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NLV14067BDWR2G

Onsemi

NLV14067BDWR2G by Onsemi

NLV14067BDWR2G by Onsemi is a CMOS single-ended multiplexer with 16 channels. It operates at temperatures ranging from -55 to 125 °C and has a max on-state resistance of 1300 ohm. This small outline package with gull wing terminals is ideal for military-grade applications requiring low supply current and fast switch-on times.

Median Price

$0.946

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 1,908 parts In-Stock

1+ parts

-

100+ parts

$0.912

1k+ parts

$0.757

10k+ parts

$0.675

1,908

-

$0.912

$0.757

$0.675

DigiKey

USA . 1,908 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.140

10k+ parts

-

1,908

-

-

$1.140

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Verical

USA . 1,851 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$0.946

10k+ parts

$0.843

1,851

-

-

$0.946

$0.843

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,785 parts In-Stock

1+ parts

$0.711

100+ parts

-

1k+ parts

-

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-

1,785

$0.711

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Vyrian

USA . 1,785 parts In-Stock

1+ parts

$0.748

100+ parts

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1,785

$0.748

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,176 parts In-Stock

1+ parts

$0.673

100+ parts

-

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1,176

$0.673

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-

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Vigor

Singapore . 241 parts In-Stock

1+ parts

$0.720

100+ parts

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241

$0.720

-

-

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Corohmni

South Africa . 489 parts In-Stock

1+ parts

$0.748

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489

$0.748

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QUARKTWIN TECHNOLOGY LTD

USA . 16,767 parts In-Stock

1+ parts

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16,767

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TANS Electronics

Latvia . 7,052 parts In-Stock

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Kulean Microsystems

USA . 5,997 parts In-Stock

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5,997

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SupplyDigital Components

Austria . 5,122 parts In-Stock

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Problanco Electronics

Mexico . 3,664 parts In-Stock

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3,664

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Microchip USA

USA . 2,948 parts In-Stock

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2,948

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UHIMA Technologies

Türkiye . 600 parts In-Stock

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Overview

Discover the NLV14067BDWR2G by Onsemi, a high-quality multiplexer that offers superior performance and reliability. Manufactured by Onsemi, a trusted leader in the industry, this product is perfect for a wide range of applications. With its advanced technology and innovative design, the NLV14067BDWR2G provides customers with unmatched value and benefits. Whether you're looking for precision, efficiency, or versatility, this multiplexer delivers it all. Upgrade your projects with the NLV14067BDWR2G and experience the difference today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and simplifying assembly.

Package Shape: RECTANGULAR

Rectangular package shape is versatile and easy to mount in different orientations.

Power Supplies (V): 5/15

Supports a wide range of power supply voltages, offering flexibility in system design.

No. of Terminals: 24

Having 24 terminals allows for multiple input/output connections, enabling the multiplexer/switch to handle a higher number of channels.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on PCBs and is cost-effective in terms of material usage.

Maximum Operating Temperature: 125 °C

Operates reliably at high temperatures, suitable for demanding industrial or military applications.

Minimum Operating Temperature: -55 °C

Capable of functioning in extremely cold environments, expanding its use in various conditions.

Terminal Finish: MATTE TIN

Matte tin terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: DUAL

Dual terminal position allows for more stable connections and better signal transmission.

Other IC type: SINGLE-ENDED MULTIPLEXER

Single-ended multiplexer type simplifies the signal switching process and reduces complexity in circuit design.

Maximum Time At Peak Reflow Temperature (s): 30

Can withstand peak reflow temperatures for a sufficient time during the manufacturing process without compromising performance.

Peak Reflow Temperature °C: 260

Withstands high peak reflow temperatures, ensuring reliable soldering during assembly.

Maximum On-state Resistance (Ron): 1300 ohm

Low on-state resistance minimizes signal loss and improves overall system efficiency.

Maximum Switch-on Time: 600 ns

Fast switch-on time ensures quick signal switching, ideal for high-speed applications.

Temperature Grade: MILITARY

Military-grade temperature tolerance ensures performance in harsh environmental conditions and critical applications.

Maximum Supply Current (Isup): 0.6 mA

Low supply current consumption reduces power usage and extends battery life in portable devices.

No. of Channels: 16

Supports 16 channels for multiplexing or switching signals, offering versatility in signal routing.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity for reliable operation.

Terminal Form: GULL WING

Gull wing terminal form is suitable for surface mount assembly and ensures secure solder joints.

Terminal Pitch: 1.27 mm

1.27mm terminal pitch allows for high-density mounting on PCBs, maximizing board space efficiency.

Moisture Sensitivity Level (MSL): 3

MSL 3 indicates moderate moisture sensitivity, requiring standard handling procedures during storage and assembly.

Maximum Signal Current: 0.025 A

Capable of handling a maximum signal current of 0.025A, suitable for a wide range of signal types and strengths.

Technical Specifications

Multiplexers & Switches NLV14067BDWR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G24

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

3

No. of Channels:

16

No. of Functions:

1

No. of Terminals:

24

Maximum On-state Resistance (Ron):

1300 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP24,.4

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Maximum Supply Current (Isup):

.6 mA

Surface Mount:

YES

Maximum Switch-on Time:

600 ns

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14067BDWR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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