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NTBGS001N06C

Onsemi

NTBGS001N06C by Onsemi

The Onsemi NTBGS001N06C is a Power FET with N-CHANNEL polarity, ideal for SWITCHING applications. It features a 60V DS Breakdown Voltage, 363A Drain Current, and 0.001 ohm Drain-Source Resistance. With a max power dissipation of 250W and operating temperature range from -55 to 175 °C, it offers reliable performance in various electronic systems.

Median Price

$6.250

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 511 parts In-Stock

1+ parts

$5.680

100+ parts

$2.733

1k+ parts

-

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511

$5.680

$2.733

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Mouser Electronics

USA . 800 parts In-Stock

1+ parts

$6.820

100+ parts

$3.290

1k+ parts

$2.620

10k+ parts

-

800

$6.820

$3.290

$2.620

-

Distributors (In-Stock)

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Digiode

USA . 328 parts In-Stock

1+ parts

$14.801

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328

$14.801

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Vyrian

USA . 90 parts In-Stock

1+ parts

$15.580

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90

$15.580

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Chip Stock

USA . 77,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 10,850 parts In-Stock

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10,850

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Nova Conductors

Japan . 750 parts In-Stock

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750

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Distributors (Availability)

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Ampacity Inc.

Singapore . 421 parts In-Stock

1+ parts

$13.240

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421

$13.240

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Corphita

USA . 1,562 parts In-Stock

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$14.022

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1,562

$14.022

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Corohmni

South Africa . 481 parts In-Stock

1+ parts

$15.580

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481

$15.580

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Microchip USA

USA . 8,118 parts In-Stock

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$27.992

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8,118

$27.992

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SupplyDigital Components

Austria . 5,681 parts In-Stock

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Argo Parts USA

USA . 5,217 parts In-Stock

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TANS Electronics

Latvia . 3,106 parts In-Stock

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Kulean Microsystems

USA . 3,005 parts In-Stock

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Problanco Electronics

Mexico . 1,821 parts In-Stock

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Aranea Global

USA . 1,000 parts In-Stock

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UHIMA Technologies

Türkiye . 914 parts In-Stock

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914

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Continental Prestige Electronics

USA . 696 parts In-Stock

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696

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Authorized Procurement Solutions

USA . 200 parts In-Stock

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200

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Overview

Looking for a reliable Power Field Effect Transistor? Look no further than the NTBGS001N06C by Onsemi. With a single configuration and built-in diode, this N-channel transistor is perfect for switching applications. Offering a maximum drain current of 363 A and a low on-resistance of 0.001 ohm, this transistor provides high performance in a small outline package. Trust the quality and expertise of Onsemi to deliver top-notch products like the NTBGS001N06C for all your power needs. Upgrade your electronics with this efficient and durable component today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and stability to the product, ensuring long-term reliability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, leading to better performance in many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against voltage spikes.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in such scenarios.

Surface Mount: YES

Surface mount capability makes for easier integration into various electronic devices.

Minimum DS Breakdown Voltage: 60 V

With a high breakdown voltage, this FET can handle higher voltages without failure.

Package Shape: RECTANGULAR

Rectangular shape provides ease of handling and placement on circuit boards.

Terminal Form: GULL WING

Gull wing terminals allow for secure soldering connection, enhancing overall reliability.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high input impedance and good gain characteristics, suitable for many circuit designs.

Maximum Drain Current (Abs) (ID): 363 A

High maximum drain current allows for handling of large power loads with ease.

No. of Terminals: 6

Having 6 terminals provides flexibility in circuit connections and configurations.

Maximum Power Dissipation (Abs): 250 W

High power dissipation capability ensures the FET can handle heavy loads without overheating.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on circuit boards and allows for compact designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology offers high efficiency and fast switching speeds, making it ideal for many applications.

Maximum Operating Temperature: 175 °C

High maximum operating temperature range allows for use in various environments and conditions.

Transistor Element Material: SILICON

Silicon transistors are known for their reliability and stability in electronic circuits.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature ensures functionality even in cold environments.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good solderability and corrosion resistance for long-term performance.

Maximum Drain-Source On Resistance: 0.001 ohm

Low on-resistance helps in reducing power losses and improving efficiency in switching operations.

Terminal Position: SINGLE

Single terminal position makes for simple and efficient circuit connections.

Case Connection: DRAIN

Drain case connection allows for easy heat dissipation, ensuring reliable operation under heavy loads.

Maximum Time At Peak Reflow Temperature (s): 30

Allows for efficient soldering during assembly processes, reducing production time.

Peak Reflow Temperature °C: 245

High peak reflow temperature ensures proper soldering and joint integrity during manufacturing.

Maximum Feedback Capacitance (Crss): 53 pF

Low feedback capacitance helps in reducing unwanted signal coupling and improving overall circuit performance.

Technical Specifications

Power Field Effect Transistors (FET) NTBGS001N06C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

363 A

Maximum Drain Current (ID):

363 A

Maximum Drain-Source On Resistance:

.001 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

53 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

NTBGS001N06C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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