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NLVSX5004DTR2G

Onsemi

NLVSX5004DTR2G by Onsemi

NLVSX5004DTR2G by Onsemi is a 14-terminal IC with max supply voltage of 4.5V and min of 0.9V. With AEC-Q100 screening, it operates in automotive grade applications at temp range -40 to 125 °C, making it ideal for interface circuits in automotive electronics.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,350 parts In-Stock

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Vyrian

USA . 913 parts In-Stock

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SupplyDigital Components

Austria . 6,640 parts In-Stock

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Kulean Microsystems

USA . 6,129 parts In-Stock

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Corphita

USA . 1,744 parts In-Stock

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Problanco Electronics

Mexico . 1,515 parts In-Stock

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UHIMA Technologies

Türkiye . 717 parts In-Stock

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TANS Electronics

Latvia . 481 parts In-Stock

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Corohmni

South Africa . 276 parts In-Stock

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Overview

Elevate your automotive electronics with the NLVSX5004DTR2G by Onsemi. Manufactured with precision and expertise, this interface IC offers unparalleled quality and reliability for a wide range of applications. With its compact package style and advanced features, this product delivers exceptional performance while ensuring seamless integration into your design. Trust in Onsemi's reputation for excellence and elevate your projects with the NLVSX5004DTR2G. Experience the value and benefits that only Onsemi can provide.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Lightweight and durable material, suitable for various environmental conditions

Surface Mount: YES

Ease of integration onto circuit boards without the need for additional connectors

Maximum Supply Voltage: 4.5 V

Can handle higher voltage inputs for versatile application use

Screening Level: AEC-Q100

Meets automotive industry quality standards for reliability and performance

Package Shape: RECTANGULAR

Space-efficient design for compact electronic devices

No. of Terminals: 14

Sufficient number of connection points for various input/output requirements

Package Style (Meter): SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Compact size with minimal footprint, suitable for space-constrained applications

Minimum Supply Voltage: 0.9 V

Low power consumption for energy-efficient operation

Maximum Operating Temperature: 125 °C

Can withstand high temperature environments for extended use

Minimum Operating Temperature: -40 °C

Capable of operating in extreme cold conditions without performance impact

Terminal Position: DUAL

Provides redundancy and flexibility for connecting to external devices

Maximum Seated Height: 1.2 mm

Low profile design for slim electronic devices or applications with space constraints

Width: 4.4 mm

Narrow form factor for efficient use of board space

Length: 5 mm

Compact size for integration into small electronic devices

Temperature Grade: AUTOMOTIVE

Suitable for automotive applications where temperature fluctuations are common

Terminal Form: GULL WING

Secure and reliable connection to circuit boards

Terminal Pitch: 0.65 mm

Fine pitch design for high-density mounting and space savings

Interface IC Type: INTERFACE CIRCUIT

Specifically designed for interface circuit applications, ensuring compatibility and performance

Technical Specifications

Other Function Interface ICs NLVSX5004DTR2G attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G14

Length:

5 mm

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1.2 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

4.4 mm

Trade Compliance

NLVSX5004DTR2G Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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