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NLVSX5014MUTAG

Onsemi

NLVSX5014MUTAG by Onsemi

NLVSX5014MUTAG by Onsemi is a 4-bit bus driver with 11ns propagation delay, operating at 2.8V. It features bidirectional control and supports a load capacitance of 50pF. Ideal for military applications due to its AEC-Q100 screening level and wide temperature range from -55 to 125 °C.

Median Price

$0.810

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 2,750 parts In-Stock

1+ parts

$0.810

100+ parts

$0.458

1k+ parts

$0.394

10k+ parts

-

2,750

$0.810

$0.458

$0.394

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Distributors (In-Stock)

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Digiode

USA . 742 parts In-Stock

1+ parts

$0.836

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-

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742

$0.836

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Vyrian

USA . 2,497 parts In-Stock

1+ parts

$0.880

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2,497

$0.880

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Flip Electronics

USA . 58,690 parts In-Stock

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58,690

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Distributors (Availability)

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Corphita

USA . 2,244 parts In-Stock

1+ parts

$0.792

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2,244

$0.792

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Corohmni

South Africa . 66 parts In-Stock

1+ parts

$0.880

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66

$0.880

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Kulean Microsystems

USA . 7,199 parts In-Stock

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7,199

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Microchip USA

USA . 7,028 parts In-Stock

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7,028

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SupplyDigital Components

Austria . 3,932 parts In-Stock

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3,932

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TANS Electronics

Latvia . 2,952 parts In-Stock

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2,952

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Problanco Electronics

Mexico . 1,032 parts In-Stock

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1,032

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UHIMA Technologies

Türkiye . 707 parts In-Stock

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707

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Overview

Elevate your electronic designs with the NLVSX5014MUTAG by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality bus drivers and transceivers that ensure reliable performance and precision. This versatile product offers seamless integration into various applications, providing customers with enhanced functionality and efficiency. With its advanced features and superior design, the NLVSX5014MUTAG is the perfect solution for your electronic needs. Experience the value and benefits that Onsemi brings to the table with this exceptional product.

Feature Benefit Bullets

Propagation Delay At Nominal Supply: 11 ns

Low propagation delay ensures fast signal transmission, making this product suitable for time-sensitive applications.

Surface Mount: YES

Surface mount capability allows for easy and secure mounting on PCBs, saving space and facilitating automated assembly processes.

Package Style: CHIP CARRIER, VERY THIN PROFILE

The compact and thin package style enables this product to be used in space-constrained applications while maintaining reliability and performance.

Minimum Operating Temperature: -55 °C

Wide operating temperature range ensures this product can function in extreme environments, providing versatility and reliability.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures product reliability even in hot conditions, making it suitable for a variety of applications.

Technical Specifications

Bus Driver & Transceivers NLVSX5014MUTAG attributes and parameters. Explore more Bus Driver & Transceivers devices from Onsemi

Specs

Control Type:

COMMON CONTROL

Count Direction:

BIDIRECTIONAL

JESD-30 Code:

R-XQCC-N12

JESD-609 Code:

e4

Length:

2 mm

Load Capacitance (CL):

50 pF

Logic IC Type:

Maximum I (ol):

.02 Amp

Moisture Sensitivity Level (MSL):

1

No. of Bits:

4

No. of Functions:

1

No. of Ports:

2

No. of Terminals:

12

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output Characteristics:

3-STATE

Output Polarity:

TRUE

Package Body Material:

UNSPECIFIED

Package Code:

Package Equivalence Code:

LCC12,.07X.08,16

Package Shape:

Package Style (Meter):

CHIP CARRIER, VERY THIN PROFILE

Packing Method:

TR

Peak Reflow Temperature (C):

260

Maximum Power Supply Current (ICC):

.018 mA

Propagation Delay At Nominal Supply:

11 ns

Propagation Delay (tpd):

40 ns

Screening Level:

AEC-Q100

Maximum Seated Height:

.55 mm

Maximum Supply Voltage (Vsup):

4.5 V

Minimum Supply Voltage (Vsup):

.9 V

Nominal Supply Voltage / Vsup (V):

2.8

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

Terminal Pitch:

.4 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Translation:

0.9/4.5V & 0.9/4.5V

Width:

1.7 mm

Trade Compliance

NLVSX5014MUTAG Logic ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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