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NTBG040N120SC1

Onsemi

NTBG040N120SC1 by Onsemi

NTBG040N120SC1 by Onsemi is a N-CHANNEL FET with 1200V DS Breakdown Voltage, ideal for SWITCHING applications. Features include 240A IDM, 578mJ EAS, and 0.056ohm RDS(ON). Operating in ENHANCEMENT MODE, it has a max power dissipation of 357W and operates at temperatures up to 175°C.

Median Price

$17.318

Lifecycle Status

Suppliers In-Stock

18

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 575 parts In-Stock

1+ parts

$15.045

100+ parts

$12.559

1k+ parts

$12.410

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575

$15.045

$12.559

$12.410

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Mouser Electronics

USA . 1,027 parts In-Stock

1+ parts

$19.590

100+ parts

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1,027

$19.590

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Element14

Singapore . 738 parts In-Stock

1+ parts

$21.881

100+ parts

$18.680

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738

$21.881

$18.680

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DigiKey

USA . 398 parts In-Stock

1+ parts

$23.790

100+ parts

$15.831

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398

$23.790

$15.831

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Chip1Stop

Japan . 680 parts In-Stock

1+ parts

$67.400

100+ parts

$31.600

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$22.800

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680

$67.400

$31.600

$22.800

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Verical

USA . 26,400 parts In-Stock

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$13.015

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$13.015

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RS (Exports)

UK . 795 parts In-Stock

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$13.681

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$13.338

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795

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$13.681

$13.338

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Avnet

USA . 64 parts In-Stock

1+ parts

-

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$46.695

10k+ parts

$43.812

64

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$46.695

$43.812

Newark

USA . 54 parts In-Stock

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$13.150

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54

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$13.150

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Rochester

USA . 2 parts In-Stock

1+ parts

-

100+ parts

$12.930

1k+ parts

$11.570

10k+ parts

$10.890

2

-

$12.930

$11.570

$10.890

Distributors (In-Stock)

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Digiode

USA . 1,985 parts In-Stock

1+ parts

$13.652

100+ parts

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1,985

$13.652

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$15.887

100+ parts

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300

$15.887

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Flip Electronics

USA . 7,200 parts In-Stock

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7,200

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NAC Semi

USA . 1,600 parts In-Stock

1+ parts

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$20.130

10k+ parts

$18.580

1,600

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$20.130

$18.580

IBS Electronics

USA . 800 parts In-Stock

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800

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Vyrian

USA . 254 parts In-Stock

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254

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Chip Stock

USA . 145 parts In-Stock

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145

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Cyclops Electronics Ltd

UK . 50 parts In-Stock

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50

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Distributors (Availability)

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Ampacity Inc.

Singapore . 276 parts In-Stock

1+ parts

$2.640

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276

$2.640

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Corohmni

South Africa . 300 parts In-Stock

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$3.104

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300

$3.104

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Corphita

USA . 783 parts In-Stock

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$12.933

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783

$12.933

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Netroflash

USA . 50 parts In-Stock

1+ parts

$15.887

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$15.569

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50

$15.887

$15.569

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Microchip USA

USA . 6,734 parts In-Stock

1+ parts

$48.715

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6,734

$48.715

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TANS Electronics

Latvia . 7,236 parts In-Stock

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Problanco Electronics

Mexico . 6,376 parts In-Stock

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Kulean Microsystems

USA . 6,345 parts In-Stock

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SupplyDigital Components

Austria . 5,826 parts In-Stock

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Argo Parts USA

USA . 1,939 parts In-Stock

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Eastek

USA . 1,600 parts In-Stock

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$24.250

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UHIMA Technologies

Türkiye . 178 parts In-Stock

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Continental Prestige Electronics

USA . 34 parts In-Stock

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Overview

Discover the power of the NTBG040N120SC1 by Onsemi, a high-quality Power Field Effect Transistor that delivers exceptional performance in switching applications. Manufactured by Onsemi, a trusted name in semiconductor technology, this N-CHANNEL FET offers reliable operation and efficiency. With a maximum DS Breakdown Voltage of 1200V and a Maximum Drain Current of 60A, this transistor is designed for enhanced functionality. Whether you're looking to optimize power management or improve system performance, the NTBG040N120SC1 provides value, reliability, and innovation for your projects. Partner with Onsemi and experience the difference in power transistor technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the FET, ensuring longevity and reliable performance.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs, making them a preferred choice for many applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and offers added protection against reverse voltage, making the FET more versatile and user-friendly.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring fast and efficient operation in various electronic circuits.

Surface Mount: YES

Easy to integrate into surface mount circuit boards, saving space and simplifying the overall design.

Minimum DS Breakdown Voltage: 1200 V

High breakdown voltage allows the FET to handle high voltages, making it suitable for power applications.

Package Shape: RECTANGULAR

The rectangular shape makes it easy to mount and fit into compact spaces within electronic devices.

Terminal Form: GULL WING

The gull wing terminal form provides secure connections and ease of soldering during the assembly process.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer high switching speeds and low ON resistance, ideal for efficient power management.

Technical Specifications

Power Field Effect Transistors (FET) NTBG040N120SC1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

578 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

1200 V

Maximum Drain Current (Abs) (ID):

60 A

Maximum Drain Current (ID):

60 A

Maximum Drain-Source On Resistance:

.056 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12.5 pF

JEDEC-95 Code:

TO-263CB

JESD-30 Code:

R-PSSO-G7

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

7

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

240 A

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON CARBIDE

Maximum Turn Off Time (toff):

66 ns

Maximum Turn On Time (ton):

66 ns

Trade Compliance

NTBG040N120SC1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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