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NLV14066BDTR2G

Onsemi

NLV14066BDTR2G by Onsemi

NLV14066BDTR2G by Onsemi is a CMOS SPST multiplexer with 4 functions, operating at -55 to 125°C. It has a max on-state resistance of 1200 ohm and operates on power supplies of 5/15V. This military-grade device in a small outline package is ideal for high-temperature applications requiring separate outputs.

Median Price

$0.442

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 158 parts In-Stock

1+ parts

$0.620

100+ parts

$0.333

1k+ parts

$0.252

10k+ parts

$0.225

158

$0.620

$0.333

$0.252

$0.225

Rochester

USA . 601 parts In-Stock

1+ parts

-

100+ parts

$0.263

1k+ parts

$0.218

10k+ parts

$0.194

601

-

$0.263

$0.218

$0.194

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,465 parts In-Stock

1+ parts

$0.204

100+ parts

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2,465

$0.204

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Vyrian

USA . 5,599 parts In-Stock

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5,599

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Distributors (Availability)

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Corphita

USA . 1,302 parts In-Stock

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$0.194

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-

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1,302

$0.194

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Corohmni

South Africa . 231 parts In-Stock

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$0.215

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231

$0.215

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Vigor

Singapore . 204 parts In-Stock

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$0.600

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204

$0.600

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QUARKTWIN TECHNOLOGY LTD

USA . 21,935 parts In-Stock

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21,935

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Problanco Electronics

Mexico . 7,347 parts In-Stock

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7,347

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TANS Electronics

Latvia . 5,480 parts In-Stock

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5,480

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Kulean Microsystems

USA . 5,044 parts In-Stock

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5,044

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Kepictronics

USA . 5,019 parts In-Stock

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5,019

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SupplyDigital Components

Austria . 4,189 parts In-Stock

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4,189

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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UHIMA Technologies

Türkiye . 14 parts In-Stock

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Overview

Enhance your electronic design projects with the NLV14066BDTR2G by Onsemi, a top-quality multiplexer & switch that offers unmatched performance and reliability. Manufactured by Onsemi, a renowned industry leader, this product is perfect for a wide range of applications. With its innovative features and cutting-edge technology, customers can expect seamless operation and exceptional results. Trust in the NLV14066BDTR2G to deliver value, efficiency, and precision like never before. Elevate your projects to new heights with this superior product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material provides durability and protection for the internal components of the multiplexer/switch.

Surface Mount: YES

Surface mount capability allows for easier and more efficient installation of the multiplexer/switch onto circuit boards, saving time and effort during assembly.

No. of Functions: 4

Having 4 functions in one device increases the versatility and functionality of the multiplexer/switch, making it a versatile solution for various applications.

Power Supplies (V): 5/15

Support for multiple power supply voltages (5V/15V) provides flexibility in different operating conditions, ensuring compatibility with a wider range of systems.

Maximum Operating Temperature: 125 °C

High maximum operating temperature of 125°C ensures reliable performance in demanding environments without the risk of overheating or component failure.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with various logic levels, making the multiplexer/switch efficient and reliable.

Technical Specifications

Multiplexers & Switches NLV14066BDTR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e4

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Functions:

4

No. of Terminals:

14

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

NICKEL PALLADIUM GOLD

Terminal Form:

GULL WING

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14066BDTR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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