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NTBG160N120SC1

Onsemi

NTBG160N120SC1 by Onsemi

The Onsemi NTBG160N120SC1 is a N-CHANNEL Power FET with 1200V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a max IDM of 78A and EAS of 120mJ. With a compact SMALL OUTLINE package and SILICON CARBIDE material, it operates b/w -55 to 175 °C for efficient performance.

Median Price

$6.400

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Newark

USA . 765 parts In-Stock

1+ parts

$2.360

100+ parts

$2.360

1k+ parts

$2.360

10k+ parts

-

765

$2.360

$2.360

$2.360

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Mouser Electronics

USA . 2,050 parts In-Stock

1+ parts

$6.850

100+ parts

$4.970

1k+ parts

$4.820

10k+ parts

-

2,050

$6.850

$4.970

$4.820

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Element14

Singapore . 765 parts In-Stock

1+ parts

$9.850

100+ parts

$8.410

1k+ parts

$8.040

10k+ parts

-

765

$9.850

$8.410

$8.040

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DigiKey

USA . 583 parts In-Stock

1+ parts

$10.010

100+ parts

$5.157

1k+ parts

$4.214

10k+ parts

-

583

$10.010

$5.157

$4.214

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Chip1Stop

Japan . 3,265 parts In-Stock

1+ parts

$26.400

100+ parts

$11.000

1k+ parts

$7.510

10k+ parts

-

3,265

$26.400

$11.000

$7.510

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Rochester

USA . 3,910 parts In-Stock

1+ parts

-

100+ parts

$4.220

1k+ parts

$3.770

10k+ parts

$3.550

3,910

-

$4.220

$3.770

$3.550

Verical

USA . 3,910 parts In-Stock

1+ parts

-

100+ parts

$5.275

1k+ parts

$4.713

10k+ parts

$4.438

3,910

-

$5.275

$4.713

$4.438

EBV Elektronik

Germany . 1,600 parts In-Stock

1+ parts

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1,600

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-

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RS (Exports)

UK . 1,535 parts In-Stock

1+ parts

-

100+ parts

$5.949

1k+ parts

$5.240

10k+ parts

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1,535

-

$5.949

$5.240

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Farnell

UK . 765 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$3.520

10k+ parts

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765

-

-

$3.520

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Avnet

USA . 54 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$18.570

10k+ parts

$17.424

54

-

-

$18.570

$17.424

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 918 parts In-Stock

1+ parts

$1.177

100+ parts

-

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918

$1.177

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-

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Digiode

USA . 510 parts In-Stock

1+ parts

$4.446

100+ parts

-

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510

$4.446

-

-

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NAC Semi

USA . 1,600 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$8.820

10k+ parts

$8.020

1,600

-

-

$8.820

$8.020

IBS Electronics

USA . 880 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$6.185

10k+ parts

$6.031

880

-

-

$6.185

$6.031

Cyclops Electronics Ltd

UK . 101 parts In-Stock

1+ parts

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101

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Distributors (Availability)

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Corohmni

South Africa . 86 parts In-Stock

1+ parts

$1.177

100+ parts

-

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86

$1.177

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-

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Corphita

USA . 1,651 parts In-Stock

1+ parts

$4.212

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1,651

$4.212

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-

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Continental Prestige Electronics

USA . 765 parts In-Stock

1+ parts

$9.210

100+ parts

$6.560

1k+ parts

-

10k+ parts

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765

$9.210

$6.560

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-

Microchip USA

USA . 3,759 parts In-Stock

1+ parts

$18.042

100+ parts

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3,759

$18.042

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Perfect Parts

USA . 22,277 parts In-Stock

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22,277

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Lixinc

USA . 14,428 parts In-Stock

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14,428

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TANS Electronics

Latvia . 7,318 parts In-Stock

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7,318

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Problanco Electronics

Mexico . 6,419 parts In-Stock

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SupplyDigital Components

Austria . 6,016 parts In-Stock

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6,016

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Kulean Microsystems

USA . 3,281 parts In-Stock

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3,281

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Eastek

USA . 1,600 parts In-Stock

1+ parts

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100+ parts

$9.370

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1,600

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$9.370

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UHIMA Technologies

Türkiye . 211 parts In-Stock

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211

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Overview

Experience the power of the NTBG160N120SC1 Power Field Effect Transistor by Onsemi, a game-changer in switching applications. With a maximum DS Breakdown Voltage of 1200V and a Maximum Drain Current of 19.5A, this N-CHANNEL FET offers unmatched performance and reliability. Its single configuration with a built-in diode ensures seamless operation, while its Silicon Carbide transistor element material guarantees durability. Trust Onsemi's expertise in semiconductor technology and elevate your projects with the NTBG160N120SC1 - where quality meets innovation.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides a durable and lightweight housing for the field effect transistor, making it suitable for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and ensures efficient switching operations.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage ensures reliable performance and protection against voltage spikes.

Operating Mode: ENHANCEMENT MODE

Enhancement mode operation allows for easy control of the transistor during switching applications.

Maximum Power Dissipation (Abs): 136 W

High power dissipation capability enables the transistor to handle heavy loads without overheating.

Maximum Operating Temperature: 175 °C

Wide operating temperature range makes the FET suitable for use in various environmental conditions.

Maximum Turn On Time (ton): 40 ns

Fast turn-on time ensures swift switching performance, making the FET ideal for high-speed applications.

Maximum Drain-Source On Resistance: 0.224 ohm

Low on-resistance results in minimal power loss and efficient operation of the transistor.

Technical Specifications

Power Field Effect Transistors (FET) NTBG160N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

19.5 A

Maximum Drain Current (ID):

19.5 A

Maximum Drain-Source On Resistance:

.224 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

5.87 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

78 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

42 ns

Maximum Turn On Time (ton):

40 ns

Trade Compliance

NTBG160N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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