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NLVSX5004MN1TXG

Onsemi

NLVSX5004MN1TXG by Onsemi

NLVSX5004MN1TXG by Onsemi is an AEC-Q100 compliant interface IC with a supply voltage range of 0.9V to 4.5V, suitable for automotive applications. It features a compact chip carrier package with 14 terminals and operates in temperatures ranging from -40 °C to 125°C. The terminal finish is nickel palladium gold, making it ideal for surface mount assembly processes.

Median Price

$0.690

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,379 parts In-Stock

1+ parts

-

100+ parts

$0.677

1k+ parts

$0.562

10k+ parts

$0.501

1,379

-

$0.677

$0.562

$0.501

Verical

USA . 1,379 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.703

10k+ parts

-

1,379

-

-

$0.703

-

Distributors (In-Stock)

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Digiode

USA . 1,979 parts In-Stock

1+ parts

$0.528

100+ parts

-

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1,979

$0.528

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Flip Electronics

USA . 103,548 parts In-Stock

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103,548

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Vyrian

USA . 3,706 parts In-Stock

1+ parts

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3,706

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Distributors (Availability)

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Corphita

USA . 663 parts In-Stock

1+ parts

$0.500

100+ parts

-

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663

$0.500

-

-

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Corohmni

South Africa . 102 parts In-Stock

1+ parts

$0.556

100+ parts

-

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102

$0.556

-

-

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AZTECH Wire

Italy . 358 parts In-Stock

1+ parts

$17.280

100+ parts

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358

$17.280

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Problanco Electronics

Mexico . 7,015 parts In-Stock

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7,015

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Kulean Microsystems

USA . 4,397 parts In-Stock

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4,397

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SupplyDigital Components

Austria . 3,695 parts In-Stock

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3,695

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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TANS Electronics

Latvia . 2,739 parts In-Stock

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2,739

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UHIMA Technologies

Türkiye . 830 parts In-Stock

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830

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Microchip USA

USA . 359 parts In-Stock

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359

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Overview

Discover the ultimate solution for your interface IC needs with the NLVSX5004MN1TXG by Onsemi. Manufactured to the highest quality standards, this innovative product offers unparalleled reliability and performance. Ideal for automotive applications and beyond, this chip carrier boasts a compact design and wide operating temperature range. Say goodbye to compatibility issues and hello to seamless integration with the NLVSX5004MN1TXG. Elevate your projects with this cutting-edge interface circuit today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/epoxy material provides durability and reliability for long-term use.

Surface Mount: YES

Allows for easy and efficient PCB assembly.

Maximum Supply Voltage: 4.5 V

Can handle higher voltage inputs, suitable for a variety of applications.

Screening Level: AEC-Q100

Meets automotive industry quality standards, ensuring reliability in automotive applications.

Package Shape: SQUARE

Square shape allows for efficient use of space on the PCB.

No. of Terminals: 14

Provides multiple connection points for versatile system integration.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Varied package styles offer flexibility in design and heat dissipation.

Minimum Supply Voltage: 0.9 V

Low minimum supply voltage enables energy-efficient operation.

Maximum Operating Temperature: 125 °C

Can withstand high operating temperatures, suitable for harsh environments.

Minimum Operating Temperature: -40 °C

Wide temperature range allows for reliable operation in extreme conditions.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold finish ensures good conductivity and corrosion resistance.

Terminal Position: QUAD

Quad terminal position allows for stable connections.

Maximum Seated Height: 1 mm

Low seated height enables compact designs.

Width: 3.5 mm

Narrow width allows for space-saving PCB layout.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for efficient soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature capability ensures proper soldering.

Length: 3.5 mm

Compact length saves space on the PCB.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates suitability for automotive applications.

Terminal Form: NO LEAD

Lead-free terminal form complies with environmental regulations.

Terminal Pitch: 0.5 mm

Compact terminal pitch enables high-density integration on the PCB.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuits, ensuring optimal performance.

Technical Specifications

Other Function Interface ICs NLVSX5004MN1TXG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N14

JESD-609 Code:

e4

Length:

3.5 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.5 mm

Trade Compliance

NLVSX5004MN1TXG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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