-lasting reliability. Trust Onsemi's expertise in semiconductor technology to deliver top-quality products like the NTH4L067N65S3H that will meet your power switching needs with ease.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as a package body material provides good insulation and protection for the internal components, ensuring the reliability and durability of the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs are commonly used in high power applications due to their lower ON resistance and higher efficiency, making this product a suitable choice for applications requiring high performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast switching speeds and low input capacitance, making it ideal for power management and control in various electronic devices.

Minimum DS Breakdown Voltage: 650 V

With a high minimum breakdown voltage of 650 V, this FET can handle high voltage operation, making it suitable for applications that require high power handling capabilities.

Maximum Power Dissipation (Abs): 266 W

The high maximum power dissipation of 266 W allows the FET to handle high power levels without overheating, ensuring reliable performance in demanding environments.

Maximum Drain Current (ID): 40 A

With a high maximum drain current of 40 A, this FET can handle large current loads, making it suitable for high power applications where a robust and efficient transistor is required.

Maximum Drain-Source On Resistance: 0.067 ohm

The low ON resistance of 0.067 ohm helps minimize power loss and improve efficiency in the circuit, making this FET a good choice for high current applications where low resistance is critical.

Technical Specifications

Power Field Effect Transistors (FET) NTH4L067N65S3H attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

422 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

40 A

Maximum Drain-Source On Resistance:

.067 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T4

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

112 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTH4L067N65S3H Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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