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NLVSX5004MN1TWG

Onsemi

NLVSX5004MN1TWG by Onsemi

NLVSX5004MN1TWG by Onsemi is a quad interface IC with 14 terminals, suitable for automotive applications. It operates b/w -40 to 125 °C and supports a supply voltage range of 0.9V to 4.5V. This chip carrier has a very thin profile, making it ideal for surface mount installations.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,727 parts In-Stock

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Vyrian

USA . 1,592 parts In-Stock

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1,592

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Problanco Electronics

Mexico . 6,048 parts In-Stock

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SupplyDigital Components

Austria . 5,027 parts In-Stock

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TANS Electronics

Latvia . 3,651 parts In-Stock

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Kulean Microsystems

USA . 2,969 parts In-Stock

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UHIMA Technologies

Türkiye . 743 parts In-Stock

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Corphita

USA . 695 parts In-Stock

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695

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Corohmni

South Africa . 293 parts In-Stock

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Overview

Enhance your product line with the NLVSX5004MN1TWG by Onsemi, a top-quality Other Function Interface IC that delivers unmatched performance and reliability. Manufactured by the renowned Onsemi brand, this chip carrier with a heat sink/slug package style offers a wide range of automotive applications. With a low supply voltage and high operating temperature, this interface circuit is designed to optimize efficiency and functionality. Elevate your projects with the NLVSX5004MN1TWG and experience the value and benefits it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the IC, ensuring reliable performance in various environments.

Surface Mount: YES

Being surface mount compatible allows for easy installation and compact PCB design, making it suitable for space-constrained applications.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage tolerance of 4.5 V provides flexibility in power supply options and compatibility with a wide range of systems.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the IC meets automotive quality standards, making it reliable for use in automotive applications where extreme conditions may be present.

Maximum Operating Temperature: 125 °C

With a maximum operating temperature of 125 °C, this IC can withstand high temperature environments without compromising its performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C ensures that the IC can function effectively in cold conditions, making it versatile for various temperature environments.

Width: 3 mm

The compact width of 3 mm allows for efficient use of PCB real estate, making it ideal for applications where space is limited.

Length: 2.5 mm

The small length of 2.5 mm contributes to the overall compact size of the IC, enabling it to be used in compact electronic devices or systems.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification indicates that the IC is suitable for use in automotive applications, ensuring reliability and performance in automotive systems.

Terminal Form: NO LEAD

The no-lead terminal form reduces the risk of solder joint cracking and improves reliability, making the IC suitable for applications where durability is essential.

Interface IC Type: INTERFACE CIRCUIT

The interface circuit type indicates that the IC is specifically designed for interfacing with other components or systems, making it a specialized solution for interface-related applications.

Technical Specifications

Other Function Interface ICs NLVSX5004MN1TWG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N14

Length:

2.5 mm

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3 mm

Trade Compliance

NLVSX5004MN1TWG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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