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NLX2G16CMX1TCG

Onsemi

NLX2G16CMX1TCG by Onsemi

NLX2G16CMX1TCG by Onsemi is a Logic Gates IC with 10.2ns Propagation Delay, suitable for military applications. It operates at 1.65-5.5V, has 6 terminals in a small outline package, and can handle up to 4A current output.

Median Price

$0.132

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 319,250 parts In-Stock

1+ parts

-

100+ parts

$0.132

1k+ parts

$0.110

10k+ parts

$0.098

319,250

-

$0.132

$0.110

$0.098

Avnet

USA . 319,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.120

10k+ parts

$0.110

319,250

-

-

$0.120

$0.110

Verical

USA . 277,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

$0.165

277,250

-

-

-

$0.165

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,492 parts In-Stock

1+ parts

$0.103

100+ parts

-

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2,492

$0.103

-

-

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Vyrian

USA . 8,482 parts In-Stock

1+ parts

-

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8,482

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R&J Components

USA . 3,000 parts In-Stock

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-

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3,000

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-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,392 parts In-Stock

1+ parts

$0.097

100+ parts

-

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2,392

$0.097

-

-

-

Vigor

Singapore . 630 parts In-Stock

1+ parts

$0.100

100+ parts

-

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630

$0.100

-

-

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Corohmni

South Africa . 384 parts In-Stock

1+ parts

$0.108

100+ parts

-

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384

$0.108

-

-

-

Component Stockers USA

USA . 243,986 parts In-Stock

1+ parts

$0.110

100+ parts

$0.100

1k+ parts

$0.090

10k+ parts

$0.090

243,986

$0.110

$0.100

$0.090

$0.090

AZTECH Wire

Italy . 277 parts In-Stock

1+ parts

$13.620

100+ parts

-

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277

$13.620

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Continental Prestige Electronics

USA . 319,250 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

$0.094

10k+ parts

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319,250

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-

$0.094

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Kulean Microsystems

USA . 7,480 parts In-Stock

1+ parts

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7,480

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Perfect Parts

USA . 6,568 parts In-Stock

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6,568

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TANS Electronics

Latvia . 6,340 parts In-Stock

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6,340

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SupplyDigital Components

Austria . 4,202 parts In-Stock

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4,202

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

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4,000

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Problanco Electronics

Mexico . 3,419 parts In-Stock

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3,419

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Microchip USA

USA . 456 parts In-Stock

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456

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UHIMA Technologies

Türkiye . 96 parts In-Stock

1+ parts

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96

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Overview

Discover the NLX2G16CMX1TCG by Onsemi, a high-quality logic gate that offers fast propagation delay and low power consumption. With Onsemi's reputation for excellence in semiconductor manufacturing, this product delivers reliable performance in a compact package. Ideal for a wide range of applications, this logic gate is designed to meet the demands of today's technology-driven world. Upgrade your circuit designs with the NLX2G16CMX1TCG and experience enhanced efficiency and functionality.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 10.2 ns

Low propagation delay ensures fast data processing, making this product suitable for high-speed applications.

Surface Mount: YES

Surface mount technology allows for efficient and compact PCB design, saving space and making installation easier.

No. of Functions: 2

Having multiple functions in one component reduces the need for additional logic gates, simplifying circuit design.

Nominal Supply Voltage / Vsup (V): 2.3

Operating at a moderate supply voltage of 2.3V makes this product energy-efficient and suitable for various applications.

Load Capacitance (CL): 15 pF

Low load capacitance means the gate can drive capacitive loads efficiently, ensuring stable operation in different circuit configurations.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this product reliable and efficient.

Maximum Seated Height: 0.4 mm

The ultra-thin profile of this product allows for compact and slim PCB designs, ideal for space-constrained applications.

Technical Specifications

Logic Gates NLX2G16CMX1TCG attributes and parameters. Explore more Logic Gates devices from Onsemi

Specs

Family:

2G

JESD-30 Code:

S-XDSO-N6

JESD-609 Code:

e4

Length:

1 mm

Load Capacitance (CL):

15 pF

Logic IC Type:

Maximum I (ol):

4 Amp

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Inputs:

1

No. of Terminals:

6

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

SOLCC6,.04,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Power Supplies (V):

1.8/5

Propagation Delay At Nominal Supply:

10.2 ns

Propagation Delay (tpd):

10.2 ns

Qualification:

Not Qualified

Schmitt Trigger:

NO

Maximum Seated Height:

.4 mm

Sub-Category:

Gates

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage / Vsup (V):

2.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.35 mm

Terminal Position:

DUAL

Width:

1 mm

Trade Compliance

NLX2G16CMX1TCG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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