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NLVSXN5004MUTAG

Onsemi

NLVSXN5004MUTAG by Onsemi

NLVSXN5004MUTAG by Onsemi is a 12-terminal interface IC with a max supply voltage of 4.5V and operating temperature range from -40 to 125 °C. Designed for automotive applications, it features a chip carrier package style and AEC-Q100 screening level, making it suitable for use in various other function interface circuits.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,806 parts In-Stock

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Digiode

USA . 1,712 parts In-Stock

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SupplyDigital Components

Austria . 6,617 parts In-Stock

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Problanco Electronics

Mexico . 6,503 parts In-Stock

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TANS Electronics

Latvia . 5,745 parts In-Stock

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Kulean Microsystems

USA . 926 parts In-Stock

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UHIMA Technologies

Türkiye . 645 parts In-Stock

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Corphita

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Corohmni

South Africa . 302 parts In-Stock

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Overview

Upgrade your electronics with the NLVSXN5004MUTAG by Onsemi, a top-quality interface circuit designed for automotive applications. Manufactured with precision and reliability in mind, this chip carrier offers a very thin profile and 12 terminals for seamless integration. With a wide operating temperature range and AEC-Q100 screening level, this product ensures optimal performance even in extreme conditions. Experience superior functionality and efficient operation with Onsemi's innovative solution. Elevate your projects with the NLVSXN5004MUTAG and unlock endless possibilities today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material provides durability and reliability to the product, making it suitable for automotive applications where robustness is required.

Surface Mount: YES

Surface mount technology makes the product easier to assemble and saves space on the PCB, enhancing the overall efficiency of the system.

Maximum Supply Voltage: 4.5 V

Handling a maximum supply voltage of 4.5V ensures compatibility with a wide range of power sources, increasing the versatility of the product.

Screening Level: AEC-Q100

AEC-Q100 screening ensures that the product meets the stringent quality requirements for automotive electronics, guaranteeing high performance and reliability under harsh operating conditions.

Minimum Operating Temperature: -40 °C

Operating at temperatures as low as -40 °C allows the product to function reliably in extreme cold environments, making it suitable for automotive and industrial applications.

Technical Specifications

Other Function Interface ICs NLVSXN5004MUTAG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N12

Length:

2 mm

No. of Functions:

1

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC12,.07X.08,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

.55 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

1.7 mm

Trade Compliance

NLVSXN5004MUTAG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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