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ISO7220CD

Texas Instruments

ISO7220CD by Texas Instruments

ISO7220CD by Texas Instruments is a dual-channel interface IC with CMOS technology. It operates b/w -40 to 125°C, suitable for automotive applications. With a supply voltage range of 2.8V to 5V and small outline package style, it offers reliable performance in various electronic systems.

Median Price

$3.620

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 13 parts In-Stock

1+ parts

$0.682

100+ parts

-

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13

$0.682

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Chip1Stop

Japan . 13 parts In-Stock

1+ parts

$2.990

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13

$2.990

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Mouser Electronics

USA . 1,115 parts In-Stock

1+ parts

$4.250

100+ parts

$3.140

1k+ parts

$2.670

10k+ parts

$2.480

1,115

$4.250

$3.140

$2.670

$2.480

RS (Exports)

UK . 4 parts In-Stock

1+ parts

$4.416

100+ parts

$2.888

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-

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4

$4.416

$2.888

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Verical

USA . 13 parts In-Stock

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13

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Distributors (In-Stock)

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Digiode

USA . 2,050 parts In-Stock

1+ parts

$1.361

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2,050

$1.361

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Nova Conductors

Japan . 300 parts In-Stock

1+ parts

$2.152

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300

$2.152

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Chip Stock

USA . 14,450 parts In-Stock

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14,450

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Vyrian

USA . 194 parts In-Stock

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Rebound Electronics

UK . 100 parts In-Stock

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100

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Cogito LLC

Ukraine . 10 parts In-Stock

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Cyclops Electronics Ltd

UK . 10 parts In-Stock

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10

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Ampacity Inc.

Singapore . 194 parts In-Stock

1+ parts

$1.170

100+ parts

-

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194

$1.170

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Semicontronic

India . 194 parts In-Stock

1+ parts

$1.170

100+ parts

$1.141

1k+ parts

$1.135

10k+ parts

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194

$1.170

$1.141

$1.135

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Corphita

USA . 1,170 parts In-Stock

1+ parts

$1.290

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1,170

$1.290

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Argo Parts USA

USA . 1,848 parts In-Stock

1+ parts

$2.152

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1,848

$2.152

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Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.152

100+ parts

-

1k+ parts

$2.045

10k+ parts

$2.002

1,000

$2.152

-

$2.045

$2.002

Continental Prestige Electronics

USA . 472 parts In-Stock

1+ parts

$2.152

100+ parts

-

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$2.109

472

$2.152

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-

$2.109

Corohmni

South Africa . 67 parts In-Stock

1+ parts

$3.361

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67

$3.361

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Parana Technologies

USA . 1,343 parts In-Stock

1+ parts

$8.372

100+ parts

$777.489

1k+ parts

$7.535

10k+ parts

-

1,343

$8.372

$777.489

$7.535

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DigiPath Technology Company

USA . 58 parts In-Stock

1+ parts

$9.219

100+ parts

$8.481

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58

$9.219

$8.481

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ChromeModa Solutions

Germany . 6,303 parts In-Stock

1+ parts

$9.407

100+ parts

$7.714

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6,303

$9.407

$7.714

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IDEA Electronic Components Group

UK . 1,828 parts In-Stock

1+ parts

$9.407

100+ parts

$8.937

1k+ parts

$8.466

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1,828

$9.407

$8.937

$8.466

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Advanced Electronics

New Zealand . 450 parts In-Stock

1+ parts

$14.355

100+ parts

$13.637

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$13.637

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450

$14.355

$13.637

$13.637

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iodParts Technologies Inc.

India . 34,326 parts In-Stock

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Lixinc

USA . 17,240 parts In-Stock

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Alle Elektronik GmbH

Germany . 5,040 parts In-Stock

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Robosynatics

Brazil . 150 parts In-Stock

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Lucentia Tech

USA . 150 parts In-Stock

1+ parts

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$0.301

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$0.301

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$0.301

150

-

$0.301

$0.301

$0.301

Overview

Unlock a new level of performance and reliability with the Texas Instruments ISO7220CD. Designed with precision and expertise, this interface circuit IC offers unparalleled quality and durability, making it a top choice for a wide range of applications. Whether you're looking to enhance your automotive systems or streamline industrial processes, this product delivers unmatched value and benefits. Trust in Texas Instruments to provide cutting-edge technology that exceeds expectations, choose the ISO7220CD for all your interface circuit needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the product lightweight and durable, ensuring long-term reliability.

Surface Mount: YES

Surface mount technology enables easy and efficient assembly onto circuit boards, saving space and reducing production costs.

Maximum Supply Voltage: 5 V

Support for a maximum supply voltage of 5V ensures compatibility with a wide range of applications.

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various electronic devices and systems.

No. of Terminals: 8

Having 8 terminals provides flexibility in connection options and supports the required functionality.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the circuit board, making it suitable for compact designs.

Minimum Supply Voltage: 2.8 V

Support for a minimum supply voltage of 2.8V ensures efficient power consumption and compatibility with low-power systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures stability and reliability in harsh environmental conditions.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature of -40°C allows the product to function effectively in cold environments.

Terminal Finish: NICKEL PALLADIUM GOLD

Nickel palladium gold terminal finish provides excellent conductivity and corrosion resistance for long-lasting performance.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board layout and facilitates ease of connection.

Maximum Seated Height: 1.75 mm

Low maximum seated height of 1.75mm ensures compatibility with slim and compact device designs.

Width: 3.895 mm

Narrow width of 3.895mm saves space on the circuit board and allows for high-density mounting.

Maximum Time At Peak Reflow Temperature (s): 30

Short maximum time at peak reflow temperature of 30s reduces the risk of heat damage during soldering.

Peak Reflow Temperature °C: 260

High peak reflow temperature of 260°C ensures reliable solder joints and robust thermal performance.

Length: 4.905 mm

Compact length of 4.905mm contributes to the overall small form factor of the product.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade certification ensures the product can withstand the demanding conditions of automotive applications.

No. of Channels: 2

Having 2 channels offers versatility in signal processing and communication capabilities.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, enhancing overall performance.

Terminal Form: GULL WING

Gull wing terminal form simplifies surface mount assembly and provides mechanical strength for reliable connections.

Nominal Supply Voltage: 5 V

Nominal supply voltage of 5V ensures stable operation and compatibility with standard voltage levels.

Terminal Pitch: 1.27 mm

Compact terminal pitch of 1.27mm allows for high-density mounting and efficient use of PCB space.

Interface IC Type: INTERFACE CIRCUIT

Interface circuit type enables seamless communication between different parts of the system, enhancing overall functionality.

Technical Specifications

Other Function Interface ICs ISO7220CD attributes and parameters. Explore more Other Function Interface ICs devices from Texas Instruments

Specs

Interface IC Type:

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

4.905 mm

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

1

No. of Terminals:

8

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Qualification:

Not Qualified

Maximum Seated Height:

1.75 mm

Maximum Supply Voltage:

5 V

Minimum Supply Voltage:

2.8 V

Nominal Supply Voltage:

5 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

3.895 mm

Trade Compliance

ISO7220CD Interface ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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