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NLVSXN5004MN1TXG

Onsemi

NLVSXN5004MN1TXG by Onsemi

NLVSXN5004MN1TXG by Onsemi is an AEC-Q100 compliant interface IC with a supply voltage range of 0.9V to 4.5V, ideal for automotive applications. This chip carrier package has 14 terminals and operates in temperatures ranging from -40 °C to 125°C, making it suitable for harsh environments. With a very thin profile and no-lead terminal form, it offers high reliability and performance in automotive electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,212 parts In-Stock

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Digiode

USA . 1,085 parts In-Stock

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Kulean Microsystems

USA . 7,303 parts In-Stock

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SupplyDigital Components

Austria . 6,256 parts In-Stock

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Problanco Electronics

Mexico . 1,115 parts In-Stock

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TANS Electronics

Latvia . 1,068 parts In-Stock

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Corphita

USA . 589 parts In-Stock

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Corohmni

South Africa . 473 parts In-Stock

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UHIMA Technologies

Türkiye . 288 parts In-Stock

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Overview

Enhance your automotive electronic systems with the NLVSXN5004MN1TXG by Onsemi, a cutting-edge interface circuit designed to deliver top-notch performance and reliability. Manufactured by industry leader Onsemi, this product boasts superior quality and durability, making it an ideal choice for a wide range of applications in the automotive sector. With a wide operating temperature range and high supply voltage tolerance, this chip carrier package offers unmatched value and benefits for customers seeking innovative solutions for their interface IC needs. Experience the advantages of Onsemi's expertise with the NLVSXN5004MN1TXG and elevate your electronic designs to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and resistance to environmental factors, making it suitable for automotive applications.

Surface Mount: YES

Saves space on the PCB and allows for automated assembly, reducing manufacturing cost and time.

Maximum Supply Voltage: 4.5 V

Can handle a relatively high supply voltage, increasing versatility in different applications.

Screening Level: AEC-Q100

Meets automotive industry reliability standards, ensuring stable performance in harsh operating conditions.

Package Shape: SQUARE

Square package shape is compact and efficient for space-saving designs.

No. of Terminals: 14

Provides enough connectivity options for various interfacing requirements.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Versatile package styles allow for efficient heat dissipation and slim form factor designs.

Minimum Supply Voltage: 0.9 V

Can operate at low supply voltages, suitable for battery-powered applications.

Maximum Operating Temperature: 125 °C

Can withstand high temperatures, making it suitable for automotive applications where temperature can vary.

Minimum Operating Temperature: -40 °C

Operates in freezing temperatures, suitable for automotive applications in cold climates.

Terminal Position: QUAD

Quad terminal position provides stable connectivity and ease of PCB layout.

Maximum Seated Height: 1 mm

Low profile package design helps save space and allows for compact device designs.

Width: 3.5 mm

Compact width allows for efficient use of board space.

Length: 3.5 mm

Square shape with equal length and width facilitates uniform layout on the PCB.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry temperature standards for reliable performance in automotive applications.

Terminal Form: NO LEAD

Lead-free terminals comply with RoHS regulations for environmental sustainability.

Terminal Pitch: 0.5 mm

Fine terminal pitch allows for high-density circuit designs, suitable for compact devices.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interfacing applications, ensuring optimal signal transmission and processing.

Technical Specifications

Other Function Interface ICs NLVSXN5004MN1TXG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N14

Length:

3.5 mm

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

NLVSXN5004MN1TXG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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