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NLV14066BDR2G

Onsemi

NLV14066BDR2G by Onsemi

NLV14066BDR2G by Onsemi is a CMOS multiplexer with 4 functions, operating at -55 to 125°C. It has a max on-state resistance of 1200 ohm and operates on power supplies of 5/15V. Ideal for military-grade applications due to its small outline package style and separate output feature.

Median Price

$0.247

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 7,000 parts In-Stock

1+ parts

$0.170

100+ parts

-

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7,000

$0.170

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Mouser Electronics

USA . 367 parts In-Stock

1+ parts

$0.420

100+ parts

$0.243

1k+ parts

$0.213

10k+ parts

$0.193

367

$0.420

$0.243

$0.213

$0.193

DigiKey

USA . 2,164 parts In-Stock

1+ parts

$0.480

100+ parts

$0.261

1k+ parts

$0.223

10k+ parts

$0.203

2,164

$0.480

$0.261

$0.223

$0.203

Rochester

USA . 25,143 parts In-Stock

1+ parts

-

100+ parts

$0.247

1k+ parts

$0.205

10k+ parts

$0.183

25,143

-

$0.247

$0.205

$0.183

Verical

USA . 11,422 parts In-Stock

1+ parts

-

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$0.229

11,422

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$0.229

Chip1Stop

Japan . 7,000 parts In-Stock

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-

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7,000

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Flip Electronics (Authorized)

USA . 2,500 parts In-Stock

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2,500

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Distributors (In-Stock)

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Digiode

USA . 2,183 parts In-Stock

1+ parts

$0.162

100+ parts

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2,183

$0.162

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Vyrian

USA . 1,190 parts In-Stock

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$0.170

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1,190

$0.170

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Flip Electronics

USA . 2,500 parts In-Stock

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2,500

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 1,394 parts In-Stock

1+ parts

$0.153

100+ parts

-

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1,394

$0.153

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Component Stockers USA

USA . 37,844 parts In-Stock

1+ parts

$0.170

100+ parts

$0.170

1k+ parts

$0.150

10k+ parts

$0.150

37,844

$0.170

$0.170

$0.150

$0.150

Corohmni

South Africa . 197 parts In-Stock

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$0.170

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197

$0.170

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Vigor

Singapore . 183 parts In-Stock

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$0.220

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183

$0.220

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QUARKTWIN TECHNOLOGY LTD

USA . 9,944 parts In-Stock

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9,944

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Problanco Electronics

Mexico . 7,365 parts In-Stock

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7,365

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TANS Electronics

Latvia . 5,817 parts In-Stock

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Kulean Microsystems

USA . 4,693 parts In-Stock

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4,693

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Authorized Procurement Solutions

USA . 4,000 parts In-Stock

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4,000

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SupplyDigital Components

Austria . 1,223 parts In-Stock

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1,223

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UHIMA Technologies

Türkiye . 834 parts In-Stock

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834

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Overview

Enhance your electronic designs with the NLV14066BDR2G by Onsemi, a versatile multiplexer and switch that offers unmatched quality and reliability. Manufactured by Onsemi, a trusted name in the industry known for delivering top-notch components, this product is perfect for a wide range of applications. With a package body material of plastic/epoxy and a small outline package style, this device is compact yet powerful. Its dual terminal position and separate output make it a convenient choice for any project. Experience the benefits of seamless switching and enhanced performance with the NLV14066BDR2G - the perfect solution for all your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, suitable for various applications.

Surface Mount: YES

Surface mount technology allows for easy and efficient PCB assembly, saving space and reducing production costs.

No. of Functions: 4

Having 4 functions in one device simplifies circuit design and saves board space, making it a cost-effective solution.

Power Supplies (V): 5/15

Support for multiple power supply voltages (5V and 15V) gives flexibility in system integration and compatibility with various setups.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance in harsh environments or industrial applications.

Technology: CMOS

CMOS technology offers low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Technical Specifications

Multiplexers & Switches NLV14066BDR2G attributes and parameters. Explore more Multiplexers & Switches devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

Normal Position (V):

NO

No. of Functions:

4

No. of Terminals:

14

Maximum On-state Resistance (Ron):

1200 ohm

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Output (V):

SEPARATE OUTPUT

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP14,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Power Supplies (V):

5/15

Qualification:

Not Qualified

Sub-Category:

Multiplexer or Switches

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

NLV14066BDR2G Other Function Semiconductors trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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