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NLVSXN5004MNTXG

Onsemi

NLVSXN5004MNTXG by Onsemi

NLVSXN5004MNTXG by Onsemi is an interface IC with a max supply voltage of 4.5V, suitable for automotive applications. It features a package style of CHIP CARRIER and operates in temperatures ranging from -40 to 125 °C. With 14 terminals and a terminal pitch of 0.5mm, it offers a compact solution for various electronic systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 2,294 parts In-Stock

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Digiode

USA . 515 parts In-Stock

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515

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Kulean Microsystems

USA . 4,397 parts In-Stock

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4,397

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TANS Electronics

Latvia . 2,605 parts In-Stock

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Problanco Electronics

Mexico . 1,213 parts In-Stock

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SupplyDigital Components

Austria . 683 parts In-Stock

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Corohmni

South Africa . 309 parts In-Stock

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Corphita

USA . 282 parts In-Stock

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UHIMA Technologies

Türkiye . 136 parts In-Stock

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Overview

Experience seamless connectivity and enhanced functionality with the NLVSXN5004MNTXG by Onsemi. Crafted with precision and quality in mind, this interface IC offers unrivaled performance in a compact chip carrier package. Whether you're looking to improve automotive applications or streamline industrial processes, this versatile product is designed to exceed expectations. Trust in Onsemi's reputation for reliability and innovation, and unlock the endless possibilities that the NLVSXN5004MNTXG has to offer. Elevate your projects with this cutting-edge solution today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product durable and resistant to external elements, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable reduces the need for additional components and simplifies the assembly process, making it a convenient choice for manufacturing.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage enables the product to handle higher power requirements, increasing its versatility in various applications.

Screening Level: AEC-Q100

Compliance with AEC-Q100 ensures that the product meets automotive quality standards, making it suitable for use in automotive applications where reliability is crucial.

Package Shape: SQUARE

The square package shape allows for easy placement on circuit boards and efficient use of space, making it a practical choice for compact designs.

No. of Terminals: 14

Having 14 terminals provides ample connectivity options, allowing for versatile integration into different circuit configurations.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles offers efficient heat dissipation and space-saving benefits, making it an ideal solution for tight spaces.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage requirement allows for operation in low-power scenarios, ensuring energy efficiency and compatibility with a wide range of power sources.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, the product can withstand harsh environmental conditions and extended use without overheating, ensuring reliable performance.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature enables the product to operate in extreme cold conditions, making it suitable for use in a variety of environments.

Terminal Position: QUAD

The quad terminal position provides a stable and secure connection, reducing the risk of signal loss or disconnection in high-vibration environments.

Maximum Seated Height: 1 mm

The low maximum seated height allows for a slim and compact design, enabling the product to be easily integrated into space-constrained applications.

Width: 3.5 mm

The narrow width makes the product suitable for use in small electronic devices and allows for efficient use of PCB space.

Length: 3.5 mm

The compact length enables the product to fit comfortably within limited space constraints, making it a versatile choice for miniaturized designs.

Temperature Grade: AUTOMOTIVE

Having an automotive temperature grade ensures that the product can withstand rugged automotive environments, making it a reliable choice for automotive applications.

Terminal Form: NO LEAD

The no-lead terminal form simplifies the assembly process and reduces the risk of solder joint failure, enhancing the reliability of the product.

Terminal Pitch: 0.5 mm

With a fine terminal pitch of 0.5 mm, the product offers high-density connectivity options, enabling complex circuit designs in a compact form factor.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit IC type, the product facilitates communication between different components, making it a versatile choice for integrating various functions in a system.

Technical Specifications

Other Function Interface ICs NLVSXN5004MNTXG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

S-PQCC-N14

Length:

3.5 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14/18,.14SQ,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

3.5 mm

Trade Compliance

NLVSXN5004MNTXG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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