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NLVSXN5004MNTWG

Onsemi

NLVSXN5004MNTWG by Onsemi

NLVSXN5004MNTWG by Onsemi is a 14-terminal interface IC with a supply voltage range of 0.9V to 4.5V, ideal for automotive applications. It features AEC-Q100 screening level, operates b/w -40 °C to 125°C, and has a compact chip carrier package style.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 2,147 parts In-Stock

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Vyrian

USA . 1,912 parts In-Stock

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TANS Electronics

Latvia . 6,525 parts In-Stock

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6,525

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SupplyDigital Components

Austria . 6,306 parts In-Stock

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Kulean Microsystems

USA . 3,719 parts In-Stock

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Corphita

USA . 874 parts In-Stock

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Problanco Electronics

Mexico . 736 parts In-Stock

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Corohmni

South Africa . 282 parts In-Stock

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UHIMA Technologies

Türkiye . 46 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the NLVSXN5004MNTWG by Onsemi, a leading manufacturer in the industry. This cutting-edge product falls under the category of Other Function Interface ICs, offering versatile applications across various sectors. With a maximum supply voltage of 4.5V and AEC-Q100 screening level, this interface circuit ensures optimal performance even in challenging environments. Its innovative design, coupled with a package style of chip carrier and very thin profile, makes it a compact and efficient solution for your needs. Trust Onsemi to deliver superior products that bring unmatched value and benefits to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy package body material makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly on circuit boards, saving time and reducing production costs.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage capability ensures compatibility with various systems and applications, providing flexibility in use.

Screening Level: AEC-Q100

Having AEC-Q100 screening level certification ensures high reliability and quality standards for automotive electronics applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on the PCB, making it easier to integrate into compact designs.

No. of Terminals: 14

Having 14 terminals provides versatility in connectivity options and allows for a wider range of functions to be supported.

Package Style (Meter): CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

The combination of chip carrier, heat sink/slug, and very thin profile package styles ensures effective heat dissipation and compact design, ideal for automotive applications.

Minimum Supply Voltage: 0.9 V

The low minimum supply voltage requirement allows for efficient power consumption and compatibility with lower voltage systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range ensures reliable performance in automotive environments with fluctuating temperature conditions.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature range allows for reliable operation even in extreme cold conditions, making it suitable for automotive use.

Terminal Position: QUAD

The quad terminal position provides stable and secure connections, ensuring reliable signal transmission and system performance.

Maximum Seated Height: 1 mm

The low maximum seated height profile allows for compact integration on the PCB, making it suitable for space-constrained applications.

Width: 2.5 mm

The compact width size enables easy placement on the PCB and efficient use of space in electronic designs.

Length: 3 mm

The short length of the product contributes to a compact form factor, making it ideal for applications where space is limited.

Temperature Grade: AUTOMOTIVE

The automotive temperature grade certification ensures reliable performance in automotive applications, meeting industry standards for quality and durability.

Terminal Form: NO LEAD

The use of no lead terminal form reduces the risk of lead contamination, making it environmentally friendly and compliant with RoHS directives.

Terminal Pitch: 0.5 mm

The small terminal pitch allows for high-density mounting on the PCB, enabling a more compact and efficient circuit design.

Interface IC Type: INTERFACE CIRCUIT

Being an interface circuit type IC, it enables smooth communication between different components and systems, making it a versatile and essential component in electronic devices.

Technical Specifications

Other Function Interface ICs NLVSXN5004MNTWG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N14

Length:

3 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.5 mm

Trade Compliance

NLVSXN5004MNTWG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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