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NLVSX5004MNTWG

Onsemi

NLVSX5004MNTWG by Onsemi

NLVSX5004MNTWG by Onsemi is an interface IC with a max supply voltage of 4.5V, suitable for automotive applications with AEC-Q100 screening. It features a chip carrier package style, operates b/w -40 to 125 °C, and has 14 terminals in a rectangular shape.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 1,460 parts In-Stock

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Digiode

USA . 79 parts In-Stock

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79

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SupplyDigital Components

Austria . 7,886 parts In-Stock

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Problanco Electronics

Mexico . 6,897 parts In-Stock

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Kulean Microsystems

USA . 5,001 parts In-Stock

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Corphita

USA . 800 parts In-Stock

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800

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TANS Electronics

Latvia . 723 parts In-Stock

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UHIMA Technologies

Türkiye . 540 parts In-Stock

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Corohmni

South Africa . 209 parts In-Stock

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Overview

Enhance your automotive electronics with the NLVSX5004MNTWG by Onsemi, a top-quality Interface IC designed to elevate your applications to new heights. With a focus on reliability and performance, Onsemi is known for delivering cutting-edge solutions that meet the highest industry standards. Perfect for a wide range of automotive functions, this product offers unparalleled value, benefits, and advantages to customers seeking seamless integration and superior functionality. Upgrade your projects today with the NLVSX5004MNTWG and experience the difference Onsemi can make in your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides durability and protection to the IC, ensuring a longer lifespan.

Surface Mount: YES

Being surface mountable makes installation easier and saves space on the PCB.

Maximum Supply Voltage: 4.5 V

The high maximum supply voltage allows for versatility in power requirements.

Screening Level: AEC-Q100

Compliance with AEC-Q100 standards ensures high quality and reliability, making it suitable for automotive applications.

Package Shape: RECTANGULAR

Rectangular shape allows for easy placement and soldering on the PCB.

Minimum Operating Temperature: -40 °C

Wide operating temperature range enables the IC to function effectively in extreme cold conditions.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in hot environments.

Interface IC Type: INTERFACE CIRCUIT

Specifically designed as an interface circuit, ensuring efficient communication between different components.

Technical Specifications

Other Function Interface ICs NLVSX5004MNTWG attributes and parameters. Explore more Other Function Interface ICs devices from Onsemi

Specs

Interface IC Type:

JESD-30 Code:

R-PQCC-N14

Length:

3 mm

No. of Functions:

1

No. of Terminals:

14

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

LCC14,.1X.12,20

Package Shape:

Package Style (Meter):

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Peak Reflow Temperature (C):

NOT SPECIFIED

Screening Level:

AEC-Q100

Maximum Seated Height:

1 mm

Maximum Supply Voltage:

4.5 V

Minimum Supply Voltage:

.9 V

Surface Mount:

YES

Temperature Grade:

Terminal Form:

Terminal Pitch:

.5 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

2.5 mm

Trade Compliance

NLVSX5004MNTWG Interface ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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