Loading...

NTBGS002N06C

Onsemi

NTBGS002N06C by Onsemi

The Onsemi NTBGS002N06C is a N-CHANNEL Power FET with 60V DS Breakdown Voltage and 252A Drain Current. Ideal for applications requiring high power dissipation up to 242W, such as in power management systems or motor control circuits. Its small outline package and low on-resistance make it suitable for compact designs in various electronic devices.

Median Price

$5.288

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 608 parts In-Stock

1+ parts

-

100+ parts

$4.700

1k+ parts

$4.210

10k+ parts

$3.960

608

-

$4.700

$4.210

$3.960

Verical

USA . 456 parts In-Stock

1+ parts

-

100+ parts

$5.875

1k+ parts

$5.263

10k+ parts

$4.950

456

-

$5.875

$5.263

$4.950

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 100 parts In-Stock

1+ parts

$5.390

100+ parts

-

1k+ parts

-

10k+ parts

-

100

$5.390

-

-

-

Chip Stock

USA . 54,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

54,000

-

-

-

-

Vyrian

USA . 1,126 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,126

-

-

-

-

Digiode

USA . 848 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

848

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 167 parts In-Stock

1+ parts

$5.282

100+ parts

-

1k+ parts

-

10k+ parts

-

167

$5.282

-

-

-

Continental Prestige Electronics

USA . 5,163 parts In-Stock

1+ parts

$5.390

100+ parts

-

1k+ parts

-

10k+ parts

$5.282

5,163

$5.390

-

-

$5.282

Netroflash

USA . 50 parts In-Stock

1+ parts

$5.390

100+ parts

$5.282

1k+ parts

-

10k+ parts

-

50

$5.390

$5.282

-

-

AZTECH Wire

Italy . 304 parts In-Stock

1+ parts

$9.014

100+ parts

-

1k+ parts

-

10k+ parts

-

304

$9.014

-

-

-

Ampacity Inc.

Singapore . 140 parts In-Stock

1+ parts

$17.050

100+ parts

-

1k+ parts

-

10k+ parts

-

140

$17.050

-

-

-

Microchip USA

USA . 5,676 parts In-Stock

1+ parts

$17.316

100+ parts

-

1k+ parts

-

10k+ parts

-

5,676

$17.316

-

-

-

Authorized Procurement Solutions

USA . 10,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

10,000

-

-

-

-

Kulean Microsystems

USA . 7,579 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

7,579

-

-

-

-

SupplyDigital Components

Austria . 5,386 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,386

-

-

-

-

TANS Electronics

Latvia . 5,141 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,141

-

-

-

-

Argo Parts USA

USA . 3,122 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,122

-

-

-

-

Problanco Electronics

Mexico . 1,847 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,847

-

-

-

-

UHIMA Technologies

Türkiye . 936 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

936

-

-

-

-

iodParts Technologies Inc.

India . 804 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

804

-

-

-

-

Corphita

USA . 654 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

654

-

-

-

-

Overview

Unleash the power of innovation with the NTBGS002N06C by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-notch quality and reliability in every product. This Power Field Effect Transistor is designed for efficiency and performance, offering customers a seamless experience in various applications. With its N-CHANNEL configuration and built-in diode, this transistor provides unmatched value and benefits to users, ensuring optimal functionality and durability. Upgrade your projects with the NTBGS002N06C and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components of the transistor, making it suitable for various environmental conditions.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower on-state resistance and higher switching speeds compared to P-channel FETs, making them ideal for high-performance applications.

Minimum DS Breakdown Voltage: 60 V

With a breakdown voltage of 60V, this FET can handle higher voltages and power levels, making it suitable for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against back EMF, enhancing the performance and reliability of the transistor.

Maximum Drain Current (Abs) (ID): 252 A

With a high maximum drain current rating, this FET can handle heavy load currents, making it suitable for high-power applications.

Maximum Power Dissipation (Abs): 242 W

The high power dissipation rating ensures that the transistor can handle high power levels without overheating, improving its overall reliability.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows this FET to operate reliably in various thermal conditions, making it versatile for different applications.

Maximum Drain-Source On Resistance: 0.002 ohm

The low on-resistance helps in reducing power loss and improving efficiency in high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) NTBGS002N06C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

252 A

Maximum Drain Current (ID):

252 A

Maximum Drain-Source On Resistance:

.002 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

26 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G6

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Element Material:

SILICON

Trade Compliance

NTBGS002N06C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

previous next
The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 19