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NLVSV2T244DMR2G

Onsemi

NLVSV2T244DMR2G by Onsemi

NLVSV2T244DMR2G by Onsemi is an 8-terminal interface IC with a max supply voltage of 4.5V and min of 0.9V, suitable for industrial applications. It operates b/w -40 to 85 °C, has dual terminal position in gull wing form, and meets AEC-Q100 screening standards. Ideal for compact designs requiring small outline package style with thin profile.

Median Price

$0.714

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 230 parts In-Stock

1+ parts

-

100+ parts

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$0.714

230

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$0.714

Distributors (In-Stock)

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Flip Electronics

USA . 4,000 parts In-Stock

1+ parts

$1.200

100+ parts

-

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4,000

$1.200

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Digiode

USA . 254 parts In-Stock

1+ parts

$1.615

100+ parts

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254

$1.615

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Chip Stock

USA . 80,000 parts In-Stock

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80,000

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Vyrian

USA . 11,926 parts In-Stock

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11,926

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vigor

Singapore . 225 parts In-Stock

1+ parts

$0.860

100+ parts

-

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225

$0.860

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Ampacity Inc.

Singapore . 88 parts In-Stock

1+ parts

$1.440

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88

$1.440

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Corphita

USA . 2,051 parts In-Stock

1+ parts

$1.530

100+ parts

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2,051

$1.530

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Corohmni

South Africa . 208 parts In-Stock

1+ parts

$1.700

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208

$1.700

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Microchip USA

USA . 8,029 parts In-Stock

1+ parts

$5.315

100+ parts

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8,029

$5.315

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SupplyDigital Components

Austria . 7,907 parts In-Stock

1+ parts

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7,907

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TANS Electronics

Latvia . 5,882 parts In-Stock

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5,882

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Problanco Electronics

Mexico . 5,695 parts In-Stock

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5,695

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Component Stockers USA

USA . 5,420 parts In-Stock

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5,420

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Kulean Microsystems

USA . 688 parts In-Stock

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688

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UHIMA Technologies

Türkiye . 124 parts In-Stock

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124

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Overview

Elevate your electronic designs with the NLVSV2T244DMR2G by Onsemi, a top-of-the-line Interface IC that offers unparalleled quality and reliability. Manufactured by Onsemi, a trusted name in the industry, this product is perfect for a wide range of applications. With its advanced features and innovative design, customers can expect seamless performance and enhanced functionality. Experience the value and benefits of this product firsthand and take your projects to the next level. Choose Onsemi for superior quality and exceptional results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides good protection for the internal components of the IC, making it reliable for long-term use.

Surface Mount: YES

Being surface mountable makes installation easier and ensures a secure connection, improving overall performance.

Maximum Supply Voltage: 4.5 V

With a high maximum supply voltage, this IC can handle a wide range of power sources, making it versatile for various applications.

No. of Functions: 2

Having multiple functions in a single IC allows for more efficient use of space and resources, making it cost-effective.

Screening Level: AEC-Q100

This screening level ensures high reliability and quality, making it suitable for automotive applications where rigorous standards are required.

Package Shape: SQUARE

The square shape of the package allows for efficient use of space on a circuit board, maximizing the IC's functionality within a compact design.

No. of Terminals: 8

Having multiple terminals enables a secure connection with other components, reducing the likelihood of signal interference or loss.

Package Style: SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

This package style offers a slim design and reduces the overall footprint on the circuit board, ideal for applications where space is limited.

Minimum Supply Voltage: 0.9 V

With a low minimum supply voltage, this IC can operate efficiently even with lower power sources, increasing its overall versatility.

Maximum Operating Temperature: 85 °C

The high maximum operating temperature ensures the IC can perform reliably even in harsh environments or under heavy loads.

Minimum Operating Temperature: -40 °C

With a wide range of operating temperatures, this IC can function in extreme cold conditions, making it suitable for a variety of environments.

Terminal Finish: MATTE TIN

The matte tin finish provides a stable and reliable connection, ensuring good conductivity and reducing the risk of signal loss or interference.

Terminal Position: DUAL

Having dual terminal positions allows for flexibility in installation and connection options, making it adaptable to various circuit board layouts.

Maximum Seated Height: 1.1 mm

The low seated height of the IC minimizes the overall profile of the circuit board, which is important for space-constrained applications.

Width: 3 mm

With a compact width, this IC can be easily integrated into a variety of circuit board designs without taking up excessive space.

Maximum Time At Peak Reflow Temperature (s): 30

This IC can withstand high reflow temperatures for a longer duration, ensuring a reliable solder connection during manufacturing.

Peak Reflow Temperature °C: 260

The high peak reflow temperature tolerance ensures that this IC can go through the soldering process without being damaged, resulting in a reliable connection.

Length: 3 mm

With a compact length, this IC can fit into tight spaces on a circuit board, allowing for more efficient use of available space.

Temperature Grade: INDUSTRIAL

The industrial temperature grade ensures that this IC can withstand a wide range of operating temperatures, making it suitable for industrial applications.

Terminal Form: GULL WING

The gull wing terminal form provides a secure and reliable connection to the circuit board, reducing the risk of signal loss or damage during installation.

Nominal Supply Voltage: 3.3 V

With a stable nominal supply voltage, this IC can maintain consistent performance over a range of operating conditions, ensuring reliable operation.

Terminal Pitch: 0.65 mm

The small terminal pitch allows for a high density of connections within a small area, maximizing the functionality of the IC within a compact design.

Interface IC Type: INTERFACE CIRCUIT

As an interface circuit IC, this product facilitates communication between different components in a system, making it essential for seamless operation.

Technical Specifications

Other Function Interface ICs NLVSV2T244DMR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PDSO-G8

JESD-609 Code:

e3

Length:

3 mm

Moisture Sensitivity Level (MSL):

1

No. of Functions:

2

No. of Terminals:

8

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

1.1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3 mm

Trade Compliance

NLVSV2T244DMR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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