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NLVSX5004MUTAG

Onsemi

NLVSX5004MUTAG by Onsemi

NLVSX5004MUTAG by Onsemi is a 12-terminal interface IC with a supply voltage range of 0.9V to 4.5V, suitable for automotive applications. It features a chip carrier package style, nickel gold palladium terminal finish, and operates in temperatures ranging from -40 °C to 125°C. Ideal for surface mount assembly with a compact size of 2mm x 1.7mm and terminal pitch of 0.4mm.

Median Price

$0.862

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 652,602 parts In-Stock

1+ parts

-

100+ parts

$0.847

1k+ parts

$0.703

10k+ parts

$0.627

652,602

-

$0.847

$0.703

$0.627

Verical

USA . 649,117 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.878

10k+ parts

$0.783

649,117

-

-

$0.878

$0.783

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 409 parts In-Stock

1+ parts

$0.659

100+ parts

-

1k+ parts

-

10k+ parts

-

409

$0.659

-

-

-

ComSIT Distribution GmbH

Germany . 164,250 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

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164,250

-

-

-

-

Vyrian

USA . 4,618 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,618

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 88 parts In-Stock

1+ parts

$0.625

100+ parts

-

1k+ parts

-

10k+ parts

-

88

$0.625

-

-

-

Corohmni

South Africa . 378 parts In-Stock

1+ parts

$0.694

100+ parts

-

1k+ parts

-

10k+ parts

-

378

$0.694

-

-

-

Vigor

Singapore . 350 parts In-Stock

1+ parts

$0.750

100+ parts

-

1k+ parts

-

10k+ parts

-

350

$0.750

-

-

-

AZTECH Wire

Italy . 699 parts In-Stock

1+ parts

$18.350

100+ parts

-

1k+ parts

-

10k+ parts

-

699

$18.350

-

-

-

Perfect Parts

USA . 9,968 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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9,968

-

-

-

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Kulean Microsystems

USA . 7,938 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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7,938

-

-

-

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SupplyDigital Components

Austria . 4,708 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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4,708

-

-

-

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Problanco Electronics

Mexico . 3,948 parts In-Stock

1+ parts

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100+ parts

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3,948

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-

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Futuretech Components

Singapore . 3,000 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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3,000

-

-

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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3,000

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-

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TANS Electronics

Latvia . 2,754 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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2,754

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-

-

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UHIMA Technologies

Türkiye . 469 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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469

-

-

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Microchip USA

USA . 299 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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10k+ parts

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299

-

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-

-

Overview

Enhance your automotive applications with the NLVSX5004MUTAG by Onsemi, a high-quality interface IC designed to optimize performance and reliability. Manufactured with precision and expertise, this product offers unparalleled value and benefits to customers seeking seamless integration and functionality in their devices. With a wide range of applications in automotive systems, this chip carrier with a very thin profile ensures maximum efficiency and durability, making it the perfect solution for your interface circuit needs. Experience the advantage of superior technology and innovation with the NLVSX5004MUTAG from Onsemi.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of durable and lightweight plastic/epoxy material ensures the product is resistant to harsh environments and offers reliable performance.

Surface Mount: YES

Being surface mountable makes installation easy and efficient, saving time and effort during assembly.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage allows for versatile application in various circuits without the risk of overloading.

Screening Level: AEC-Q100

Meeting the AEC-Q100 standard ensures that the product is designed for automotive applications and adheres to strict quality requirements.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on PCBs and enables easy integration into tight layouts.

No. of Terminals: 12

Having 12 terminals provides ample connectivity options, making the product suitable for complex circuit designs.

Package Style (Meter): CHIP CARRIER, VERY THIN PROFILE

The thin profile chip carrier design saves space on the PCB and promotes thermal efficiency for optimal performance.

Minimum Supply Voltage: 0.9 V

With a low minimum supply voltage, the product can operate efficiently even in low power environments.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures the product can withstand elevated heat conditions without compromising performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature allows the product to function reliably in cold environments or during temperature fluctuations.

Terminal Finish: NICKEL GOLD PALLADIUM

The use of nickel, gold, and palladium terminal finish provides excellent corrosion resistance and ensures long-term durability.

Terminal Position: QUAD

The quad terminal position offers enhanced stability and connectivity for the product, making it suitable for demanding applications.

Maximum Seated Height: 0.55 mm

The low maximum seated height allows for compact and slim device designs, ideal for space-constrained applications.

Width: 1.7 mm

The narrow width of 1.7 mm enables the product to fit into tight spaces on the PCB, offering flexibility in layout design.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature of 30 seconds ensures efficient soldering during assembly, reducing the risk of heat damage.

Peak Reflow Temperature °C: 260

The high peak reflow temperature of 260 °C supports reliable soldering and ensures robust joint connections.

Length: 2 mm

The compact length of 2 mm allows for space-saving installation on the PCB while maintaining the required functionality.

Temperature Grade: AUTOMOTIVE

Designed for automotive applications, the product meets stringent temperature requirements and is suitable for use in automotive electronics.

Terminal Form: NO LEAD

The lead-free terminal form is environmentally friendly and complies with regulations while offering reliable electrical connections.

Terminal Pitch: 0.4 mm

The tight terminal pitch of 0.4 mm enables high-density mounting and enhances connectivity options for intricate circuit designs.

Interface IC Type: INTERFACE CIRCUIT

Being designed as an interface circuit IC, this product facilitates communication between different components, making it an essential part of electronic systems.

Technical Specifications

Other Function Interface ICs NLVSX5004MUTAG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N12

Length:

2 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12,.07X.08,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

260

Screening Level:

AEC-Q100

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL GOLD PALLADIUM

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

1.7 mm

Trade Compliance

NLVSX5004MUTAG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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