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NLV14053BDR2G

Onsemi

NLV14053BDR2G by Onsemi

NLV14053BDR2G by Onsemi is a CMOS SPDT multiplexer with 3 functions, 2 channels, and on-state resistance of 1200 ohm. Operating b/w -55 to 125°C, it has a peak reflow temp of 260°C. Ideal for military-grade applications requiring small outline packages and dual terminal positions.

Median Price

$0.460

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,011 parts In-Stock

1+ parts

$0.600

100+ parts

$0.334

1k+ parts

$0.290

10k+ parts

$0.269

2,011

$0.600

$0.334

$0.290

$0.269

DigiKey

USA . 1,904 parts In-Stock

1+ parts

$0.600

100+ parts

$0.333

1k+ parts

$0.289

10k+ parts

$0.261

1,904

$0.600

$0.333

$0.289

$0.261

Rochester

USA . 47,708 parts In-Stock

1+ parts

-

100+ parts

$0.321

1k+ parts

$0.267

10k+ parts

$0.238

47,708

-

$0.321

$0.267

$0.238

Flip Electronics (Authorized)

USA . 40,000 parts In-Stock

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40,000

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Verical

USA . 32,500 parts In-Stock

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$0.297

32,500

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-

-

$0.297

Distributors (In-Stock)

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Digiode

USA . 825 parts In-Stock

1+ parts

$0.250

100+ parts

-

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825

$0.250

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Vyrian

USA . 764 parts In-Stock

1+ parts

$0.263

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-

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764

$0.263

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Flip Electronics

USA . 50,000 parts In-Stock

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ComSIT Distribution GmbH

Germany . 2,190 parts In-Stock

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ComSIT USA

USA . 2,190 parts In-Stock

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2,190

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Distributors (Availability)

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Corphita

USA . 1,097 parts In-Stock

1+ parts

$0.237

100+ parts

-

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1,097

$0.237

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Corohmni

South Africa . 145 parts In-Stock

1+ parts

$0.263

100+ parts

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145

$0.263

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Vigor

Singapore . 229 parts In-Stock

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$0.290

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229

$0.290

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Microchip USA

USA . 6,178 parts In-Stock

1+ parts

$1.495

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6,178

$1.495

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SupplyDigital Components

Austria . 6,340 parts In-Stock

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6,340

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Problanco Electronics

Mexico . 4,203 parts In-Stock

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TANS Electronics

Latvia . 1,216 parts In-Stock

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Kulean Microsystems

USA . 583 parts In-Stock

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583

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UHIMA Technologies

Türkiye . 334 parts In-Stock

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334

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Overview

Discover the unparalleled quality and reliability of the NLV14053BDR2G by Onsemi, a leading manufacturer in the industry of Multiplexers & Switches. This versatile product offers customers the advantage of 3 functions in one compact package, making it ideal for a wide range of applications. With a temperature grade of MILITARY and CMOS technology, this switch ensures top-notch performance even in extreme conditions. Experience the value and benefits of seamless switching with the NLV14053BDR2G, designed to exceed expectations and deliver unparalleled results.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material ensures the package is durable and reliable for long-term use.

Surface Mount: YES

The surface mount feature allows for easy and efficient installation on circuit boards.

No. of Functions: 3

With 3 functions, this multiplexer and switch offers versatility and flexibility in routing signals.

Power Supplies (V): 5/15

This multiplexer and switch can work with power supplies ranging from 5V to 15V, providing compatibility with a variety of systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125C ensures reliability in challenging environmental conditions.

Technology: CMOS

CMOS technology ensures low power consumption and high noise immunity, making this multiplexer and switch efficient and reliable.

Technical Specifications

Multiplexers & Switches NLV14053BDR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G16

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Channels:

2

No. of Functions:

3

No. of Terminals:

16

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Maximum Signal Current:

.025 A

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Switching (V):

BREAK-BEFORE-MAKE

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14053BDR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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