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NTBGS3D5N06C

Onsemi

NTBGS3D5N06C by Onsemi

NTBGS3D5N06C by Onsemi is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 491A IDM. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0037 ohm RDS(on), and 176mJ EAS rating. Operating in ENHANCEMENT MODE, this transistor has a max temp of 175°C and DRAIN connection.

Median Price

$3.135

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 377 parts In-Stock

1+ parts

$3.320

100+ parts

$1.790

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-

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377

$3.320

$1.790

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Element14

Singapore . 377 parts In-Stock

1+ parts

$5.360

100+ parts

$3.650

1k+ parts

$2.760

10k+ parts

-

377

$5.360

$3.650

$2.760

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Rochester

USA . 12,563 parts In-Stock

1+ parts

-

100+ parts

$1.900

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$1.700

10k+ parts

$1.600

12,563

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$1.900

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$1.600

Verical

USA . 12,563 parts In-Stock

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-

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$2.125

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$2.000

12,563

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$2.125

$2.000

RS (Exports)

UK . 790 parts In-Stock

1+ parts

-

100+ parts

$4.666

1k+ parts

$4.437

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790

-

$4.666

$4.437

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Mouser Electronics

USA . 682 parts In-Stock

1+ parts

-

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$2.950

10k+ parts

$2.660

682

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$2.660

Distributors (In-Stock)

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Digiode

USA . 1,836 parts In-Stock

1+ parts

$2.014

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1,836

$2.014

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Flip Electronics

USA . 11,200 parts In-Stock

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Vyrian

USA . 9,464 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 633 parts In-Stock

1+ parts

$1.908

100+ parts

-

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633

$1.908

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Corohmni

South Africa . 357 parts In-Stock

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$2.120

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357

$2.120

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Microchip USA

USA . 5,031 parts In-Stock

1+ parts

$17.429

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5,031

$17.429

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TANS Electronics

Latvia . 4,677 parts In-Stock

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Kulean Microsystems

USA . 4,364 parts In-Stock

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Problanco Electronics

Mexico . 3,554 parts In-Stock

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SupplyDigital Components

Austria . 2,332 parts In-Stock

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UHIMA Technologies

Türkiye . 152 parts In-Stock

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Overview

Discover the NTBGS3D5N06C by Onsemi, a high-quality Power Field Effect Transistor with a single configuration and built-in diode. Perfect for switching applications, this N-Channel transistor offers exceptional performance and reliability. With a maximum pulsed drain current of 491 A and an avalanche energy rating of 176 mJ, this transistor delivers unparalleled power dissipation capabilities. Trust in Onsemi's expertise in semiconductor technology to provide you with a versatile and efficient solution for your electronic projects. Choose the NTBGS3D5N06C for superior performance and peace of mind.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the FET, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and faster switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and saves space on the PCB, making this FET a convenient choice for certain applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast turn-on and turn-off times, making it suitable for power management and control circuits.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and cost during manufacturing.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET can handle higher voltages, making it suitable for a wide range of applications.

Maximum Pulsed Drain Current (IDM): 491 A

The high pulsed drain current rating of 491A indicates the FET's ability to handle large current spikes, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 115 W

With a maximum power dissipation rating of 115W, this FET can effectively dissipate heat under high load conditions, ensuring reliable performance.

Maximum Operating Temperature: 175 °C

The high maximum operating temperature of 175°C allows for operation in elevated temperature environments without compromising performance.

Maximum Drain Current (ID): 127 A

The maximum drain current rating of 127A indicates the FET's ability to handle high continuous currents, making it suitable for power-hungry applications.

Maximum Drain-Source On Resistance: 0.0037 ohm

The low drain-source on resistance of 0.0037 ohm minimizes power loss and heat generation, ensuring efficient operation of the FET.

Maximum Feedback Capacitance (Crss): 21 pF

The low feedback capacitance of 21pF minimizes signal distortion and improves high-frequency performance, making this FET suitable for high-speed applications.

Technical Specifications

Power Field Effect Transistors (FET) NTBGS3D5N06C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

176 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (ID):

127 A

Maximum Drain-Source On Resistance:

.0037 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

21 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G6

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

491 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTBGS3D5N06C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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