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SN74LVC2G66DCURG4

Texas Instruments

SN74LVC2G66DCURG4 by Texas Instruments

SN74LVC2G66DCURG4 by Texas Instruments is a CMOS SPST switch with 2 channels, 30 ohm Ron, and 5.6 ns switch-on time. It operates in industrial temperature range (-40 to 85 °C) and has a small outline package for space-constrained applications. Ideal for multiplexing signals in systems requiring low power consumption (Isup: 0.015 mA).

Median Price

$0.560

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Texas Instruments

USA . 97,148 parts In-Stock

1+ parts

$0.560

100+ parts

$0.380

1k+ parts

$0.195

10k+ parts

-

97,148

$0.560

$0.380

$0.195

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 17 parts In-Stock

1+ parts

$0.195

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-

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17

$0.195

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Digiode

USA . 191 parts In-Stock

1+ parts

$0.532

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191

$0.532

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Chip Stock

USA . 49,690 parts In-Stock

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49,690

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Vyrian

USA . 49,666 parts In-Stock

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49,666

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Component Sense

UK . 2,925 parts In-Stock

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2,925

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Distributors (Availability)

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Continental Prestige Electronics

USA . 2,663 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

$0.191

2,663

$0.195

-

-

$0.191

Argo Parts USA

USA . 1,304 parts In-Stock

1+ parts

$0.195

100+ parts

-

1k+ parts

-

10k+ parts

$0.189

1,304

$0.195

-

-

$0.189

Corohmni

South Africa . 49 parts In-Stock

1+ parts

$0.195

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-

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49

$0.195

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$0.201

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$0.191

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$0.191

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350

$0.201

$0.191

$0.191

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Ampacity Inc.

Singapore . 49,712 parts In-Stock

1+ parts

$0.476

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49,712

$0.476

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Semicontronic

India . 49,584 parts In-Stock

1+ parts

$0.476

100+ parts

$0.464

1k+ parts

$0.462

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49,584

$0.476

$0.464

$0.462

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Corphita

USA . 4,455 parts In-Stock

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$0.504

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4,455

$0.504

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Parana Technologies

USA . 1,412 parts In-Stock

1+ parts

$13.266

100+ parts

$1,231.981

1k+ parts

$11.940

10k+ parts

-

1,412

$13.266

$1,231.981

$11.940

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DigiPath Technology Company

USA . 1,869 parts In-Stock

1+ parts

$14.608

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1,869

$14.608

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ChromeModa Solutions

Germany . 2,388 parts In-Stock

1+ parts

$14.906

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$12.223

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2,388

$14.906

$12.223

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IDEA Electronic Components Group

UK . 1,204 parts In-Stock

1+ parts

$14.906

100+ parts

$14.161

1k+ parts

$13.415

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1,204

$14.906

$14.161

$13.415

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Kepictronics

USA . 10,800 parts In-Stock

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10,800

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Microchip USA

USA . 1,101 parts In-Stock

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Robosynatics

Brazil . 100 parts In-Stock

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100

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Lucentia Tech

USA . 100 parts In-Stock

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100

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Overview

Experience seamless and reliable circuit switching with the Texas Instruments SN74LVC2G66DCURG4. As a leading manufacturer in the industry, Texas Instruments delivers top-quality multiplexers & switches that provide exceptional performance in a compact package. Ideal for industrial applications, this versatile component offers customers the value of precise control and efficiency. Trust in Texas Instruments for cutting-edge technology that meets your needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and ensures the product can withstand various environmental conditions.

Surface Mount: YES

Allows for easy installation and integration into electronic assemblies.

No. of Functions: 2

Provides flexibility and enables multiple functions to be controlled or switched.

Nominal Supply Voltage (Vsup): 2.3 V

Offers a stable and optimized voltage supply for efficient operation.

Power Supplies (V): 3.3

Compatible with standard power supplies for seamless integration into existing systems.

Package Style (Meter): SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Compact design allows for space-saving and efficient PCB layout.

Maximum Operating Temperature: 85 °C

Can operate effectively in a wide range of temperatures, making it suitable for various applications.

Minimum Operating Temperature: -40 °C

Capable of functioning in extreme cold conditions without performance degradation.

Terminal Finish: Nickel/Palladium/Gold (Ni/Pd/Au)

Provides a reliable and corrosion-resistant terminal finish for long-term use.

Technology: CMOS

Utilizes CMOS technology for low power consumption and efficient performance.

Technical Specifications

Multiplexers & Switches SN74LVC2G66DCURG4 attributes and parameters. Explore more Multiplexers & Switches devices from Texas Instruments

Specs

Other IC type:

Nominal Bandwidth:

300 kHz

Maximum Input Voltage:

5.5 V

Minimum Input Voltage:

0 V

JESD-30 Code:

R-PDSO-G8

JESD-609 Code:

e4

Length:

2.3 mm

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Channels:

2

No. of Functions:

2

No. of Terminals:

8

Nominal Off-state Isolation:

42 dB

Nominal On-state Resistance Match:

5 ohm

Maximum On-state Resistance (Ron):

30 ohm

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TSSOP8,.12,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

.9 mm

Sub-Category:

Multiplexers or Switches

Maximum Supply Current (Isup):

.015 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

1.65 V

Nominal Supply Voltage (Vsup):

2.3 V

Surface Mount:

YES

Maximum Switch-off Time:

6.9 ns

Maximum Switch-on Time:

5.6 ns

Switching (V):

MAKE-BEFORE-BREAK

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Nickel/Palladium/Gold (Ni/Pd/Au)

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

2 mm

Trade Compliance

SN74LVC2G66DCURG4 Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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