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NLVSXN5004MN1TWG

Onsemi

NLVSXN5004MN1TWG by Onsemi

NLVSXN5004MN1TWG by Onsemi is a 14-terminal interface IC with a max supply voltage of 4.5V and operating temperature range from -40 to 125 °C. Designed for automotive applications, it features a chip carrier package style and AEC-Q100 screening level for robust performance in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

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Vyrian

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Kulean Microsystems

USA . 4,430 parts In-Stock

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SupplyDigital Components

Austria . 3,436 parts In-Stock

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TANS Electronics

Latvia . 2,177 parts In-Stock

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UHIMA Technologies

Türkiye . 541 parts In-Stock

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Corphita

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Corohmni

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Problanco Electronics

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Overview

Enhance your automotive electronic systems with the NLVSXN5004MN1TWG by Onsemi. Known for their superior quality and reliability, Onsemi delivers cutting-edge interface ICs like no other. This chip carrier, heat sink/slug, very thin profile package offers seamless integration into a wide range of applications. From automotive electronics to consumer devices, this AEC-Q100 screening level product ensures optimal performance in any environment. Upgrade your technology with the NLVSXN5004MN1TWG and experience the unmatched value and benefits it brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient assembly onto PCBs, saving time and space.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage ensures compatibility with a wide range of automotive power systems.

Screening Level: AEC-Q100

AEC-Q100 screening ensures the product meets automotive industry reliability standards, making it suitable for harsh environments.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient placement and heat dissipation in automotive electronics systems.

No. of Terminals: 14

Having 14 terminals provides flexibility and connectivity options for interfacing with other components in the system.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures efficient heat dissipation and space-saving design.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage allows for operation in low power automotive systems, increasing efficiency.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in hot automotive engine compartments.

Minimum Operating Temperature: -40 °C

The wide temperature range of -40 to 125 °C ensures operation in extreme cold and hot conditions.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection for interfacing with other components.

Maximum Seated Height: 1 mm

The low maximum seated height allows for compact and space-saving designs in automotive electronics systems.

Width: 3 mm

The narrow width of 3 mm allows for efficient placement and routing on PCBs.

Length: 2.5 mm

The small length of 2.5 mm contributes to the overall compactness and space-saving design of the product.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade ensures the product can withstand the temperature variations and demands of automotive applications.

Terminal Form: NO LEAD

The no-lead terminal form eliminates the risk of lead-related issues and ensures environmental compliance.

Terminal Pitch: 0.5 mm

The small terminal pitch of 0.5 mm allows for high-density packaging and efficient use of space on PCBs.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit integration simplifies system design and enhances communication between different components in automotive electronics.

Technical Specifications

Other Function Interface ICs NLVSXN5004MN1TWG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N14

Length:

2.5 mm

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

NLVSXN5004MN1TWG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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