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NTBG080N120SC1

Onsemi

NTBG080N120SC1 by Onsemi

NTBG080N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max Drain Current of 30A, 179W Power Dissipation, and operates in ENHANCEMENT MODE. With a peak reflow temperature of 245°C and an operating temperature range from -55 to 175°C, it offers reliable performance in various industrial settings.

Median Price

$7.966

Lifecycle Status

Suppliers In-Stock

19

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 30 parts In-Stock

1+ parts

$1.918

100+ parts

$1.855

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-

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30

$1.918

$1.855

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Farnell

UK . 55 parts In-Stock

1+ parts

$6.630

100+ parts

$6.100

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-

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55

$6.630

$6.100

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Chip1Stop

Japan . 30 parts In-Stock

1+ parts

$7.620

100+ parts

-

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30

$7.620

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DigiKey

USA . 743 parts In-Stock

1+ parts

$14.170

100+ parts

$8.132

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-

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743

$14.170

$8.132

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Mouser Electronics

USA . 462 parts In-Stock

1+ parts

$14.170

100+ parts

$8.140

1k+ parts

$7.640

10k+ parts

-

462

$14.170

$8.140

$7.640

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Rochester

USA . 5,023 parts In-Stock

1+ parts

-

100+ parts

$6.650

1k+ parts

$5.950

10k+ parts

$5.600

5,023

-

$6.650

$5.950

$5.600

Verical

USA . 4,800 parts In-Stock

1+ parts

-

100+ parts

$8.313

1k+ parts

$7.438

10k+ parts

$7.000

4,800

-

$8.313

$7.438

$7.000

Element14

Singapore . 1,623 parts In-Stock

1+ parts

-

100+ parts

$9.255

1k+ parts

$8.595

10k+ parts

$8.254

1,623

-

$9.255

$8.595

$8.254

RS (Exports)

UK . 760 parts In-Stock

1+ parts

-

100+ parts

$9.448

1k+ parts

$8.986

10k+ parts

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760

-

$9.448

$8.986

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Newark

USA . 55 parts In-Stock

1+ parts

-

100+ parts

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$7.240

10k+ parts

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55

-

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$7.240

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Distributors (In-Stock)

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Digiode

USA . 295 parts In-Stock

1+ parts

$6.052

100+ parts

-

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295

$6.052

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Nova Conductors

Japan . 42 parts In-Stock

1+ parts

$8.910

100+ parts

-

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42

$8.910

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Chip Stock

USA . 45,000 parts In-Stock

1+ parts

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45,000

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Sensible Micro Corp

USA . 5,152 parts In-Stock

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5,152

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Flip Electronics

USA . 4,800 parts In-Stock

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4,800

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Bristol Electronics

USA . 1,380 parts In-Stock

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1,380

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NAC Semi

USA . 800 parts In-Stock

1+ parts

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$15.610

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800

-

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$15.610

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Vyrian

USA . 361 parts In-Stock

1+ parts

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361

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IBS Electronics

USA . 50 parts In-Stock

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100+ parts

$9.593

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50

-

$9.593

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 177 parts In-Stock

1+ parts

$5.640

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177

$5.640

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Corphita

USA . 1,327 parts In-Stock

1+ parts

$5.733

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1,327

$5.733

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Corohmni

South Africa . 380 parts In-Stock

1+ parts

$6.370

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380

$6.370

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Continental Prestige Electronics

USA . 995 parts In-Stock

1+ parts

$11.240

100+ parts

$8.440

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995

$11.240

$8.440

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Microchip USA

USA . 8,716 parts In-Stock

1+ parts

$27.019

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8,716

$27.019

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TANS Electronics

Latvia . 7,080 parts In-Stock

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7,080

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Argo Parts USA

USA . 3,762 parts In-Stock

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SupplyDigital Components

Austria . 2,262 parts In-Stock

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Problanco Electronics

Mexico . 1,522 parts In-Stock

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UHIMA Technologies

Türkiye . 982 parts In-Stock

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982

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Kulean Microsystems

USA . 305 parts In-Stock

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Authorized Procurement Solutions

USA . 77 parts In-Stock

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77

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Overview

Experience the power of innovation with the NTBG080N120SC1 by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors that are essential for various switching applications. With a single configuration and built-in diode, this N-CHANNEL transistor offers unmatched reliability and efficiency. Its high maximum drain current and low on-resistance ensure optimal performance, while its compact design makes it ideal for surface mount applications. Say goodbye to compromised functionality and hello to superior quality with the NTBG080N120SC1 - the perfect solution for all your power needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes this FET lightweight and durable.

Polarity or Channel Type: N-CHANNEL

The N-channel type increases efficiency and allows for faster switching speeds.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode in this FET simplifies circuit design and saves space on the PCB.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures reliable and efficient performance.

Surface Mount: YES

The surface mount capability of this FET makes it easy to integrate into compact electronic devices.

Minimum DS Breakdown Voltage: 1200 V

With a high breakdown voltage, this FET can handle high voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy placement and soldering on the PCB.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and enhances heat dissipation.

Operating Mode: ENHANCEMENT MODE

Operating in enhancement mode allows for precise control over the FET's conductivity.

Maximum Pulsed Drain Current (IDM): 110 A

The high pulsed drain current rating enables this FET to handle sudden surges in current.

Avalanche Energy Rating (EAS): 171 mJ

With a high avalanche energy rating, this FET can withstand voltage spikes without damage.

Maximum Drain Current (Abs) (ID): 30 A

The high maximum drain current rating ensures reliable performance under heavy load conditions.

Technical Specifications

Power Field Effect Transistors (FET) NTBG080N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

171 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

30 A

Maximum Drain Current (ID):

30 A

Maximum Drain-Source On Resistance:

.11 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

7.9 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

110 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

52 ns

Maximum Turn On Time (ton):

44 ns

Trade Compliance

NTBG080N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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