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NTBG060N090SC1

Onsemi

NTBG060N090SC1 by Onsemi

The Onsemi NTBG060N090SC1 is a N-CHANNEL FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 176A and EAS of 162mJ, operating in ENHANCEMENT MODE. With a Drain Current of 44A and 0.084 ohm RDS(on), this MOSFET offers high power dissipation up to 211W in a SMALL OUTLINE package.

Median Price

$8.140

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Future Electronics

Canada . 50 parts In-Stock

1+ parts

$6.270

100+ parts

$6.160

1k+ parts

$6.000

10k+ parts

-

50

$6.270

$6.160

$6.000

-

Arrow

USA . 1,600 parts In-Stock

1+ parts

$6.414

100+ parts

-

1k+ parts

-

10k+ parts

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1,600

$6.414

-

-

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Newark

USA . 59 parts In-Stock

1+ parts

$7.280

100+ parts

$7.280

1k+ parts

$7.280

10k+ parts

-

59

$7.280

$7.280

$7.280

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Verical

USA . 800 parts In-Stock

1+ parts

$7.941

100+ parts

-

1k+ parts

-

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800

$7.941

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-

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Farnell

UK . 59 parts In-Stock

1+ parts

$8.140

100+ parts

$6.650

1k+ parts

$5.940

10k+ parts

-

59

$8.140

$6.650

$5.940

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Chip1Stop

Japan . 800 parts In-Stock

1+ parts

$8.540

100+ parts

-

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-

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800

$8.540

-

-

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Mouser Electronics

USA . 1,276 parts In-Stock

1+ parts

$10.610

100+ parts

$7.970

1k+ parts

-

10k+ parts

-

1,276

$10.610

$7.970

-

-

DigiKey

USA . 899 parts In-Stock

1+ parts

$13.740

100+ parts

$8.530

1k+ parts

$6.969

10k+ parts

-

899

$13.740

$8.530

$6.969

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Element14

Singapore . 59 parts In-Stock

1+ parts

$14.470

100+ parts

$11.860

1k+ parts

$11.630

10k+ parts

-

59

$14.470

$11.860

$11.630

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,778 parts In-Stock

1+ parts

$5.956

100+ parts

-

1k+ parts

-

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1,778

$5.956

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Vyrian

USA . 2,273 parts In-Stock

1+ parts

$6.270

100+ parts

-

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2,273

$6.270

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Flip Electronics

USA . 4,000 parts In-Stock

1+ parts

-

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4,000

-

-

-

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NAC Semi

USA . 68 parts In-Stock

1+ parts

-

100+ parts

$9.590

1k+ parts

-

10k+ parts

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68

-

$9.590

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Advanced Electronics

New Zealand . 150 parts In-Stock

1+ parts

$1.494

100+ parts

$1.360

1k+ parts

$1.225

10k+ parts

-

150

$1.494

$1.360

$1.225

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Corphita

USA . 619 parts In-Stock

1+ parts

$5.643

100+ parts

-

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619

$5.643

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Corohmni

South Africa . 227 parts In-Stock

1+ parts

$6.270

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-

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227

$6.270

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Component Stockers USA

USA . 22 parts In-Stock

1+ parts

$11.100

100+ parts

$8.930

1k+ parts

$9.090

10k+ parts

-

22

$11.100

$8.930

$9.090

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Continental Prestige Electronics

USA . 64 parts In-Stock

1+ parts

$13.160

100+ parts

$10.210

1k+ parts

-

10k+ parts

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64

$13.160

$10.210

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Microchip USA

USA . 8,887 parts In-Stock

1+ parts

$29.294

100+ parts

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8,887

$29.294

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SupplyDigital Components

Austria . 5,289 parts In-Stock

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5,289

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Perfect Parts

USA . 3,618 parts In-Stock

1+ parts

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3,618

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Problanco Electronics

Mexico . 2,790 parts In-Stock

1+ parts

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2,790

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TANS Electronics

Latvia . 1,390 parts In-Stock

1+ parts

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1,390

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Kulean Microsystems

USA . 339 parts In-Stock

1+ parts

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339

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UHIMA Technologies

Türkiye . 254 parts In-Stock

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254

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Eastek

USA . 77 parts In-Stock

1+ parts

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100+ parts

$12.930

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77

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$12.930

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Overview

Experience the ultimate power efficiency and reliability with the Onsemi NTBG060N090SC1 Power Field Effect Transistor. Designed by one of the industry's leading manufacturers, this N-CHANNEL transistor offers enhanced performance for a variety of switching applications. With a built-in diode and impressive breakdown voltage of 900V, this transistor ensures optimal functionality and durability. Say goodbye to inefficiency and hello to seamless operation with the NTBG060N090SC1. Elevate your projects with this cutting-edge solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FET.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and saves space by incorporating a diode within the FET package.

Minimum DS Breakdown Voltage: 900 V

Suitable for high voltage applications, ensuring reliable performance under high voltage conditions.

Maximum Pulsed Drain Current (IDM): 176 A

Capable of handling high current spikes, making it suitable for demanding applications.

Maximum Power Dissipation (Abs): 211 W

Can dissipate a high amount of power, allowing for operation in high power environments.

Maximum Operating Temperature: 175 °C

Can operate in high temperature environments without performance degradation.

Maximum Drain-Source On Resistance: 0.084 ohm

Low on-resistance results in reduced power loss and efficient switching.

Technical Specifications

Power Field Effect Transistors (FET) NTBG060N090SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

162 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

44 A

Maximum Drain Current (ID):

44 A

Maximum Drain-Source On Resistance:

.084 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

176 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

94 ns

Maximum Turn On Time (ton):

106 ns

Trade Compliance

NTBG060N090SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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